W25Q128JVFIQ - 128Mbit SPI/Quad SPI NOR Flash, 3V, 16-SOIC | Winbond
부품 번호: W25Q128JVFIQ ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1.65 | $1.65 |
| 10 | $1.45 | $14.50 |
| 100 | $1.18 | $118.00 |
| 500 | $0.95 | $475.00 |
| 1,000 | $0.78 | $780.00 |
| 3,000 | $0.62 | $1,860.00 |
W25Q128JVFIQ 개요
A serial NOR flash like the W25Q128JVFIQ is a non-volatile memory device that uses a synchronous serial peripheral interface (SPI) rather than a parallel address/data bus. It belongs to the broader category of NOR flash -> flash memory -> non-volatile memory IC, and serves as firmware storage in embedded systems. Uniform 4 KB sector erase, 32 KB and 64 KB block erase, and a 256-byte programmable page let designers optimize erase granularity versus endurance (typically 100K cycles per sector, 20-year data retention per Winbond).
Key features of the W25Q128JVFIQ include dual/quad SPI with one 8-bit instruction clocked on a single I/O and 24/32-bit addressable space up to 128 Mb. The chip provides high read throughput (~6 ns access), continuous read mode with wrap-around, security registers (3 x 256-byte OTP), and individual block/sector locking via Status Register bits. A 64-bit Unique ID and JEDEC Manufacturer/Device ID (9Fh / EFh for Winbond 128 Mbit JV) simplify factory programming and traceability.
Architecturally, the W25Q128JVFIQ uses Winbond's proprietary NOR cell array with an internal ECC engine on 8-byte boundaries (single-bit correction per ECC group), an SRAM page buffer for page program, and a charge-pump high-voltage generator for program/erase. The device also offers a QPI mode (quad peripheral interface) where all four I/O pins carry instruction/address/data, further boosting XIP throughput to ~532 Mbit/s peak.
Typical applications include firmware/code shadowing for microcontrollers and SoCs, BIOS/storage for FPGA configuration bitstreams, IoT edge nodes storing OTA update images, automotive infotainment display back-up, and consumer electronics where small-footprint non-volatile code storage is required. Its 16-SOIC-300 footprint also routes easily to a wide range of MCU SPI masters.
When designing with this device, ensure the host MCU SPI clock supports the configured 80 MHz to 133 MHz modes and that /CS, /WP (used as /IO2 in Quad), and /HOLD (used as /IO3 in Quad) are not left floating - unused Quad-I/O pins must be tied through a 10-100 kohm resistor to avoid noise-induced false commands. Also note that Quad-I/O fast-read commands (EBh, ECh) require the host to drive the mode-bit dummy cycle, which differs from single-I/O.
This page synthesizes distributor pricing, JEDEC-compatible drop-in alternatives (including cross-brand second sources such as the GigaDevice GD25Q128), and design notes for both new designs and field-replacement scenarios that go beyond what the manufacturer datasheet alone provides.
드롭인 대체품: W25Q128JVFIQ — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: W25Q128JVFIQ (동일 폼 팩터 및 풋프린트) — 차이점: Block Erase Sizes, Memory Size, Memory Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
W25Q128JVSIQ
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
W25Q128JVFIFQ
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
GD25Q128CSIGR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
GD25Q128E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MX25L12835FM2I-10G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EN25QH128A-104HIP
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
W25Q128JVFIQ 최대 정격 & 전기적 특성
| 메모리 유형 | NOR Flash |
| 메모리 크기 | 128 Mbit (16 MB) |
| 인터페이스 | SPI, Dual SPI, Quad SPI, QPI |
| Clock Frequency (Max) | 133 MHz |
| 공급 전압 | 2.7 V to 3.6 V |
| Page Size | 256 bytes |
| Sector Size | 4 KB uniform |
| Block Erase Sizes | 32 KB / 64 KB |
| Program/Erase Cycles | 100K cycles per sector (typical) |
| Data Retention | 20 years (typical) |
| 패키지 | 16-SOIC (300 mil) |
| 동작 온도 | -40 C to +85 C (industrial) |
| MSL 레벨 | 3 |
| RoHS 상태 | Compliant |
| JEDEC Device ID | EFh (Winbond 128 Mbit JV family) |
| Unique ID Length | 64 bits |
| Security Registers | 3 x 256-byte OTP |
W25Q128JVFIQ 핀 구성
| 핀 1 | /CS — Chip Select (active low) |
| 핀 2 | DO (/IO1) — Serial Data Out / IO1 in Quad-SPI |
| 핀 3 | /WP (/IO2) — Write Protect (active low) / IO2 in Quad-SPI |
| 핀 4 | GND — Ground |
| 핀 5 | SI (/IO0) — Serial Data In / IO0 in Quad-SPI |
| 핀 6 | CLK — Serial Clock |
| 핀 7 | /HOLD (/IO3) — Hold (active low) / IO3 in Quad-SPI |
| 핀 8 | VCC — Power Supply 2.7-3.6 V |
일반적인 애플리케이션
W25Q128JVFIQ 적합 용도: 6 애플리케이션s: MCU Firmware Boot Storage, FPGA Configuration Bitstream Storage, IoT Edge Device OTA Update Storage, Industrial HMI Display Boot & Asset Storage, Automotive Infotainment Backup Storage, Consumer Electronics Firmware + Asset Storage.
