AMD

XC7A200T-1FBG676I - 740K Logic Cells FPGA | AMD Xilinx | FBG676

Name: XC7A200T-1FBG676I
Brand: AMD
Price: 390 USD
Availability: InStock

부품 번호: XC7A200T-1FBG676I ✓ 활성

재고 있음 영업일 기준 1~3일 내 발송

1.0 V Vdss FCBGA-676 (FBG676) Package -1 Speed

시작가 $390 USD / 개

MOQ: 1 |

가격 업데이트: 2026-08-05

볼륨 가격

수량	단가	합계
1	$495	$495.00
10	$465	$4,650.00
100	$435	$43,500.00
500	$410	$205,000.00
1,000	$390	$390,000.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

XC7A200T-1FBG676I 개요

The AMD Xilinx XC7A200T-1FBG676I is a high-performance Artix-7 family FPGA delivering 740K logic cells, 215,360 logic slices, and 13,140 Kb of Block RAM in a 676-ball FCBGA (FBG676) package. It operates with a core voltage of 1.0V and supports I/O standards up to 3.3V, making it suitable for a wide range of high-speed digital designs. Data verified as of 2026-08-05.

An FPGA (Field-Programmable Gate Array) is an integrated circuit that can be configured by the designer after manufacturing, offering reconfigurable logic blocks and programmable interconnects. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are a subset of digital integrated circuits. They provide a flexible alternative to ASICs, enabling rapid prototyping and hardware acceleration without the high NRE costs of custom silicon.

Key features include 740K logic cells, 365 DSP48E1 slices, 10.5 Mb of distributed RAM, and 13,140 Kb of Block RAM. The device supports up to 400 I/O pins with SelectIO technology, offering programmable I/O standards and speeds. It also includes integrated PCIe blocks, Gigabit Transceivers (GTX) for high-speed serial communication, and a XADC for analog-to-digital conversion, providing a comprehensive platform for complex digital systems.

The Artix-7 architecture is built on a 28nm high-k metal gate (HKMG) process, balancing performance and power efficiency. The device features a configurable logic block (CLB) structure with 6-input LUTs, dedicated carry chains, and flip-flops, enabling efficient implementation of complex logic functions. The DSP48E1 slices support high-speed arithmetic operations, while the Block RAM provides on-chip storage for data buffering and FIFO implementations.

Typical applications include software-defined radio (SDR), medical imaging, industrial motor control, and high-performance computing acceleration. The high logic density and DSP resources make it ideal for signal processing tasks, while the transceivers enable high-speed data communication in networking and broadcast equipment.

When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) with proper sequencing, and the 676-ball BGA package demands a multi-layer PCB with adequate thermal vias for heat dissipation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the AMD datasheet.

드롭인 대체품: XC7A200T-1FBG676I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

XC7A200T-2FBG676I

AMD

Artix-7 · 16825 · 215360 · 13455360 · 400 · 676-FCBGA (27x27) · -40°C to 100°C (TJ) · SMD (SMT)

✓ 재고 있음

$100 / 개

데이터시트 보기 →

XC7A200T-1FBG676C

Commercial temperature grade (0C to +85C), same package and pinout

📋 참조 대체품 (카탈로그에 없음)

XC7A200T-1FBG676I 최대 정격 & 전기적 특성

Family	Artix-7
Logic Cells	740K
Logic Slices	215,360
Block RAM	13,140 Kb
Distributed RAM	10.5 Mb
DSP48E1 Slices	365
Maximum I/O Pins	400
Core Voltage (VCCINT)	1.0 V
I/O Voltage (VCCO)	1.2 V to 3.3 V
패키지	FCBGA-676 (FBG676)
동작 온도	-40C to +100C (I grade)
Speed Grade	-1
GTX Transceivers	16
PCIe Blocks	1
XADC Blocks	1
RoHS 상태	Compliant

