STM32H747XIH6 - Dual-Core Cortex-M7/M4 MCU, 2MB Flash | STMicroelectronics
부품 번호: STM32H747XIH6 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $25.4 | $25.40 |
| 10 | $22.85 | $228.50 |
| 100 | $20.3 | $2,030.00 |
| 500 | $18.1 | $9,050.00 |
| 1,000 | $16.2 | $16,200.00 |
STM32H747XIH6 개요
A microcontroller (MCU) is a compact integrated circuit that integrates a processor core, on-chip memory, and programmable input/output peripherals into a single chip. Within STMicroelectronics' portfolio, the STM32 family is the company's mainstream 32-bit Arm Cortex-M line, and the STM32H7 sub-family sits at the top of that portfolio, representing the highest-performance Cortex-M class devices ST produces. The H747 specifically targets applications that benefit from a heterogeneous dual-core architecture, with the Cortex-M7 handling signal processing, graphics, and AI inference while the Cortex-M4 handles low-latency motor control, communication stacks, and housekeeping.
Key features include 2 MB of flash, 1 MB of SRAM, three 16-bit ADC converters running up to 3.6 MSPS, two 12-bit DACs, a TFT-LCD controller with DSI interface support, a hardware JPEG codec, a digital camera interface, and a hardware cryptographic accelerator. Communication interfaces include multiple SPI/I2C/UART instances, two USB 2.0 OTG controllers, two CAN-FD modules, an Ethernet MAC, SDMMC, and a flexible static memory controller for SRAM/NOR/NAND.
The architecture is built on a 40 nm CMOS process, enabling high clock speeds with efficient power consumption. An integrated SMPS step-down converter improves dynamic efficiency by generating internal core voltage from the 1.62-3.6 V external supply. The device also features a true random number generator and 128 unique-device-ID bits, supporting secure-boot and key-storage flows.
Typical applications include industrial automation and PLCs, motor drives and servo control, smart home gateways, audio processing and consumer audio, machine vision, edge AI inference, and human-machine-interface (HMI) panels with TFT-LCD or DSI displays. The combination of high-speed DSP, rich connectivity, and an integrated display pipeline makes it suitable for products that need both local processing and cloud connectivity.
When designing with this device, careful PCB layout and power-supply decoupling are required to achieve stable 480 MHz operation; ST recommends a 4-layer PCB with a continuous ground plane. Multiple low-power modes (D1/D2/D3 domains with DStop/DStandby) allow developers to optimize for battery-powered edge devices while still retaining sub-millisecond wake-up latency.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: STM32H747XIH6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: STM32H747XIH6 (동일 폼 팩터 및 풋프린트) — 차이점: Communication Interfaces, Package, Mounting Type, SRAM, Display Interface.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
STM32H745XIH6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
STM32H747IIK6
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
STM32H747BGT6
✅ 드롭인✓ 재고 있음
$17.1 / 개
데이터시트 보기 →STM32H757XIH6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$12.18 / 개
데이터시트 보기 →STM32H747XIH6TR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
ES32H747XIH6U
✅ 드롭인✓ 재고 있음
$19.75 / 개
데이터시트 보기 →STM32H747XIH6 최대 정격 & 전기적 특성
| Core Architecture | Dual-core Arm Cortex-M7 + Cortex-M4 |
| Cortex-M7 Max Frequency | 480 MHz |
| Cortex-M4 Max Frequency | 240 MHz |
| Flash Memory | 2 MB |
| SRAM | 1 MB |
| Supply Voltage (VDD) | 1.62 V to 3.6 V |
| 동작 온도 | -40 C to +85 C |
| 패키지 | TFBGA-265 (14x14 mm, 240+25 balls) |
| ADC | 3 x 16-bit, up to 3.6 MSPS |
| DAC | 2 x 12-bit |
| Communication Interfaces | USB OTG x2, CAN-FD x2, Ethernet, SPI, I2C, SDMMC, USART/UART, SAI |
| Display Interface | TFT-LCD + MIPI-DSI |
| Graphics Accelerator | Chrom-ART (DMA2D) |
| Cryptographic Accelerator | AES / SHA / PKA hardware acceleration |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
STM32H747XIH6 tfbga-265 (14x14 mm, 240+25 balls) 핀 구성 가이드
STM32H747XIH6(tfbga-265 (14x14 mm, 240+25 balls) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: STM32H747XIH6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
STM32H747XIH6 적합 용도: 7 애플리케이션s: Industrial PLC and Motor Control, Human-Machine Interface (HMI) Panels with TFT-LCD, Edge AI Inference (Vision and Audio), Audio Processing and Consumer Audio, Smart Home Gateway and IoT Hub, Machine Vision and Digital Camera Systems, Automotive Infotainment and Cluster Displays.
