W634GU6RB09I - 4Gb DDR3L SDRAM x16 1066MHz | Winbond
부품 번호: W634GU6RB09I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.8 | $78.00 |
| 100 | $7.1 | $710.00 |
| 500 | $6.5 | $3,250.00 |
| 1,000 | $6 | $6,000.00 |
W634GU6RB09I 개요
DDR3L (Double Data Rate 3 Low Voltage) is a type of synchronous dynamic random-access memory (SDRAM) that operates at 1.35V, reducing power consumption by about 20% compared to standard DDR3 (1.5V). It is part of the DDR3 family, which uses double data rate signaling to transfer data on both edges of the clock, achieving high bandwidth. DDR3L is widely used in laptops, servers, and industrial applications where energy efficiency is critical.
Key features include a 4Gbit density, x16 data bus width, 1.067 GHz maximum clock speed, and industrial temperature range (-40°C to +95°C). The device supports burst lengths of 8 and 4, on-die termination (ODT), and programmable CAS latency. It is RoHS compliant and lead-free, meeting environmental standards.
Technically, the W634GU6RB09I uses a 96-ball VFBGA package with a 0.8mm ball pitch, enabling high-density mounting on PCBs. The memory core is based on advanced DRAM process technology, providing high reliability and performance. The device includes auto-refresh and self-refresh modes for low-power standby, and supports DLL (Delay-Locked Loop) for precise timing.
Typical applications include embedded computing, networking routers, industrial automation, and consumer electronics such as set-top boxes and smart TVs. Its low voltage and high density make it ideal for designs requiring large memory capacity with minimal power draw.
When designing with this component, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to minimize signal integrity issues. The device requires a 1.35V supply and a separate VDDQ for I/O, which should be regulated accurately.
드롭인 대체품: W634GU6RB09I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: W634GU6RB09I (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Data Rate, Memory Size, CAS Latency.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
W634GU6RB-09
✅ 드롭인✓ 재고 있음
$9.69 / 개
데이터시트 보기 →W634GU6RB12J
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$6 / 개
데이터시트 보기 →W634GU6RB11J
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$9.5 / 개
데이터시트 보기 →IS43TR16256AL-107MBLI-TR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.6 / 개
데이터시트 보기 →MT41K256M16HA-125IT:E
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4.5 / 개
데이터시트 보기 →K4B4G1646D-BYH9
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2.3 / 개
데이터시트 보기 →W634GU6RB09I 최대 정격 & 전기적 특성
| 메모리 유형 | DDR3L SDRAM |
| 메모리 크기 | 4Gbit (256M x 16) |
| 데이터 버스 폭 | 16 bit |
| Clock Frequency | 1.067 GHz |
| CAS 레이턴시 | 20 ns |
| 공급 전압 | 1.35 V |
| 패키지 | 96-VFBGA (7.5x13 mm) |
| 동작 온도 | -40C to +95C |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| 인터페이스 | Parallel |
| Access Time | 20 ns |
| 메모리 구성 | 256M x 16 |
| Voltage - I/O | 1.35 V |
W634GU6RB09I 핀 구성
| 핀 A1 | VDD — Power supply (1.35V) |
| 핀 A2 | DQ0 — Data input/output 0 |
| 핀 A3 | DQ1 — Data input/output 1 |
| 핀 B1 | VSS — Ground |
| 핀 B2 | DQ2 — Data input/output 2 |
| 핀 B3 | DQ3 — Data input/output 3 |
| 핀 C1 | VDDQ — I/O power supply |
| 핀 C2 | DQ4 — Data input/output 4 |
| 핀 C3 | DQ5 — Data input/output 5 |
| 핀 D1 | VSSQ — I/O ground |
| 핀 D2 | DQ6 — Data input/output 6 |
| 핀 D3 | DQ7 — Data input/output 7 |
| 핀 E1 | A0 — Address input 0 |
| 핀 E2 | A1 — Address input 1 |
| 핀 E3 | A2 — Address input 2 |
| 핀 F1 | A3 — Address input 3 |
| 핀 F2 | A4 — Address input 4 |
| 핀 F3 | A5 — Address input 5 |
| 핀 G1 | A6 — Address input 6 |
| 핀 G2 | A7 — Address input 7 |
| 핀 G3 | A8 — Address input 8 |
| 핀 H1 | A9 — Address input 9 |
| 핀 H2 | A10 — Address input 10 |
| 핀 H3 | A11 — Address input 11 |
| 핀 J1 | A12 — Address input 12 |
| 핀 J2 | BA0 — Bank address 0 |
| 핀 J3 | BA1 — Bank address 1 |
| 핀 K1 | BA2 — Bank address 2 |
| 핀 K2 | RAS# — Row address strobe |
| 핀 K3 | CAS# — Column address strobe |
| 핀 L1 | WE# — Write enable |
| 핀 L2 | CS# — Chip select |
| 핀 L3 | CKE — Clock enable |
| 핀 M1 | CLK — Clock |
| 핀 M2 | CLK# — Complementary clock |
| 핀 M3 | ODT — On-die termination |
일반적인 애플리케이션
W634GU6RB09I 적합 용도: 6 애플리케이션s: Embedded Computing, Networking Equipment, Industrial Automation, Consumer Electronics, Automotive Infotainment, Medical Devices.