XC7A200T-1FBG676I 핀 구성

핀 A1	IO_L1P_T0 — User I/O differential pair P
핀 A2	IO_L1N_T0 — User I/O differential pair N
핀 B1	IO_L2P_T0 — User I/O differential pair P
핀 B2	IO_L2N_T0 — User I/O differential pair N
핀 C1	VCCINT — Core voltage 1.0V
핀 C2	GND — Ground
핀 D1	IO_L3P_T0 — User I/O differential pair P
핀 D2	IO_L3N_T0 — User I/O differential pair N
핀 E1	VCCAUX — Auxiliary voltage 1.8V
핀 E2	GND — Ground
핀 F1	IO_L4P_T0 — User I/O differential pair P
핀 F2	IO_L4N_T0 — User I/O differential pair N

일반적인 애플리케이션

XC7A200T-1FBG676I 적합 용도: 6 애플리케이션s: Software-Defined Radio (SDR), Medical Imaging, Industrial Motor Control, High-Performance Computing Acceleration, Broadcast Video Processing, Aerospace and Defense.

📡

Software-Defined Radio (SDR)

The XC7A200T-1FBG676I is ideal for SDR platforms due to its high logic density and DSP resources. With 365 DSP48E1 slices, it can implement complex modulation/demodulation algorithms, channel filters, and FFT engines. The 16 GTX transceivers provide high-speed serial interfaces to connect to ADCs and DACs, enabling wideband signal processing. The XADC block allows on-chip monitoring of signal levels and temperature, enhancing system reliability. In a typical SDR, the FPGA handles baseband processing, digital up/down conversion, and protocol stack implementation, offloading the host processor. The industrial temperature grade ensures operation in field-deployed environments.

추천

AD9361 (RF transceiver for SDR front-end) ADS54J60 (High-speed ADC for digitizing IF signals)

💊

Medical Imaging

The XC7A200T-1FBG676I is well-suited for medical imaging systems such as ultrasound and CT scanners, where high-speed signal processing and data throughput are critical. Its 740K logic cells enable implementation of image reconstruction algorithms, filtering, and beamforming. The 13,140 Kb of Block RAM provides ample storage for image frames and intermediate data. The 400 I/O pins interface with sensor arrays and memory devices, while the GTX transceivers can stream processed images to display systems. The industrial temperature grade ensures reliable operation in clinical environments. The FPGA's reconfigurability allows for algorithm updates without hardware changes, extending product lifespan.

추천

AD9273 (Octal LNA/VGA/ADC for ultrasound) DDR3 SDRAM (External memory for image buffering)

🏭

Industrial Motor Control

The XC7A200T-1FBG676I excels in industrial motor control applications, providing high-performance processing for field-oriented control (FOC) algorithms. Its 365 DSP48E1 slices handle the complex mathematical operations required for real-time current and speed control loops. The FPGA's deterministic timing ensures precise PWM generation for inverter stages, reducing torque ripple and improving efficiency. With 400 I/O pins, it can interface with encoders, current sensors, and gate drivers. The industrial temperature grade (-40C to +100C) makes it suitable for factory floor environments. The reconfigurable nature allows for customization of control algorithms for different motor types and power ratings.

추천

IR2110 (Gate driver for IGBT/MOSFET) ADS1202 (Current sensing ADC)

🖥️

High-Performance Computing Acceleration

The XC7A200T-1FBG676I can accelerate compute-intensive workloads in data centers and scientific computing. Its 740K logic cells and 365 DSP slices enable implementation of custom arithmetic units, such as FFTs, matrix multipliers, and cryptographic engines. The 16 GTX transceivers provide high-bandwidth connectivity to host processors or other FPGAs, enabling scalable acceleration platforms. The Block RAM and distributed RAM offer on-chip data storage, reducing memory latency. The FPGA's parallel processing capability delivers significant speedups over CPU-only implementations for specific algorithms. The industrial temperature grade ensures reliable operation in server environments.

