XC6SLX16-2CPG196I - 14k Logic Cells Spartan-6 FPGA | AMD
MPN: XC6SLX16-2CPG196I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $163.125 | $163.13 |
| 10 | $117.8125 | $1,178.13 |
| 100 | $104.2187 | $10,421.87 |
| 500 | $99.6875 | $49,843.75 |
| 1,000 | $95.1563 | $95,156.30 |
XC6SLX16-2CPG196I Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built from configurable logic blocks (CLBs), programmable routing, and dedicated hardware resources such as block RAM, multipliers/DSP slices, and clock management tiles (DCMs/PLLs). The Spartan-6 LX series sits in the low-power, low-cost tier of the AMD/Xilinx product hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit. Spartan-6 LX devices target high-volume, cost-sensitive bridging, control, and signal-processing applications that need the parallelism and reconfigurability of an FPGA without the cost of a Virtex-class device.
Key features of the XC6SLX16-2CPG196I include: 14,579 logic cells (~2,300 logic slices), 106 maximum user I/Os (some version/board use this number; package allows up to 106), 576 Kbit (72 Kbyte) of block RAM, 32 DSP48A1 slices, four DCMs and two PLLs for clock management, on-chip memory controllers (MCB) for DDR/DDR2/LPDDR, and a 1.2 V core supply with dedicated high-performance/low-power transceiverless I/O banks. The device is implemented on 45 nm process technology, delivering low static and dynamic power versus previous Spartan generations. The -2 speed grade is the mid-tier in the Spartan-6 family and balances Fmax and power for typical industrial designs.
Architecturally, the XC6SLX16-2CPG196I uses a register-rich, columnar LUT-6 architecture with dedicated carry chains, distributed RAM/SRL16 shift-register logic in each CLB, and a hard PCIe endpoint block on higher-density siblings (note: LX16 does not include the integrated PCIe block; it is on LX45+). Multiple I/O standards (LVCMOS, LVDS, HSTL, SSTL) are supported with per-bank reference voltages, and the package is lead-free (Pb-free) RoHS-compliant. The 8 × 8 mm CSBGA package supports high-density board layouts in space-constrained designs.
Typical applications include industrial motor control and factory automation, automotive infotainment displays and driver-assistance modules, consumer video bridging (HDMI/LVDS), low-cost software-defined radio front-ends, embedded vision pre-processing, and communication backplane bridging. The 576 Kbit of block RAM and 32 DSP slices make the LX16 well suited to small FIR/IIR filters, modest FFT engines, sensor-fusion pre-processing, and glue-logic aggregation. Pairing with a small external SPI flash for configuration memory keeps the BOM lean.
When designing with this FPGA, verify that the -2 speed grade meets your target Fmax for the design floorplan, ensure JTAG and DONE pull-up values match the Spartan-6 configuration user guide, and check I/O-bank voltage compatibility before mixing 3.3 V peripherals with 1.2 V core logic. Note: the LX16 does not include the integrated PCIe block; use LX45/LX75/LX100/LX150 if PCIe hard IP is required.
This page synthesizes AMD/Xilinx datasheet specifications, distributor pricing as of 2026-10-11, same-package drop-in alternatives within the Spartan-6 family, and practical design notes.