MCU Firmware Boot Storage
The W25Q128JVFIQ serves as primary boot flash for microcontrollers and SoCs running RTOS or bare-metal firmware. Its 16 MB capacity supports multi-image firmware with OTA rollback, and 4 KB uniform sectors enable selective bootloader updates without erasing the full image. SPI/Quad-SPI modes deliver fast execute-in-place (XIP) reads at up to 532 Mbit/s, eliminating shadow-RAM requirements. The wide 2.7-3.6 V supply and -40 to +85 C industrial temperature range suit outdoor and factory-floor MCUs. Designers should verify the host MCU SPI peripheral supports the configured 80-133 MHz clock and follow the Winbond Quad Enable (QE) bit initialization sequence.
추천
FPGA Configuration Bitstream Storage
Xilinx and Intel/Altera FPGAs commonly store configuration bitstreams in SPI NOR flash such as the W25Q128JVFIQ. The 128 Mbit capacity fits largest FPGA bitstreams with margin for golden-image and update-image backup, while 133 MHz Quad-SPI fast-read times support multi-MHz FPGA configuration loading. The 16-SOIC footprint routes cleanly to standard FPGA SPI configuration pins and provides mechanical rigidity for industrial environments. The 100K erase cycles and 20-year data retention match typical FPGA product lifecycles, ensuring long-term field reliability. The Winbond JEDEC ID EFh is supported in stock FPGA programmer templates including iMPACT and Vivado.
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IoT Edge Device OTA Update Storage
IoT edge devices running Linux on Cortex-A SoCs use the W25Q128JVFIQ as primary storage for root filesystem, application binaries, and OTA update staging. The 16 MB density fits small Linux rootfs plus dual A/B partitions for fail-safe updates, while Quad-SPI bandwidth supports fast boot into DRAM. The chip's low standby current and 3.3 V single supply simplify battery-powered designs. The three 256-byte OTP security registers enable device-unique key injection for secure boot. Compared to raw SD-card storage, SPI NOR flash gives faster random access and superior environmental tolerance for outdoor IoT deployments.
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Industrial HMI Display Boot & Asset Storage
Industrial HMI panels store GUI assets, fonts, and bitmaps in the W25Q128JVFIQ to offload the microcontroller's internal flash. The 128 Mbit capacity fits large multilingual UI databases plus calibration tables; uniform 4 KB sectors allow per-language image replacement without disturbing the entire asset library. The industrial -40 to +85 C temperature grade handles factory automation, CNC, and outdoor signage environments. Compared to QSPI PSRAM, the NOR flash is non-volatile, enabling instant-on displays without reloading from network. The Quad-SPI interface delivers asset fetch at 532 Mbit/s for smooth UI refresh.
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Automotive Infotainment Backup Storage
Automotive infotainment head units use automotive-grade variants of the W25Q128JVFIQ family to store navigation maps, voice-prompt databases, and rear-view camera overlays. The -40 to +85 C operation and high vibration tolerance suit in-cabin and under-dash mounting, while 100K erase cycles accommodate map-update flash cycles across the vehicle's service life. Quad-SPI fast-read enables instant map tile loading during navigation. The Winbond JV family has AEC-Q100 variants available for OEM programs. Hardware designers should follow Winbond's automotive reference design for power-rail sequencing and EMI filtering.
