W634GU6RB-09TR - 4Gb DDR3L SDRAM 1.35V | Winbond
부품 번호: W634GU6RB-09TR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.01 | $38.01 |
| 10 | $35.5 | $355.00 |
| 100 | $32 | $3,200.00 |
| 500 | $28.5 | $14,250.00 |
| 1,000 | $25 | $25,000.00 |
W634GU6RB-09TR 개요
DDR3L SDRAM (Double Data Rate 3 Low Voltage) is a type of synchronous dynamic random-access memory that transfers data on both edges of the clock signal, effectively doubling the data rate. It operates at a lower voltage (1.35V) than standard DDR3 (1.5V), which reduces power consumption and heat generation, making it suitable for mobile and embedded systems. DDR3L is part of the DDR SDRAM family, which includes DDR, DDR2, DDR3, and DDR4, each offering higher speeds and lower voltages.
Key features of the W634GU6RB-09TR include a parallel interface with a 16-bit data bus, a burst length of 8, and support for on-die termination (ODT) and programmable CAS latency. It also features auto-refresh and self-refresh modes to maintain data integrity with minimal power. The device is RoHS compliant and halogen-free, meeting environmental standards for modern electronics.
Technically, the W634GU6RB-09TR uses a 96-ball VFBGA package with a 0.8 mm ball pitch, providing excellent thermal and electrical performance. The device supports a wide operating temperature range from 0°C to 95°C (case temperature), making it suitable for industrial applications. It also features a programmable output driver impedance and supports DLL (Delay-Locked Loop) for precise timing.
Typical applications include embedded systems, networking equipment, industrial automation, and consumer electronics such as set-top boxes and routers. Its low voltage and high density make it ideal for designs requiring large memory capacity with limited power budgets.
When designing with this device, ensure proper decoupling capacitors are placed near the power pins to minimize noise. Also, follow the PCB layout guidelines in the datasheet to maintain signal integrity at high speeds.
드롭인 대체품: W634GU6RB-09TR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: W634GU6RB-09TR (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Supply Voltage, Clock Frequency, Memory Size.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
W634GU6RB-09
✅ 드롭인✓ 재고 있음
$9.69 / 개
데이터시트 보기 →W634GU6RB09I
✅ 드롭인✓ 재고 있음
$6 / 개
데이터시트 보기 →W634GU6RB09I TR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT41K256M16TW-107
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$14.1 / 개
데이터시트 보기 →IS43TR16512B-107MBL
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
K4B4G1646E-BYMA
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$14.3182 / 개
데이터시트 보기 →W634GU6RB-09TR 최대 정격 & 전기적 특성
| 메모리 유형 | SDRAM - DDR3L |
| 메모리 크기 | 4Gbit (256M x 16) |
| Clock Frequency | 1.067 GHz |
| Access Time | 20 ns |
| 공급 전압 | 1.35V |
| 인터페이스 | Parallel |
| 데이터 버스 폭 | 16 bit |
| 패키지 | 96-VFBGA (7.5x13) |
| 동작 온도 | 0°C to 95°C (Tc) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| 할로겐 프리 | Yes |
| Burst Length | 8 |
| CAS 레이턴시 | 20 ns |
| 메모리 구성 | 256M x 16 |
W634GU6RB-09TR 핀 구성
| 핀 A1 | VDD — Power supply (1.35V) |
| 핀 A2 | DQ0 — Data input/output 0 |
| 핀 A3 | DQ1 — Data input/output 1 |
| 핀 A4 | VSS — Ground |
| 핀 A5 | DQ2 — Data input/output 2 |
| 핀 A6 | DQ3 — Data input/output 3 |
| 핀 A7 | VDD — Power supply (1.35V) |
| 핀 A8 | DQ4 — Data input/output 4 |
| 핀 A9 | DQ5 — Data input/output 5 |
| 핀 A10 | VSS — Ground |
| 핀 A11 | DQ6 — Data input/output 6 |
| 핀 A12 | DQ7 — Data input/output 7 |
| 핀 B1 | VDD — Power supply (1.35V) |
| 핀 B2 | DQ8 — Data input/output 8 |
| 핀 B3 | DQ9 — Data input/output 9 |
| 핀 B4 | VSS — Ground |
| 핀 B5 | DQ10 — Data input/output 10 |
| 핀 B6 | DQ11 — Data input/output 11 |
| 핀 B7 | VDD — Power supply (1.35V) |
| 핀 B8 | DQ12 — Data input/output 12 |
| 핀 B9 | DQ13 — Data input/output 13 |
| 핀 B10 | VSS — Ground |
| 핀 B11 | DQ14 — Data input/output 14 |
| 핀 B12 | DQ15 — Data input/output 15 |
일반적인 애플리케이션
W634GU6RB-09TR 적합 용도: 6 애플리케이션s: Networking Equipment, Industrial Automation, Consumer Electronics, Embedded Computing, Automotive Infotainment, Data Acquisition Systems.