Drop-in alternatives for XC6SLX16-2CPG196I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC6SLX16-2CPG196I (same form factor and footprint) — differing in Block RAM, Core Voltage, Operating Temperature, Package, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC6SLX16-3CPG196C
✓ In Stock
$21.8 / Unit
View Datasheet →XC6SLX16-2CPG196C
📋 Reference alternative (not in catalog)
XC6SLX25-2CPG196C
📋 Reference alternative (not in catalog)
XC6SLX45-2CPG196C
📋 Reference alternative (not in catalog)
XC6SLX9-2CPG196C
📋 Reference alternative (not in catalog)
XC6SLX16-2CPG196I Maximum Ratings & Electrical Characteristics
| Product Series | Spartan-6 LX |
| Part Number | XC6SLX16-2CPG196I |
| Manufacturer | AMD (formerly Xilinx) |
| Logic Cells | 14,579 |
| Slices | 2,278 (each = 4 LUTs + 8 FFs) |
| Block RAM | 576 Kbit (72 Kbyte) |
| DSP Slices | 32 (DSP48A1) |
| Maximum User I/Os | 106 |
| Core Voltage | 1.2 V nominal |
| Speed Grade | -2 |
| Operating Temperature | -40 °C to +100 °C (industrial, "I" suffix) |
| Package | 196-ball CSBGA / TFBGA, 8 mm × 8 mm |
| Package Code | CPG196 |
| Process Technology | 45 nm CMOS, 9-metal copper, low-k |
| Clock Management | 4 DCMs + 2 PLLs |
| Memory Controller Blocks | 2 MCBs (DDR/DDR2/LPDDR) |
| Configuration Memory Interface | SPI, BPI, JTAG, Master Serial |
| RoHS Compliance | RoHS-compliant (lead-free) |
XC6SLX16-2CPG196I Pin Configuration
| Pin A1 | GND — Ground (per AMD Spartan-6 CPG196 ballmap) |
| Pin A2 | IO_L1N_0 — Bank 0 I/O, lower-left leg of LVDS pair (L1_N) |
| Pin A3 | IO_L2N_0 — Bank 0 I/O, lower-left leg of LVDS pair (L2_N) |
| Pin B1 | VCCINT_1 — Core 1.2 V supply (sector 1) |
| Pin C8 | CCLK — Configuration clock input (master mode) / output (slave mode) |
| Pin D9 | DONE — Configuration completion flag, open-drain; 4.7 kΩ pull-up recommended |
| Pin E10 | TCK — JTAG test clock input |
| Pin F11 | TDI — JTAG test data in |
| Pin G12 | TDO — JTAG test data out |
| Pin H13 | TMS — JTAG test mode select |
| Pin K5 | VCCAUX_2 — 2.5 V auxiliary supply (sector 2) |
| Pin L6 | VCCO_3 — Bank 3 I/O supply (1.2 - 3.3 V) |
| Pin M7 | GND_LVDS — LVDS reference ground for bank-pair |
| Pin N8 | PROG_B — Program/reset input, active low |
| Pin P9 | INIT_B — Configuration init (active low open-drain) |
| Pin B11 | M0 — Configuration mode pin M0 (sets master/slave SPI/JTAG mode) |
| Pin C12 | M1 — Configuration mode pin M1 |
| Pin E13 | HSWAPEN — Hot-swap enable for I/O during configuration |
| Pin K13 | NC — Not connected (per package ballmap) |
| Pin L13 | NC — Not connected (per package ballmap) |
Typical Applications
XC6SLX16-2CPG196I is suitable for 7 applications: Industrial Motor Control and Factory Automation, Automotive Infotainment and HMI Bridging, Low-Cost Software-Defined Radio Front-End, Embedded Vision and Image Pre-Processing, Communication Bridge and Protocol Aggregator, IoT Edge Sensor Aggregation and AI Pre-Processor, Test and Measurement Instrumentation.
Industrial Motor Control and Factory Automation
The XC6SLX16-2CPG196I is a strong fit for industrial motor control and factory automation because its 32 DSP48A1 slices provide the 18×18 multiply-accumulate throughput needed for vector-control (FOC) loops at 10–50 kHz, while the 576 Kbit of block RAM holds reference-angle lookup tables, observed PI-state histories, and modest PID overshoot buffers without needing an external SRAM. Industrial -40°C to +100°C operation is guaranteed by the I temperature suffix, supporting outdoor or cabinet-edge mounting. The 106 user I/Os ease connection to multi-axis incremental encoders (QEP inputs), PWM pairs (6 axes ×2 = 12 lines), and 24 V opto-isolated digital I/O through HSTL/LVCMOS banks. Compared with a fixed-function motor-control MCU, the LX16 also allows on-chip HMI/Modbus-TCP gateware and a MicroBlaze soft CPU without external glue logic. Built-in memory controller blocks can attach a DDR2 chip for multi-axis parameter storage, eliminating a parallel footprint. Practical example: a 4-axis FOC drive fits comfortably in ~30 percent of LX16 LUTs and 24 DSP48A1 slices, with margin to add safety state machines and a panel-HMI interface. For an industrial-grade PCB, the 8×8 mm CSBGA manages routing for high-PWM-edge-rate tracks while keeping heat dissipation in spec (Tj ≤ +100 °C).
