XC3S250E-4VQ100C - 250K Gate Spartan-3E FPGA | AMD
부품 번호: XC3S250E-4VQ100C ✗ 단종XC3S250E-4VQ100C 개요
A field-programmable gate array is a semiconductor whose digital logic can be configured after fabrication. An FPGA belongs to the programmable-logic device hierarchy, where configuration memory, programmable logic blocks, block RAM, and programmable I/O implement parallel hardware functions. The Spartan-3E family targets consumer, communications, industrial, and embedded systems where a small FPGA provides more flexibility than fixed logic without the cost of the largest devices.
The XC3S250E-4VQ100C provides 250,000 system gates, 5,508 configurable logic elements, 612 logic array blocks, and 221,184 total RAM bits. Its 66 user I/O pins support external interfaces, while the -4 speed grade is associated with a maximum clock frequency of 572 MHz. The 100-pin TQFP package uses a 0.5 mm pitch, allowing conventional surface-mount assembly while keeping the device physically smaller than many larger FPGA packages.
The device is based on 90 nm CMOS technology and operates from a 1.2 V core supply. Its architecture supports parallel datapaths, control logic, communication interfaces, and general-purpose embedded processing implemented as programmable logic. Configuration data establishes the interconnection and logic functions, allowing one board design to support multiple firmware or configuration revisions without changing the PCB.
Typical uses include industrial control, networking equipment, video and display interfaces, consumer electronics, test systems, and embedded protocol bridges. Its 66 I/O pins are useful for designs requiring a moderate number of external connections, while the 221,184-bit RAM resource can support buffering, packet storage, and state-machine data. The 572 MHz maximum clock supports demanding datapaths when device utilization and routing permit the target frequency.
PCB design should reserve the Spartan-3E configuration interface, provide a stable 1.2 V supply, and follow the manufacturer's decoupling and pinout guidance. Designers migrating from another FPGA should treat the device as an obsolete architecture and verify timing, I/O standards, configuration behavior, and tool-chain compatibility before committing new production hardware.
This product overview consolidates the core Spartan-3E architecture, pin and package information, application guidance, and confirmed same-package alternatives. It also highlights the migration considerations engineers should evaluate before selecting this legacy FPGA for an existing or new design.
드롭인 대체품: XC3S250E-4VQ100C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
XC3S250E-4VQG100C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC3S250E-4VQ100I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC3S250E-5VQ100C
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC3S250E-5VQ100I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC3S250E-4VQ100C
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →XC3S250E-4VQ100C 최대 정격 & 전기적 특성
| Device Type | Spartan-3E field-programmable gate array |
| System Gates | 250,000 gates |
| Logic Cells | 5,508 logic cells |
| Logic Array Blocks | 612 LABs/CLBs |
| Total RAM | 221,184 RAM bits |
| User I/O Pins | 66 I/O pins |
| 최대 클록 주파수 | 572 MHz |
| Core Supply Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| 패키지 | 100-pin TQFP |
| Package Pitch | 0.5 mm |
| Terminal Count | 100 terminals |
| 실장 유형 | Surface mount |
XC3S250E-4VQ100C 0.5 mm 핀 구성 가이드
XC3S250E-4VQ100C(0.5 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC3S250E-4VQ100C.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC3S250E-4VQ100C 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Networking and Protocol Conversion, Video and Display Interfaces, Consumer Programmable Logic, Test and Measurement Equipment, Embedded Communication Gateways.
Industrial Control and Automation
The XC3S250E-4VQ100C fits industrial controllers that combine sequencing, machine timing, and communication logic on one FPGA. Its 5,508 logic cells and 612 LABs/CLBs provide parallel hardware for interlocks, counters, motion sequencing, and diagnostics, while 221,184 RAM bits can buffer process data. The 66 user I/O pins connect sensors, actuators, and field buses, and the 572 MHz maximum clock supports time-critical logic. Because the device is a mature architecture, new machinery designs should verify tool support and consider a current FPGA when redesign freedom is practical.
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Networking and Protocol Conversion
The XC3S250E-4VQ100C can implement protocol bridges and interface adapters where parallel logic offers deterministic timing and flexible packet handling. The 250,000-system-gate device includes 5,508 logic cells, 612 LABs/CLBs, and 221,184 RAM bits for framing logic, transmit and receive buffers, and state management. Its 66 user I/O pins support multiple data paths, and the 572 MHz maximum clock can accommodate demanding packet-processing blocks. Board-level validation remains essential because I/O standards, timing, and configuration requirements must match the selected external interface components.
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Video and Display Interfaces
The XC3S250E-4VQ100C is suitable for modest display timing, video timing generation, and interface-format conversion designs. Programmable logic can implement horizontal and vertical counters, synchronization generation, pixel routing, and data alignment, while the 221,184 RAM bits provide line buffers or frame-related storage. Its 66 I/O pins allow connection to memory and display-interface components, and the 572 MHz maximum clock supports parallel datapaths. Actual video bandwidth and pixel timing remain design-dependent and must be checked against routing, memory bandwidth, and the selected panel interface.
