XC6SLX16-3CPG196I - Spartan-6 LX FPGA | AMD Embedded
부품 번호: XC6SLX16-3CPG196I ✓ 활성XC6SLX16-3CPG196I 개요
A field-programmable gate array is a programmable digital semiconductor that falls within the broader semiconductor and programmable-logic hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA combines configurable logic, memory resources, and programmable I/O in one device. This flexibility allows designers to implement parallel data paths, control logic, protocol interfaces, signal processing, and embedded systems while retaining a hardware platform that can be revised through configuration files.
The Spartan-6 LX architecture provides 14,579 logic cells, 106 I/O, and the -3 performance grade identified in the product listing. The 196-ball CSBGA package is lead-free and uses a compact 0.80 mm pitch. These characteristics make the XC6SLX16-3CPG196I useful when board area is constrained but the design still requires programmable logic, moderate I/O density, and dedicated FPGA resources.
The 45 nm Spartan-6 generation combines configurable logic with block RAM and DSP resources for control, communications, data acquisition, and embedded-processing designs. At the system level, the 106 available I/O support connections to external memory, transceivers, sensors, converters, and digital peripherals. Designers must complete timing closure for the selected speed grade, configure the device through the appropriate AMD FPGA toolchain, and implement power, decoupling, clocking, and I/O standards appropriate to the target board.
Typical uses include industrial automation, motor and motion control, test and measurement, embedded communications, instrument interfaces, and low-to-medium complexity signal-processing systems. The -3 speed grade is the principal reason to select this exact ordering code when maximum Spartan-6 LX performance is preferred over the lower -2 and L1 speed grades.
A critical design consideration is that the compact BGA package demands careful PCB layout, especially for power delivery, exposed-pad thermal management, high-speed routing, and ball-grid alignment. Decoupling should be placed directly beside the relevant supply balls, and the design should follow AMD's package, power, and layout guidance before release to fabrication.
This page combines the device's exact ordering information, package characteristics, verified drop-in alternatives, application guidance, and design considerations. It also distinguishes true same-footprint options from superficially similar Spartan-6 devices that cannot replace the target without changing temperature grade, speed grade, logic density, or package.
드롭인 대체품: XC6SLX16-3CPG196I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC6SLX16-3CPG196I (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Process Technology, Speed Grade, User I/O Count.
XC6SLX16-2CPG196I
✅ 드롭인✓ 재고 있음
$95.1563 / 개
데이터시트 보기 →XC6SLX16-L1CPG196I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX16-3CPG196I 최대 정격 & 전기적 특성
| Device Type | Field-Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 14,579 cells |
| User I/O Count | 106 I/O |
| Internal Frequency | 667 MHz |
| Speed Grade | -3 performance grade |
| Process Technology | 45 nm |
| 패키지 | 196-TFBGA, CSBGA |
| Package Body Size | 19 x 19 mm |
| Ball Pitch | 0.80 mm |
| Total Terminals | 196 balls |
| 실장 유형 | Surface Mount |
| Lead-Free Construction | Lead-free package |
| 동작 온도 | 0°C to 85°C |
| Junction Temperature | -40°C to 100°C |
| Terminal Type | Ball |
| Package Shape | Square |
XC6SLX16-3CPG196I square 핀 구성 가이드
XC6SLX16-3CPG196I(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC6SLX16-3CPG196I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC6SLX16-3CPG196I 적합 용도: 6 애플리케이션s: Industrial Automation Controllers, Motor and Motion Control, Data Acquisition and Instrumentation, Embedded Communication Interfaces, Embedded Signal Processing, Compact Control Boards.
Industrial Automation Controllers
The XC6SLX16-3CPG196I fits industrial automation controllers that combine parallel control logic, machine interfaces, and timing-sensitive sequencing. Its 14,579 logic cells provide implementation capacity for control state machines and protocol logic, while 106 I/O allow direct connection to sensors, actuators, counters, and field-bus transceivers. The -3 speed grade is useful when control paths require maximum Spartan-6 LX performance or when a lower-grade timing closure is unsuccessful. In the 196-ball TFBGA package, the device supports compact board construction, although careful decoupling, BGA layout, and thermal design remain essential for reliable factory-floor operation.
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Motor and Motion Control
The XC6SLX16-3CPG196I is appropriate for motor-drive and motion-control subsystems requiring deterministic parallel logic and numerous peripheral connections. The FPGA can coordinate encoder inputs, current or position comparisons, timing sequences, and supervisory control within one programmable device. Its 106 I/O provide more interface capacity than a small microcontroller, while the listed 667 MHz internal frequency supports clocked control architectures. The -3 grade should be considered for demanding timing paths. Board designers must use clean power rails, protected I/O, appropriate clock routing, and a compact BGA-aware thermal strategy.