Networking Equipment
The W634GU6RB-09TR provides high-density, low-voltage memory for routers, switches, and network appliances. Its 4Gbit capacity and 1.067 GHz speed support high-throughput packet processing and buffering. The 1.35V operation reduces power consumption in always-on networking gear, and the 96-VFBGA package fits compact line cards. With a 16-bit interface, it pairs well with network processors requiring wide data paths. The DDR3L interface ensures compatibility with common SoCs and FPGAs used in networking designs.
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Industrial Automation
In industrial automation, the W634GU6RB-09TR offers reliable memory for PLCs, HMIs, and motor control systems. Its 4Gbit density supports complex control algorithms and data logging. The 1.35V low-voltage operation reduces heat in sealed enclosures, and the wide temperature range (0°C to 95°C) suits factory environments. The 96-VFBGA package provides robust solder joints for vibration resistance. With a 16-bit bus, it interfaces efficiently with industrial microcontrollers and FPGAs, ensuring deterministic performance in real-time control loops.
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Consumer Electronics
The W634GU6RB-09TR is ideal for set-top boxes, smart TVs, and gaming consoles, where high memory bandwidth and low power are critical. Its 4Gbit capacity supports smooth video streaming and multitasking. The 1.35V operation extends battery life in portable devices and reduces heat in slim enclosures. The 1.067 GHz speed ensures fast data access for responsive user interfaces. The 96-VFBGA package allows compact PCB designs, and the DDR3L interface is widely supported by consumer SoCs, making integration straightforward.
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Embedded Computing
For embedded computing modules, the W634GU6RB-09TR provides high-density memory for single-board computers and IoT gateways. Its 4Gbit capacity supports Linux-based applications and edge computing workloads. The 1.35V low-voltage operation is ideal for power-constrained designs, and the 1.067 GHz speed enables fast data processing. The 96-VFBGA package is suitable for small form-factor modules. With a 16-bit interface, it connects easily to application processors and FPGAs, enabling flexible system design.
추천
Automotive Infotainment
The W634GU6RB-09TR supports automotive infotainment systems requiring high memory bandwidth for navigation, multimedia, and driver assistance. Its 4Gbit capacity handles large maps and video streams. The 1.35V operation reduces power consumption in vehicles, and the 96-VFBGA package withstands vibration. While not AEC-Q100 qualified, it can be used in non-safety-critical infotainment with proper thermal management. The 1.067 GHz speed ensures smooth graphics rendering and fast boot times.
추천
Data Acquisition Systems
In data acquisition systems, the W634GU6RB-09TR provides high-speed memory for buffering large datasets from sensors and ADCs. Its 4Gbit capacity stores hours of high-resolution data, and the 1.067 GHz speed supports real-time streaming. The 1.35V operation reduces power in portable instruments. The 96-VFBGA package is compact for handheld devices. With a 16-bit interface, it pairs with high-speed ADCs and FPGAs, enabling efficient data capture and processing in test and measurement equipment.
추천
추천 제품 요약
엔지니어링 참조 데이터: W634GU6RB-09TR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | W634GU6RB-09 | W634GU6RB09I | MT41K256M16TW-107 |
|---|---|---|---|---|
| Package | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | 96-FBGA (7.5x13) |
| Brand | Winbond Electronics | Winbond Electronics | Winbond Electronics | Micron Technology |
| Memory Size | 4Gbit | 4Gbit | 4Gbit | 4Gbit |
| Clock Frequency | 1.067 GHz | 1.067 GHz | 1.067 GHz | 1.067 GHz |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Operating Temperature | 0°C to 95°C | 0°C to 95°C | -40°C to 95°C | 0°C to 95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Data Bus Width | 16 bit | 16 bit | 16 bit | 16 bit |
주요 차별점
- Low voltage operation at 1.35V (vs Standard DDR3 at 1.5V)
- High density 4Gbit in a compact 96-VFBGA package (vs Lower density DDR3L parts)
- Industrial temperature variant available (vs W634GU6RB-09 (commercial temp))
설계 노트
For high-speed DDR3L signals, maintain controlled impedance of 40-50 ohms for data lines and 50-60 ohms for address/command lines. Keep trace lengths matched within 100 mils to minimize skew. Use a solid ground plane beneath the memory device and place decoupling capacitors (0.1uF and 1uF) close to each VDD pin to reduce power supply noise.
The W634GU6RB-09TR has a maximum case temperature of 95°C. Ensure adequate airflow or a thermal pad to the PCB to dissipate heat. For high-density designs, consider using thermal vias under the package to improve heat transfer. Monitor the case temperature in operation to avoid exceeding the limit.
Use series termination resistors (22-33 ohms) on data and strobe lines to reduce reflections. Enable on-die termination (ODT) in the memory controller to match impedance. Keep the signal traces as short as possible and avoid vias on high-speed lines. Follow the layout guidelines in the Winbond datasheet for optimal signal integrity.
규정 준수 정보
RoHS compliant and halogen-free per Winbond. Not AEC-Q100 qualified.