Industrial PLC and Motor Control
The STM32H747XIH6 fits industrial PLC and motor-control applications because its dual-core architecture partitions deterministic tasks cleanly: the Cortex-M7 runs 480 MHz to execute field-oriented control (FOC) loops, complex state machines, and EtherCAT communication, while the Cortex-M4 at 240 MHz handles sub-millisecond safety monitoring, encoder sampling, and redundant comms. The on-chip ADCs (3 x 16-bit at 3.6 MSPS) digitize current and voltage feedback without external analog front-ends, and the three independent ADC units allow simultaneous sampling of all three motor phases for sensorless FOC. ST's motor-control firmware ecosystem (MCSDK) provides validated reference FOC algorithms ready to deploy on the M7 core.
추천
Human-Machine Interface (HMI) Panels with TFT-LCD
For HMI panels driving TFT-LCD up to WXGA resolution, the STM32H747XIH6's Cortex-M7 handles the LVGL/Dear-Dear rendering pipeline while the M4 manages capacitive touch sensing, RS-485/Modbus, and CAN-FD communication. The on-chip Chrom-ART DMA2D engine offloads 2D blit operations, achieving 60 fps for typical 480 x 800 panels without CPU overhead. Integrated DSI host simplifies direct connection to MIPI-DSI displays, and the parallel TFT-LCD controller supports legacy RGB panels. The 1 MB of internal SRAM is sufficient to allocate a full framebuffer plus dual render buffers for tear-free animation on most common HMI resolutions.
추천
Edge AI Inference (Vision and Audio)
Edge AI inference workloads such as keyword spotting, person detection on camera frames, and predictive-maintenance vibration analysis map naturally onto the STM32H747XIH6's dual-core architecture. The Cortex-M7 at 480 MHz runs CMSIS-NN optimized models at approximately 1-2 effective TOPS, and STM32Cube.AI tooling converts TensorFlow Lite and ONNX models into deployable firmware. The Cortex-M4 simultaneously handles sensor-fusion pre-processing, audio PCM capture, or USB host enumeration for connected cameras. The 2 MB flash accommodates medium-sized CNN models (~500 KB), and the 1 MB SRAM stores activations plus a 320 x 240 grayscale framebuffer for vision tasks.
추천
Audio Processing and Consumer Audio
For high-end consumer audio products such as networked speakers, multi-channel soundbars, and DJ controllers, the STM32H747XIH6's Cortex-M7 executes audio DSP including EQ, DRC, upmixing, and network-stream buffering at 480 MHz, while the Cortex-M4 handles BLE/wireless-stack communication and capacitive-button scanning. SAI and SPDIF interfaces support multi-channel digital audio at 192 kHz/24-bit, and the integrated I2S peripherals connect directly to audio DACs such as the PCM1794A. The hardware cryptographic accelerator secures encrypted audio streaming over Wi-Fi, while the dual-core architecture prevents glitches when the audio core is loaded with DSP while the M4 keeps BLE telemetry flowing.
추천
Smart Home Gateway and IoT Hub
For smart-home gateways aggregating Matter, Zigbee, Thread, BLE, and Wi-Fi protocols, the STM32H747XIH6's Ethernet MAC, USB 2.0 OTG, multiple UART, and CAN-FD interfaces handle the wide protocol-mix without external bridges. The Cortex-M7 runs the main gateway application, including TLS-secured cloud-communication stacks (mbedTLS accelerated by hardware crypto), while the Cortex-M4 handles time-sensitive protocol scheduling such as Zigbee MAC ticks or BLE connection-event timing. The 2 MB flash accommodates full IPv6/Thread stacks plus application code, and the 1 MB SRAM supports TLS session caches plus packet buffers.
추천
Machine Vision and Digital Camera Systems
For machine-vision systems such as barcode scanners, industrial inspection cameras, and biometric access controllers, the STM32H747XIH6's parallel DCMI camera interface streams up to 80 MByte/s from a CMOS image sensor into SRAM, and the Cortex-M7 runs the image-processing pipeline including exposure correction, edge detection, and template comparison. The Cortex-M4 handles real-time communication (RS-485, Ethernet, CAN) and trigger I/O. The integrated JPEG codec compresses frames for storage or transmission, while the Chrom-ART engine accelerates image-format conversion in hardware. The Ethernet MAC enables streaming MJPEG over IP for remote-monitoring cameras.
추천
Automotive Infotainment and Cluster Displays
Although the STM32H747XIH6 is industrial-grade, it can drive automotive-grade aftermarket infotainment and instrument-cluster displays that do not require AEC-Q100. The dual-core architecture renders SVGA/WVGA TFT-LCD displays via the parallel RGB interface and runs OpenGL-style 2D overlays via Chrom-ART, while the Cortex-M4 handles CAN-FD bus connectivity, audio routing, and capacitive-touch polling. The hardware cryptographic accelerator secures OTA firmware updates, and the 2 MB flash accommodates graphic assets plus bootloaders. For production automotive clusters requiring AEC-Q100, designers should pair the H747 with an external watchdog MCU from the SPC56 family.