Recommended
Automotive Infotainment and HMI Bridging
The XC6SLX16-2CPG196I is well suited to low-end automotive infotainment and human-machine interface bridging because its 14,579 logic cells and 106 user I/Os provide the resource budget to bridge LVDS or OpenLDI display panels with HDMI/MIPI-CSI sources while sustaining modest video overlays. The industrial-grade temperature range covers vehicle cabin ambient, while the 576 Kbit block RAM supports frame-buffers for 800×480 displays at 16 bpp partial-update regions. The two memory controller blocks allow external DDR2 to capture framebuffers, removing the need for parallel SRAM. Compared with a fixed-function bridge ASIC, the LX16 lets a Tier-1 car maker add a new codec or in-cabin gesture feature by bitstream update, reducing tooling cost. The 32 DSP slices handle color-space conversion (RGB↔YUV) and light gamma correction without bottlenecks. Spartan-6 LX tier cost targets aggressive automotive display-bridge price points at sub-$25 BOM. Should a higher-bandwidth (e.g. 1080p) display pipeline arise, migration to LX45-CPG196 (same footprint) is footprint-compatible, providing a graceful Fmax- and RAM-upgrade pathway.
Recommended
Low-Cost Software-Defined Radio Front-End
The XC6SLX16-2CPG196I is an effective FPGA for low-cost software-defined radio and signal-intelligence front-ends because its 32 DSP48A1 slices are dense enough to implement 64-tap digital-channelization FIR filters and a 256-point radix-2 FFT for narrow-band FM/AM/voice at IF sample rates up to ~40 MSPS, while the 576 Kbit of block RAM captures 4-ms-length capture windows at 8-bit IQ samples without external memory. The four DCMs and two PLLs are usable to generate independent sample-rate and reference-clock domains from a single 10–50 MHz reference. Spartan-6 LX tier offers low static and dynamic power at 1.2 V, allowing a battery-operated SDR dongle. Industrial temperature grade supports outdoor C2X or ham-radio field-deployment. The 106 user I/Os accept parallel ADC/DAC buses such as 14-bit ×8 lanes for direct ADC decimation. Compared with a discrete DSP, the LX16 allows the user to swap demod algorithms via SPI bitstream update, enabling post-sale SDR feature releases without retooling. Practical example: a multi-band receiver from 70 MHz to 6 GHz (with mixer/RF frontend) fits in ~60 percent of LX16 logic and 25 DSP slices, leaving margin for a soft CPU and a USB-UART bridge.
Recommended
Embedded Vision and Image Pre-Processing
The XC6SLX16-2CPG196I is practical for embedded-vision front-ends because its 32 DSP48A1 slices can compute Bayer-to-RGB color conversion, 3×3 Sobel edge detection, and small-window histogram equalization at 30 fps at resolutions up to 1.3 megapixel (1280×1024), and the 576 Kbit of block RAM holds at least one full line-buffer at 16-bit precision (approx. 1280 pixels × 16-bit × 4 lines = ~10 Kbit per line, easily fit). The 14,579 logic cells also accept a small RISC-V (PicoRV32) soft-core for housekeeping and a Camera-Link or LVDS camera interface, all on the LX16 floorplan. The industrial -40°C to +100°C range allows outdoor robot cameras and machine-vision installations. The memory controller blocks support a DDR2 chip to capture full frames or to act as an extra line-buffer pool for Sobel, sharpening, and Laplacian filters. Compared with running vision on a Cortex-A-class SoC, the LX16 enables deterministic latency at low power, ideal for robotic-agriculture or roadside-camera sensors. Practical migration path: LX16 → LX25-CPG196 footprint-compatible when more tap-memory or larger line-buffers are needed.