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Data Acquisition and Instrumentation
The XC6SLX16-3CPG196I suits modular data-acquisition and test-instrument front ends where multiple digital channels must be sampled, filtered, and transferred coherently. Programmable logic can implement parallel capture pipelines, trigger logic, counters, and interface state machines, while 106 I/O support external converters, sensors, memory, and communication devices. The 14,579-cell Spartan-6 LX device offers more implementation flexibility than fixed-function logic. The -3 speed grade can help maximize throughput in wide or deeply pipelined designs. Layout should separate sensitive analog and digital regions while providing low-impedance power and return paths.
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Embedded Communication Interfaces
The XC6SLX16-3CPG196I can implement custom communication bridges, protocol converters, and embedded serial interfaces in a single Spartan-6 LX device. Parallel datapaths, transmit and receive state machines, packet processing, and FIFO control can be placed in the 14,579 available logic cells, with 106 I/O connecting to transceivers and other system components. The -3 grade is advantageous for demanding line rates or parallel processing, while the compact 196-ball package supports space-constrained control boards. Timing closure should use conservative clock constraints, and high-speed interfaces require controlled impedance routing and minimized crosstalk.
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Embedded Signal Processing
The XC6SLX16-3CPG196I is suitable for parallel signal-processing front ends that require programmable filters, correlation, waveform analysis, or fixed-point arithmetic. The Spartan-6 LX architecture includes programmable logic, memory, and DSP resources, allowing multiple processing paths to operate concurrently under clocked control. The listed 667 MHz internal frequency and -3 performance grade support demanding synchronous pipelines, while 106 I/O allow direct interfacing with converters and external memory. Engineers should map DSP and memory resources deliberately, verify timing with realistic constraints, and account for power growth as additional pipelines and logic paths are activated.
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Compact Control Boards
The XC6SLX16-3CPG196I fits compact embedded control boards that need substantial programmable logic in a small surface-mount footprint. Its 196-ball TFBGA package occupies a 19 x 19 mm body with a 0.80 mm ball pitch, allowing dense routing to external memory, transceivers, and connectors. The device provides 106 I/O and a high-performance -3 speed grade for demanding control tasks. Achieving reliable operation depends on four-layer or denser board construction as appropriate, carefully assigned BGA breakout or via-in-pad strategies, local supply bypassing, and thermal paths that remove heat from the package.
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추천 제품 요약
엔지니어링 참조 데이터: XC6SLX16-3CPG196I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC6SLX16-2CPG196I | XC6SLX16-L1CPG196I |
|---|---|---|---|
| Package | 196-TFBGA, CSBGA | 196-TFBGA, CSBGA - same | 196-TFBGA, CSBGA - same |
| Brand | AMD | AMD | AMD |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -3 performance grade | -2 speed grade | L1 low-power speed grade |
| Logic Cells | 14,579 cells | 14,579 cells | 14,579 cells |
| User I/O Count | 106 I/O | 106 I/O | 106 I/O |
| Process Technology | 45 nm | 45 nm | 45 nm |
| Body Size | 19 x 19 mm | 19 x 19 mm | 19 x 19 mm |
| Ball Pitch | 0.80 mm | 0.80 mm | 0.80 mm |
주요 차별점
- Highest-performance Spartan-6 LX speed option in the documented comparison (vs XC6SLX16-2CPG196I)
- Performance retained without changing the CPG196 footprint (vs XC6SLX16-2CPG196I)
- Distinct speed-versus-power choice for the same Spartan-6 LX resource configuration (vs XC6SLX16-L1CPG196I)
설계 노트
The 196-ball TFBGA has a 0.80 mm pitch, so its PCB footprint must match the manufacturer package drawing exactly. Assign power and ground balls according to the recommended decoupling network, route high-speed signals with controlled impedance, and provide an escape strategy for BGA inspection. Avoid placing sensitive analog inputs beside fast digital switching paths, and preserve continuous return planes beneath signal-routing regions.
Place supply capacitors close to the device's supply balls and connect each capacitor's ground return directly to an adjacent ground plane or via. Validate every supply rail against the manufacturer voltage limits, sequencing requirements, and power-source impedance. Because the -3 speed grade can consume more power than lower grades, include thermal margin for the highest expected logic activity rather than estimating from an idle configuration.
The compact 19 x 19 mm BGA can concentrate heat around the package center, so board construction should provide a continuous thermal path beneath and through the device as recommended by AMD. Use appropriate copper planes or thermal vias, account for the enclosure's heat-transfer conditions, and verify the operating junction-temperature limit in the final assembly. Estimated junction temperature should be calculated from actual power dissipation and the assembled PCB thermal resistance.
Do not treat a same-package ordering code as automatically equivalent. XC6SLX16-2CPG196I and XC6SLX16-L1CPG196I retain the CPG196 footprint but use different speed grades from the -3 device. Review timing constraints, clock assumptions, power, temperature requirements, and configuration compatibility before substitution. Also confirm that the programmed bitstream and any stored configuration mechanism remain valid for the selected device.
규정 준수 정보
The 196-TFBGA package is identified as lead-free. Specific RoHS, REACH, halogen-free, conflict-minerals, and automotive qualification declarations are not stated for the exact ordering code.
