UJA1169ATK/F/3Z - Mini HS-CAN SBC with 3.3V LDO | NXP
부품 번호: UJA1169ATK/F/3Z ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3.85 | $3.85 |
| 10 | $3.42 | $34.20 |
| 100 | $2.98 | $298.00 |
| 500 | $2.65 | $1,325.00 |
| 1,000 | $2.31 | $2,310.00 |
UJA1169ATK/F/3Z 개요
An SBC is an integrated automotive network IC that combines a CAN (Controller Area Network) physical-layer transceiver with one or more voltage regulators and supporting features such as watchdog, wake-up management, and fail-safe output control. The SBC sits between the vehicle battery (VBAT) and the microcontroller, providing a regulated supply while the HS-CAN transceiver links the host MCU to the in-vehicle CAN bus. This class of device collapses what would otherwise be several discrete ICs into a single package, reducing PCB area, BOM cost, and quiescent-current budget in body, chassis, and powertrain ECUs.
Key specifications of the UJA1169ATK/F/3Z include: 3.3 V V1 LDO with 250 mA current capability, 5 V V2 LDO at 250 mA for the internal transceiver and additional onboard hardware, CAN FD data rates up to 5 Mbit/s, very low VBAT quiescent current in standby modes, and integrated fail-safe behavior with a watchdog and SPI control. The /3 suffix on this variant fixes V1 at 3.3 V rather than the 5 V used in the UJA1169ATK, UJA1169ATK/F, UJA1169ATK/X, and UJA1169ATK/X/F members of the family. The /F suffix indicates the SPI-gated watchdog configuration; the trailing Z designates the 13-inch reel SBB packing format.
Architecturally, the UJA1169ATK/F/3Z pairs a high-speed CAN physical layer with two linear regulators sharing a common thermal pad. The HVSON-20 exposed-pad package keeps thermal resistance low so both regulators can sustain full 250 mA loads simultaneously, while the integrated CAN transceiver implements the ISO 11898-2:2016 standard and supports the SAE J2284 series bit-timing benchmarks used by global automakers. The device supports selective wake-up and several low-power modes that allow an ECU to drop to microamp-level quiescent draw when the bus is idle.
Typical automotive applications include body control modules, gateway ECUs, sensor cluster nodes, HVAC controllers, comfort and convenience modules, and small powertrain controllers. The 3.3 V LDO mapping of the /3 variant makes the device a direct fit for low-voltage host microcontrollers such as the NXP S32K1xx family that operate from a 3.3 V rail.
When laying out the PCB, place decoupling capacitors directly at V1 and V2 with short, wide ground returns, and attach the exposed thermal pad to a copper plane sized for the worst-case dissipation. Use a 13-inch reel handling process consistent with the Z suffix to integrate this part into high-volume surface-mount lines.
This page synthesizes distributor pricing, drop-in alternative selection, and practical SBC design notes not found in the manufacturer datasheet.
드롭인 대체품: UJA1169ATK/F/3Z — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: UJA1169ATK/F/3Z (동일 폼 팩터 및 풋프린트) — 차이점: Package, Watchdog, CAN Standard, Operating Temperature, Product Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
UJA1169ATK/F/3
✅ 드롭인✓ 재고 있음
$3.48 / 개
데이터시트 보기 →UJA1169ATK/3Z
✅ 드롭인✓ 재고 있음
$2.1 / 개
데이터시트 보기 →UJA1169ATK/3
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
UJA1169ATK/F
✅ 드롭인✓ 재고 있음
$3.12 / 개
데이터시트 보기 →UJA1169ATK/FZ
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
UJA1169ATK/F/3Z 사양
| Product Type | Mini High-Speed CAN System Basis Chip (SBC) |
| 핀 수 | 20 |
| 패키지 | HVSON-20 (3.5x5.5 mm) with exposed thermal pad |
| 실장 유형 | Surface Mount |
| CAN Specification | ISO 11898-2:2016 compliant |
| CAN Bit Timing Compliance | SAE J2284-1 to SAE J2284-5 |
| CAN FD Support | Yes, up to 5 Mbit/s |
| V1 LDO Output Voltage | 3.3 V (fixed for /3 variant) |