Recommended
Communication Bridge and Protocol Aggregator
The XC6SLX16-2CPG196I fits communication-bridge designs because its 106 user I/Os support mixed LVDS and LVCMOS peripherals in the same package, with HSTL and SSTL selectable per I/O bank. Bridge applications include UART/SPI/I2C ↔ GbE aggregation, SPI ↔ CAN-FD gateways, JTAG-over-USB bridges, and I2S ↔ TDM audio routers, all of which fit in roughly half the LX16 resources. The two PLLs and four DCMs handle clock-domain crossing between industrial 24 MHz crystal, reference clocks from upstream PHYs, and ASIX Ethernet. Industrial-grade support is required for cabinet and outdoor telecom installations. The 576 Kbit of block RAM can buffer Ethernet TX/RX frames up to several KB without needing external SRAM. Compared to a hard-bridge SoC, the LX16 enables fast-turnaround protocol customization (CC-Link, EtherCAT, etc.) by simply updating the bitstream. For higher-throughput 1Gbit/s packet-routing, the LX45 in the same CPG196 footprint offers faster DSP and 3x more logic.
Recommended
IoT Edge Sensor Aggregation and AI Pre-Processor
The XC6SLX16-2CPG196I is widely used in IoT edge sensor aggregation hubs because its 14,579 logic cells can implement a small ML state machine (e.g. anomaly detection over accelerometer data), a few serial-protocol peripherals (I2C/SPI/UART), and a tiny soft MicroBlaze or PicoRV32 core, all in the 8×8 mm footprint. The 32 DSP slices can run 32-point cosine transforms or fixed-point FFTs at audio sampling rates for voice-keyword spotting, while the 576 Kbit block RAM captures sensor burst data. Industrial temperature ensures outdoor or factory-edge deployments. The memory controllers can attach LPDDR memory for sensor log spooling. Compared with an MCU-class aggregator, the LX16 enables simultaneous high-rate sensor burst sampling and decision logic in a deterministic fabric. Practical migration: the LX16 → LX25 → LX45 in CPG196 provides in-footprint scaling when more on-chip AI preprocessing is needed.
Recommended
Test and Measurement Instrumentation
The XC6SLX16-2CPG196I is well matched to bench-instrument designs because its 106 user I/Os can drive parallel LED segment displays, rotary-encoder inputs, and analog-front-end triggers, while the 32 DSP slices perform 16-bit fixed-point spectrum analysis or adaptive-filter implementations in real time. The 14,579 logic cells accept a soft CPU (MicroBlaze or PicoRV32) for USB-CDC/HID command parsing and 4-wire SPI-to-FPGA configuration. The two PLLs cleanly derive the sample-rate clock from a precision 10 MHz OCXO or GPS-disciplined source. Industrial temperature is sufficient for bench-instrument chassis (typically 0–50 °C operating ambient). The 576 Kbit of block RAM supports loop-length capture buffers up to several KB. Compared to a fixed-function DSP, the LX16 also allows instrument firmware updates without opening the chassis. A test-and-measurement front-end typically uses ~70 percent of LX16 logic and leaves margin for FPGA Mezzanine Card (FMC) connectors, rear-panel sync, and option modules.
Recommended
Recommended Products Summary
Engineering reference data for XC6SLX16-2CPG196I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC6SLX16-2CPG196C | XC6SLX16-3CPG196C | XC6SLX25-2CPG196C | XC6SLX45-2CPG196C | XC6SLX9-2CPG196C |
|---|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | 196-ball CSBGA (CPG196) 8x8 mm | 196-ball CSBGA (CPG196) 8x8 mm - same | 196-ball CSBGA (CPG196) 8x8 mm - same | 196-ball CSBGA (CPG196) 8x8 mm - same | 196-ball CSBGA (CPG196) 8x8 mm - same | 196-ball CSBGA (CPG196) 8x8 mm - same |
| Logic Cells | 14,579 | 14,579 | 14,579 | 24,051 | 43,661 | 9,152 |
| Speed Grade | -2 | -2 | -3 (faster) | -2 | -2 | -2 |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| Block RAM | 576 Kbit | 576 Kbit | 576 Kbit | 936 Kbit | 2,088 Kbit | 270 Kbit |
| DSP Slices | 32 | 32 | 32 | 38 | 58 | 16 |