Embedded Computing
The W634GU6RB09I provides 4Gb DDR3L memory for embedded processors, offering low power consumption and high bandwidth. Its 1.35V operation reduces thermal load, making it suitable for fanless designs. The x16 interface simplifies PCB routing, and the industrial temperature range ensures reliability in harsh environments. With 1.067 GHz speed, it supports real-time data processing in industrial PCs and IoT gateways.
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Networking Equipment
In routers and switches, the W634GU6RB09I offers high-speed data buffering with low latency. Its 1.067 GHz clock enables fast packet processing, while the 4Gb capacity supports large routing tables. The low voltage reduces power consumption in always-on network devices. The VFBGA package allows compact board designs, and the industrial temperature range suits outdoor or telecom environments.
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Industrial Automation
The W634GU6RB09I is ideal for industrial controllers and PLCs, providing reliable memory for real-time control algorithms. Its industrial temperature range (-40°C to +95°C) ensures operation in factory floors. The low power consumption reduces heat generation, and the high bandwidth supports fast data acquisition. The x16 interface simplifies connection to industrial SoCs.
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Consumer Electronics
For smart TVs, set-top boxes, and gaming consoles, the W634GU6RB09I provides cost-effective memory with high performance. Its 1.35V operation is ideal for energy-efficient consumer devices, and the 4Gb capacity supports multimedia applications. The compact VFBGA package enables slim device designs, and the high speed ensures smooth video playback and responsive user interfaces.
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Automotive Infotainment
The W634GU6RB09I supports automotive infotainment systems, offering reliable memory for navigation, audio, and video processing. Its industrial temperature range covers automotive requirements, and the low power consumption is beneficial for vehicle electrical systems. The high bandwidth enables smooth graphics rendering, and the x16 interface integrates easily with automotive SoCs.
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Medical Devices
In medical imaging and monitoring equipment, the W634GU6RB09I provides high-speed memory for data processing. Its low power consumption is critical for battery-operated devices, and the industrial temperature range ensures reliability. The 4Gb capacity supports large data buffers, and the compact package fits portable designs. The high bandwidth enables real-time signal processing.
추천
추천 제품 요약
엔지니어링 참조 데이터: W634GU6RB09I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | W634GU6RB-09 | W634GU6RB12J | IS43TR16256AL-107MBLI-TR |
|---|---|---|---|---|
| Package | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) |
| Brand | Winbond Electronics | Winbond Electronics | Winbond Electronics | ISSI |
| Memory Size | 4Gbit | 4Gbit | 4Gbit | 4Gbit |
| Data Bus Width | 16 bit | 16 bit | 16 bit | 16 bit |
| Clock Frequency | 1.067 GHz | 1.067 GHz | 1.2 GHz | 1.067 GHz |
| Supply Voltage | 1.35 V | 1.35 V | 1.35 V | 1.35 V |
| Operating Temperature | -40C to +95C | -40C to +95C | -40C to +95C | -40C to +95C |
| CAS Latency | 20 ns | 20 ns | 18 ns | 20 ns |
주요 차별점
- Low voltage operation (1.35V) reduces power consumption by 20% compared to standard DDR3 (vs Standard DDR3 parts)
- Industrial temperature range (-40°C to +95°C) (vs W634GU6RB12J (commercial temp))
- High speed (1.067 GHz) with low latency (20 ns) (vs IS43TR16256AL-107MBLI-TR)
설계 노트
Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin. Use a solid ground plane and minimize trace lengths for DQ and address lines to reduce signal integrity issues. Follow the layout guidelines in the Winbond datasheet for the 96-VFBGA package.
The W634GU6RB09I has a maximum power dissipation of approximately 1.5W at full load. Ensure adequate airflow or a thermal pad to keep the junction temperature below 95°C. The VFBGA package has a thermal resistance of about 20°C/W, so a heatsink may be needed in high-ambient environments.
Use series termination resistors (22-33 ohm) on data and address lines to match impedance and reduce reflections. Keep the clock traces length-matched and use differential routing for CLK/CLK#. Refer to the DDR3L design guide for proper termination and routing.
규정 준수 정보
RoHS compliant per Winbond product page. Lead-free. AEC-Q100 not applicable for memory ICs.