| V1 LDO Output Current | 250 mA |
| V2 LDO Output Voltage | 5 V (internal + onboard auxiliary) |
| V2 LDO Output Current | 250 mA |
| Supply Voltage Source | Vehicle battery (VBAT) |
| Watchdog | Yes, SPI-controlled (window or timeout, /F variant) |
| Low-Power Modes | Standby and Sleep with selective CAN wake-up |
| Packing Method | 13-inch reel, SBB (suffix Z) |
| RoHS / REACH | Compliant per NXP product information |
UJA1169ATK/F/3Z 핀 구성
| 핀 1 | VBAT — Battery supply input (reverse-battery protected) |
| 핀 2 | V1 — 3.3 V LDO output (host MCU supply, 250 mA) |
| 핀 3 | V2 — 5 V LDO output (transceiver + auxiliary, 250 mA) |
| 핀 4 | GND — Ground / exposed thermal pad reference |
| 핀 5 | CANH — HS-CAN bus high line |
| 핀 6 | CANL — HS-CAN bus low line |
| 핀 7 | TXD — Transmit data input to CAN bus |
| 핀 8 | RXD — Receive data output from CAN bus |
| 핀 9 | RTH — CAN bus termination resistor control (high-side) |
| 핀 10 | RTL — CAN bus termination resistor control (low-side) |
| 핀 11 | WKRQ — Wake-up request output to MCU |
| 핀 12 | WK / LIMP — Wake-up input or limp-home control |
| 핀 13 | INT / RST — Interrupt or reset output to MCU |
| 핀 14 | SPI_NSS — SPI chip select from MCU |
| 핀 15 | SPI_SCK — SPI clock from MCU |
| 핀 16 | SPI_MOSI — SPI data input from MCU |
| 핀 17 | SPI_MISO — SPI data output to MCU |
| 핀 18 | WAKE — Local wake-up input (edge sensitive) |
| 핀 19 | BAT_SENSE — Battery sensing (for VBAT supervision) |
| 핀 20 | EP — Exposed thermal pad (must be soldered to PCB ground) |
일반적인 애플리케이션
UJA1169ATK/F/3Z 적합 용도: 6 애플리케이션s: Body Control Module (BCM), Automotive Gateway ECU, HVAC Control Module, Door / Seat / Mirror ECU, Sensor Cluster Nodes, Powertrain Sub-Controller.
Body Control Module (BCM)
The UJA1169ATK/F/3Z fits BCMs because the integrated 3.3 V V1 LDO at 250 mA powers the host MCU (e.g., NXP S32K1xx) directly from VBAT, while the 5 V V2 rail feeds auxiliary loads such as relay drivers and sensor supplies. Its ISO 11898-2:2016 HS-CAN transceiver with 5 Mbit/s CAN FD supports body-network speeds, and the very low standby current satisfies BCM quiescent-current budgets. Placement on the CAN bus allows selective wake-up when the BCM receives a wake-up frame, and the SPI watchdog gives the main MCU a fail-safe reset path.
추천
Automotive Gateway ECU
In a CAN/CAN-FD gateway ECU, the UJA1169ATK/F/3Z provides the regulated MCU rail, the watchdog, and one HS-CAN channel for body/LIN-gateway backbones while the gateway processor coordinates multiple external transceivers. The 5 Mbit/s CAN FD capability matches modern in-vehicle network bit timing, and the 250 mA V1 rating easily supplies 100+ MHz Cortex-M host processors. The exposed thermal pad keeps junction temperature low even when both regulators run at full load during gateway message storms.
추천
HVAC Control Module
HVAC head units and control modules commonly draw from a 3.3 V MCU fed by an SBC, which is exactly the UJA1169ATK/F/3Z use-case. Its 5 V V2 rail at 250 mA powers fan drivers, LED backlights, and sensor interfaces, eliminating a second LDO. The HS-CAN link to the climate CAN segment enables HVAC status messages, defrost scheduler bits, and zone controls. Low-quiescent standby keeps HVAC ECUs within the OEM's parking-current budget.
추천
Door / Seat / Mirror ECU
Compact door modules, seat controllers, and mirror ECUs benefit from the UJA1169ATK/F/3Z's small 20-pin HVSON footprint, integrated regulators, and selective CAN wake-up. With the host MCU on a 3.3 V V1 rail and small sensors on 5 V V2, the BOM stays minimal, and the SBC's fail-safe mode protects the ECU during VBAT dropouts. CAN FD allows high-rate mirror-fold, seat-memory, and rear-view camera coordination traffic alongside classic CAN body messages.