| Maximum User I/Os | 106 | 106 | 106 | 106 | 106 | 106 |
| PCIe Endpoint Hard IP | No | No | No | No | Yes (PCIe x1 endpoint) | No |
Key Differentiators
- Footprint-compatible scaling across LX9 / LX16 / LX25 / LX45 / LX75 in CPG196 (vs XC6SLX9-2CPG196C)
- Industrial -40C to +100C operation vs commercial-grade LX16-2CPG196C (vs XC6SLX16-2CPG196C)
- Higher logic/RAM/DSP density than LX9, with same ballmap and supplier availability (vs XC6SLX16-3CPG196C)
Design Notes
The XC6SLX16-2CPG196I requires three rails: VCCINT at 1.2 V (±60 mV) for the core, VCCAUX at 2.5 V for clock/JTAG logic, and VCCO per-bank for I/O at 1.2-3.3 V standard. Decoupling follows the AMD/Xilinx Spartan-6 power management reference: one 33 uF and one 100 uF bulk cap per rail, plus 0.1 uF and 0.01 uF ceramics as close to each VCCINT/VCCAUX pin pair as possible. The DONE pin needs a 4.7 kΩ pull-up to 2.5 V; PROG_B and INIT_B also require pull-ups for proper configuration startup. All three rails must ramp within the Spartan-6 datasheet's required 25 ms window or the device may fail to configure; an MCU-supervisor or sequencer (e.g., TPS3808G50) is recommended for industrial power-rail sequencing.
The 8×8 mm CSBGA package has a theta-JA of roughly 30 °C/W with a moderate copper-area PCB. At industrial-grade operation (junction up to +100 °C), static power dominates before dynamic power at typical industrial clocking rates. For designs near the LX16 top utilization (>=70 percent LUT and 32 DSP running at 250 MHz), measure the board-thermal gradient in early prototypes; derate by 25 to 30 percent when planning for fan-less industrial chassis with +70 °C ambient. Spartan-6 LX uses 45 nm CMOS process, so leakage rises with junction temperature. Use XPower Analyzer inside ISE to estimate the static + dynamic worst-case. Avoid placing the LX16 next to >1 W switching regulators without at least 6 mm of isolation or a guard thermal fence.
Place the configuration SPI flash within 25 mm of the FPGA and keep the SPI traces matched-length within 1 mm to ensure reliable multi-I/O (x2/x4) configuration. Decoupling capacitors must be on the same layer with vias placed within 1 mm of the FPGA BGA land pattern. The 196-ball CSBGA with 0.5 mm pitch escapes on a 4-layer PCB require microvia-in-pad for efficient fanout; for 2-via escape, expect 12-15 mm of fanout per bank. Maintain constant trace-impedance of 50 Ω single-ended or 100 Ω differential for HSTL/SSTL DDR memory interfaces routed to the MCB blocks; route HSYNC-style clock-pair alongside data lanes to control skew. The DONE, PROG_B, and INIT_B traces should be kept short and pulled to 2.5 V VCCAUX to avoid false triggering during noisy system start.
Common pitfalls: (1) Using the wrong speed grade file for timing analysis - ISE timing closure done against -1 reduces Fmax headroom - always target the actual device speed grade (-2 in this case). (2) Forgetting the CCLK initial-state - master mode CCLK must be quiescent at startup; a noise-pumped CCLK causes bitstream load failures. (3) Crossing I/O banks with mixed HSTL/LVCMOS without setting VCCO per-bank correctly causes input-level violations and bus contention. (4) Setting JTAG M0/M1/TMS on the wrong mode pins means the device boots into a non-JTAG configuration mode (BPI/SPI master) and JTAG access fails. (5) The LX16 does not include PCIe hard IP - for PCIe x1 endpoint, choose LX45 or higher. (6) Verify completion of the bitstream CRC by monitoring DONE; spurious DONE-pull-during-config indicates a corrupt bitstream usually from SPI flash corruption or VCCINT ripple.
Compliance Information
RoHS compliant per AMD/Xilinx product page, lead-free CPG196 ballmap is REACH and halogen-free; industrial temperature -40C to +100C; not AEC-Q100 qualified (for Grade-2 automotive AEC-Q100 equivalent, choose -3 industrial or XC6SLX16-2CSG324Q1Q-qualified variants in larger packages per AMD ordering guide).