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Consumer Programmable Logic
The Spartan-3E architecture of the XC3S250E-4VQ100C targets cost-sensitive consumer products that need flexible post-production logic. Its 250,000 system gates and 5,508 logic cells can implement feature control, user interfaces, simple media handling, and accessory logic without a separate microcontroller. The 100-pin TQFP package supports compact surface-mount construction, while 66 user I/O pins connect buttons, displays, and peripheral devices. Designers should account for the architecture's legacy status, configuration support, and product-lifecycle requirements when planning new consumer releases.
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Test and Measurement Equipment
The XC3S250E-4VQ100C can implement flexible timing, stimulus generation, acquisition control, and pattern processing in test equipment. Its 612 LABs/CLBs and 5,508 logic cells support parallel state machines and digital datapaths, while 221,184 RAM bits can store samples, vectors, or calibration data. The 66 I/O pins provide connections to converters, memories, and fixture controls, and the 572 MHz maximum clock enables high-rate digital sequencing. Signal integrity, I/O standards, and timing closure must be evaluated for each instrument architecture before layout release.
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Embedded Communication Gateways
The XC3S250E-4VQ100C fits gateway products that need parallel protocol handling, local buffering, and configurable logic around one or more communication controllers. Its 5,508 logic cells can implement framing, byte stuffing, filtering, and supervisory state machines, while 221,184 RAM bits support packet buffering and queues. The 66 user I/O pins are suitable for serial, parallel, and control interfaces, and the 572 MHz maximum clock supports concurrent datapaths. For new gateway products, compare migration effort and lifecycle risk against current low-power FPGA families before finalizing the architecture.
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추천 제품 요약
엔지니어링 참조 데이터: XC3S250E-4VQ100C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC3S250E-4VQG100C | XC3S250E-4VQ100I | XC3S250E-5VQ100C | XC3S250E-5VQ100I | XC3S250E-4VQ100C |
|---|---|---|---|---|---|---|
| Package | TQFP-100 | TQFP-100 | TQFP-100 | TQFP-100 | TQFP-100 | TQFP-100 |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| System Gates | 250,000 gates | 250,000 gates | 250,000 gates | 250,000 gates | 250,000 gates | 250,000 gates |
| Logic Cells | 5,508 cells | 5,508 cells | 5,508 cells | 5,508 cells | 5,508 cells | 5,508 cells |
| Logic Array Blocks | 612 LABs/CLBs | 612 LABs/CLBs | 612 LABs/CLBs | 612 LABs/CLBs | 612 LABs/CLBs | 612 LABs/CLBs |
| Total RAM | 221,184 bits | 221,184 bits | 221,184 bits | 221,184 bits | 221,184 bits | 221,184 bits |
| User I/O Pins | 66 I/O pins | 66 I/O pins | 66 I/O pins | 66 I/O pins | 66 I/O pins | 66 I/O pins |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
주요 차별점
- Commercial-temperature -4 speed option in a compact 100-pin TQFP (vs XC3S250E-4VQ100I)
- Same-footprint choice with a higher speed ordering class (vs XC3S250E-5VQ100C)
- Direct same-package alternative confirmed in channel cross-reference records (vs XC3S250E-4VQG100C)
설계 노트
Design the 1.2 V core rail and the device's auxiliary supply requirements from the AMD/Xilinx DS312 power-supply recommendations. Place the required bulk and decoupling capacitors at the pins identified in the package and reference-design guidance; do not substitute generic bulk-capacitor distances for the manufacturer's layout. Check startup current, configuration behavior, and rail sequencing under worst-case I/O activity before finalizing the power tree.
Route the configuration interface and clock inputs according to the DS312 pinout and layout guidance, keeping sensitive configuration paths away from noisy switching nodes. The 100-pin TQFP uses a 0.5 mm pitch, so inspect the assembled land pattern, solder-paste volume, and via strategy on a representative board. Preserve access for boundary-scan or programming connections if the product's test plan depends on them.
Do not treat another FPGA in a 100-pin package as interchangeable merely because the outline and pitch match. The XC3S250E-4VQ100C depends on Spartan-3E configuration, supply sequencing, I/O behavior, and device-specific timing. When changing speed or temperature ordering variants, rebuild the timing constraints and verify power, configuration, and I/O standards. A migration to another family should be treated as a redesign with a new pinout and tool flow.
Use the manufacturer's recommended clock topology and controlled-impedance routing for high-speed interfaces. The 572 MHz figure is a device capability rather than a guaranteed system operating frequency; achievable timing depends on logic utilization, routing, I/O standards, and external components. Run post-route timing analysis and reserve margin for speed grade, temperature, and process variation before treating the target frequency as achieved.
규정 준수 정보
No exact-part environmental or automotive qualification statement is included in the cited component records. Request lot- and date-code-specific quality documentation before using the device in regulated production.