추천
추천 제품 요약
엔지니어링 참조 데이터: STM32H747XIH6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | STM32H745XIH6 | STM32H747IIK6 | STM32H747BGT6 | STM32H757XIH6 | STM32H747XIH6TR | ES32H747XIH6U |
|---|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | GigaDevice |
| Package | TFBGA-265 (14x14 mm) | TFBGA-265 (14x14 mm) - same | TFBGA-176 (10x10 mm) - smaller package | LQFP-208 (28x28 mm) - same silicon, larger footprint | TFBGA-265 (14x14 mm) - same | TFBGA-265 (14x14 mm) - same | TFBGA-265 (14x14 mm) - same footprint |
| Cortex-M7 Frequency | 480 MHz | 480 MHz | 480 MHz | 480 MHz | 480 MHz | 480 MHz | 480 MHz |
| Cortex-M4 Frequency | 240 MHz | 240 MHz | 240 MHz | 240 MHz | 240 MHz | 240 MHz | 240 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Cryptographic Accelerator | AES / SHA / TRNG subset | AES / SHA / TRNG subset | AES / SHA / TRNG subset | AES / SHA / TRNG subset | AES / SHA / PKA full + secure-boot | AES / SHA / TRNG subset | AES / SHA / TRNG subset |
주요 차별점
- Dual-core heterogeneous architecture in TFBGA-265 (vs STM32F429NIH6)
- Largest on-chip memory in 480 MHz class Cortex-M (vs STM32H750XBH6)
- Cross-brand pin-compatible alternative available (vs STM32H745XIH6)
- Hardware JPEG codec and Chrom-ART accelerator (vs GD32F103)
설계 노트
The TFBGA-265 package has a 0.8 mm ball pitch that requires a 4-layer PCB with 0.4 mm laser-drilled microvias for fan-out. STMicroelectronics' application note AN5326 recommends a continuous ground plane on layer 2 directly beneath the BGA, plus 100 nF + 4.7 uF decoupling on every VDD/VDDA/VDD_USB pin placed within 2 mm of the ball. The exposed die pad must be soldered to a 10x10 mm ground pour with at least nine thermal vias (0.3 mm drill, 0.5 mm pad) for heat dissipation.
Estimated: at 480 MHz dual-core full load with all peripherals active, the STM32H747XIH6 draws approximately 200-300 mA from VDD. The internal SMPS step-down converter converts this to ~1.0-1.2 V core voltage with ~80% efficiency; designers should provide a VDD rail capable of at least 400 mA sustained and 600 mA peak. Use a low-ESR 4.7 uF buck output cap and a 22 uF bulk capacitor near the VDD pins to handle Cortex-M7 transient load steps that occur when the M7 wakes from DStop mode.
Do not connect the JTAG/SWD signals (PA13/PA14/PB0/PB1) directly to 5 V signals; the H747 GPIOs are 3.3 V tolerant only and 5 V input will destroy the IO. The HSE crystal load capacitance must be selected based on the crystal manufacturer's C_L specification; a typical 8 MHz crystal with 8 pF C_L requires 12 pF external load capacitors on OSC_IN/OSC_OUT. The LSE Bypass mode requires the LSE crystal to be inverting-amplifier configuration - do not connect DC-biased external clock signals directly to OSC32_IN without a series capacitor.
Place the 32.768 kHz LSE crystal as close as possible to the OSC32_IN/OSC32_OUT pins with symmetric trace lengths (mismatch > 1 mm causes RTC drift). Route USB_DP/USB_DM as a 90-ohm differential pair with no stubs; the H747 USB OTG requires 45-ohm series ferrite beads plus ESD protection diodes (such as the USBLC6-2SC6). For SDMMC routing to eMMC, keep trace lengths matched within 0.5 mm and isolate from switching power supplies with a guard ground.
Estimated: at 480 MHz dual-core with all peripherals active, the STM32H747XIH6 dissipates approximately 1.0-1.5 W steady-state. Without the exposed-die pad connected to ground or with insufficient PCB copper area, the junction temperature can rise above the 125 C maximum and trigger thermal shutdown. ST recommends a minimum of 1000 mm^2 of ground-plane copper connected to the die pad via 9 thermal vias; designs with 4+ layer PCBs and continuous ground planes typically achieve theta_JA of 25-30 C/W.
규정 준수 정보
RoHS compliant per ST product page. Not AEC-Q100 qualified - choose STM32H747XIH6Q or SPC56 family for automotive applications. Lead-free and halogen-free per STMicroelectronics material declaration.