추천
Sensor Cluster Nodes
Sensor cluster nodes that aggregate radar, ultrasonic, or IMU data often use a 3.3 V MCU with a CAN FD uplink - exactly where the UJA1169ATK/F/3Z is best deployed. The 3.3 V regulator supplies the cluster MCU, the 5 V rail powers sensor analog front-ends, and the HS-CAN FD link carries compressed object lists up to 5 Mbit/s. The exposed thermal pad and shared die-thermal design keep PCB temperature rise manageable inside sealed housings.
추천
Powertrain Sub-Controller
Although the UJA1169ATK/F/3Z is not rated for full engine-control use, sub-controllers for transmission, ABS periphery, and electric-pump monitoring comfortably use its regulated rails. The 3.3 V V1 hosts a small MCU while the 5 V V2 drives solenoid drivers and analog front ends. CAN FD mesh connectivity integrates with the powertrain network, and the SPI watchdog provides deterministic fault handling required by functional-safety sub-systems.
추천
추천 제품 요약
엔지니어링 참조 데이터: UJA1169ATK/F/3Z — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | UJA1169ATK/F/3 | UJA1169ATK/3Z | UJA1169ATK/3 | UJA1169ATK/F | UJA1169ATK/FZ |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | HVSON-20 (3.5x5.5 mm) | HVSON-20 (3.5x5.5) - same | HVSON-20 (3.5x5.5) - same | HVSON-20 (3.5x5.5) - same | HVSON-20 (3.5x5.5) - same | HVSON-20 (3.5x5.5) - same |
| V1 LDO Output Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 5 V | 5 V |
| V2 LDO Output Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| SPI Watchdog (/F) | Yes (/F variant) | Yes | No (non-/F) | No | Yes | Yes |
| Packing Suffix Z (13-inch SBB) | Yes | No | Yes | No | No | Yes |
| CAN FD Speed | 5 Mbit/s | 5 Mbit/s | 5 Mbit/s | 5 Mbit/s | 5 Mbit/s | 5 Mbit/s |
| ISO 11898-2:2016 Compliant | Yes | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Member of the only NXP SBC family combining a 3.3 V V1 with an /F SPI watchdog (vs UJA1169ATK/3Z)
- Combines 3.3 V V1 in a 5 V-default family (vs UJA1169ATK/F)
- Single part number covers BCM, gateway, and HVAC node form-factors (vs TJA1057)
설계 노트
Estimated: at maximum load on both LDOs (V1 3.3 V at 250 mA and V2 5 V at 250 mA from a 12 V VBAT with worst case 50 mA quiescent overhead), the UJA1169ATK/F/3Z dissipates roughly (12-3.3)*0.250 + (12-5)*0.250 = 4.32 W steady state. The 20-pin HVSON package with exposed thermal pad must be soldered to a copper area of at least 250 mm^2 with multiple thermal vias to keep junction rise under 50 C. If your ECU enclosure operates near 85 C ambient, include a thermal relief estimation in pre-design.
Place the V1 and V2 decoupling capacitors (typically 4.7 uF to 22 uF low-ESR ceramic) within 2 mm of the pins with vias stitching the ground pads directly to the inner ground plane. Keep the HS-CAN differential pair (CANH/CANL) matched within 2 mm and routed over a continuous ground reference. Avoid routing V1 or V2 traces across the exposed thermal pad cutout area; the thermal relief pad should connect to ground, not to V1.
Do not connect the WK/LIMP and WAKE pins to noisy long-leaded harnesses without series resistors and small filter capacitors; false wake-ups from VBAT transients are a leading cause of CAN ECU field returns. Also ensure the battery-sense pin (BAT_SENSE) traces back to the module-side battery injection point, not to a regulated node, so the SBC's VBAT supervisor tracks actual vehicle dropouts. The Z-suffix packing requires SBB shelf-life tracking (typically 1 year floor life) - bake before reflow if storage exceeds this limit.
규정 준수 정보
RoHS and REACH compliance per NXP product information. AEC-Q100 is not_applicable for this part number per NXP listing; for AEC-Q100 qualified variants consult NXP automotive-grade documents.