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Consumer Electronics Firmware + Asset Storage
Consumer products such as smart speakers, e-readers, and wearable devices use the W25Q128JVFIQ to hold firmware plus localized assets in a single chip. The 16 MB density accommodates multi-region voice-model libraries in compact SOIC-16, reducing PCB area versus parallel-NOR solutions. Low standby current and 3.3 V single supply align with battery-powered form factors. The 100K erase endurance and 20-year retention guarantee typical consumer product lifecycles. Designers can leverage the Winbond Uniform 4 KB sector layout for per-region firmware customization without complex software overlays.
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추천 제품 요약
엔지니어링 참조 데이터: W25Q128JVFIQ — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | W25Q128JVSIQ | W25Q128JVFIFQ | GD25Q128CSIGR | GD25Q128E | MX25L12835FM2I-10G | EN25QH128A-104HIP |
|---|---|---|---|---|---|---|---|
| Brand | Winbond | Winbond | Winbond | GigaDevice | GigaDevice | Macronix | EON |
| Package | 16-SOIC (300 mil) | 8-SOIC (150 mil) | 16-SOIC (300 mil) - same | 8-SOIC (150 mil) | 8-SOIC (208 mil) | 8-SOIC (200 mil) | 16-SOIC (300 mil) - same |
| Density | 128 Mbit | 128 Mbit | 128 Mbit | 128 Mbit | 128 Mbit | 128 Mbit | 128 Mbit |
| Supply Voltage | 2.7-3.6 V | 2.7-3.6 V | 2.7-3.6 V | 2.7-3.6 V | 2.7-3.6 V | 2.7-3.6 V | 2.7-3.6 V |
| Max Clock Frequency | 133 MHz | 133 MHz | 133 MHz | 120 MHz | 133 MHz | 104 MHz | 104 MHz |
| JEDEC Manufacturer ID | EFh (Winbond) | EFh | EFh | C8h | C8h | C2h | 1Ch |
| Sector Size | 4 KB uniform | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Quad-SPI / QPI Support | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Endurance (P/E cycles) | 100K | 100K | 100K | 100K | 100K | 100K | 100K |
주요 차별점
- Industrial-grade operating temperature (vs GD25Q128E)
- AEC-Q100 automotive validation base (vs MX25L12835FM2I-10G)
- 16-SOIC footprint provides Quad-I/O routing flexibility (vs W25Q128JVSIQ)
설계 노트
Quad-I/O mode repurposes /WP (pin 3) and /HOLD (pin 7) as /IO2 and /IO3. If you do not actively drive these pins in firmware (set QE bit in SR2[1] first) they MUST be tied to VCC via 10-100 kohm pull-ups to avoid floating-input noise that can corrupt reads in production. Many first-prototype failures are caused by leaving /WP and /HOLD floating when transitioning from single-IO boot to quad-IO fast-read.
For reliable operation at 80 MHz+ SPI clock, place a 33 ohm series resistor on each SPI trace (CS, CLK, IO0-IO3) within 25 mm of the host MCU. Keep SPI trace lengths under 50 mm total to limit reflections, and route them over a continuous ground plane without crossing splits. Add a 100 nF decoupling capacitor within 5 mm of the flash VCC pin to suppress switching noise.
Page program operations draw up to 25 mA peak; sector erase up to 30 mA. Use a 100 nF ceramic plus 10 uF bulk capacitor on VCC to prevent supply droop during programming. If the host MCU shares the same 3.3 V rail, ensure the LDO can supply at least 50 mA above the MCU's continuous draw to avoid brown-outs that may corrupt the in-progress program cycle.
Place the W25Q128JVFIQ within 50 mm of the host MCU SPI pins, with GND pin (4) connected to a low-impedance ground pour. Avoid routing SPI traces near switching regulator inductors or high-current traces; cross-coupling from a 1 A switching node can induce bit errors at 80 MHz+. Maintain 4x dielectric spacing between SPI signals and aggressors.
규정 준수 정보
RoHS and REACH compliant per Winbond product page. Industrial temperature grade is -40 to +85 C; AEC-Q100 variants are available separately (W25Q128JVFIQ-Q1). Halogen-free per Winbond datasheet.