추천

PCIe Switch (PCIe interconnect for host communication) DDR4 SDRAM (External memory for large datasets)

📺

Broadcast Video Processing

The XC7A200T-1FBG676I is used in broadcast video equipment for real-time processing of high-definition video streams. Its high logic density supports video codecs, scaling, color space conversion, and frame rate conversion. The 13,140 Kb of Block RAM is sufficient for line buffers and frame storage. The GTX transceivers can handle SDI (Serial Digital Interface) signals at 3G/6G/12G rates, enabling direct connection to broadcast infrastructure. The 400 I/O pins interface with video codec chips and external memory. The industrial temperature grade ensures reliable operation in broadcast facilities. The FPGA's reconfigurability allows for support of evolving video standards.

추천

LMH1983 (Video clock generator) SDI PHY (SDI physical layer interface)

✈️

Aerospace and Defense

The XC7A200T-1FBG676I is suitable for aerospace and defense applications such as radar, electronic warfare, and secure communications. Its industrial temperature grade and high reliability make it suitable for harsh environments. The 365 DSP slices enable advanced signal processing for radar pulse compression and beamforming. The 16 GTX transceivers support high-speed data links for sensor fusion. The FPGA's reconfigurability allows for in-field updates of encryption algorithms and waveforms. The XADC block provides on-chip monitoring for health management. The device's high logic density supports complex system-on-chip designs, reducing board space and power.

추천

ADC12DJ3200 (High-speed ADC for radar) VITA 57.1 FMC (FPGA mezzanine card interface)

추천 제품 요약

AD9361 RF transceiver for SDR front-end 사용처: Software-Defined Radio (SDR) ADS54J60 High-speed ADC for digitizing IF signals 사용처: Software-Defined Radio (SDR) AD9273 Octal LNA/VGA/ADC for ultrasound 사용처: Medical Imaging DDR3 SDRAM External memory for image buffering 사용처: Medical Imaging IR2110 Gate driver for IGBT/MOSFET 사용처: Industrial Motor Control ADS1202 Current sensing ADC 사용처: Industrial Motor Control PCIe Switch PCIe interconnect for host communication 사용처: High-Performance Computing Acceleration DDR4 SDRAM External memory for large datasets 사용처: High-Performance Computing Acceleration LMH1983 Video clock generator 사용처: Broadcast Video Processing SDI PHY SDI physical layer interface 사용처: Broadcast Video Processing ADC12DJ3200 High-speed ADC for radar 사용처: Aerospace and Defense VITA 57.1 FMC FPGA mezzanine card interface 사용처: Aerospace and Defense

What is the logic capacity of XC7A200T-1FBG676I?

The XC7A200T-1FBG676I has 740K logic cells, 215,360 logic slices, and 13,140 Kb of Block RAM. According to the AMD Xilinx Artix-7 data sheet (DS181), this makes it one of the largest devices in the Artix-7 family, suitable for high-density logic designs.

What is the price of XC7A200T-1FBG676I?

As of 2026-08-05, the XC7A200T-1FBG676I is priced at approximately $495.00 for a single unit, with volume pricing dropping to $390.00 at 1000 units. Prices are based on distributor listings from DigiKey and Mouser and may vary with availability and market conditions.

Where can I buy XC7A200T-1FBG676I online?

The XC7A200T-1FBG676I can be purchased from authorized distributors such as DigiKey and Mouser Electronics. As of 2026-08-05, both distributors list the part as active and available for order. You can also source it directly from AMD Xilinx or through other franchised distributors.

What is the lead time for XC7A200T-1FBG676I?

The typical lead time for XC7A200T-1FBG676I is 12-16 weeks from authorized distributors, as of 2026-08-05. However, lead times can vary based on global supply chain conditions and order quantity. It is advisable to check current stock levels with distributors like DigiKey or Mouser for the most accurate lead time.

Is XC7A200T-1FBG676I in stock?

As of 2026-08-05, the XC7A200T-1FBG676I is listed as active and in stock at major distributors such as DigiKey and Mouser. However, stock levels fluctuate frequently, so it is recommended to check the distributor websites for real-time inventory status.

What is the difference between XC7A200T-1FBG676I and XC7A200T-2FBG676I?

The XC7A200T-1FBG676I has a speed grade of -1, while the XC7A200T-2FBG676I has a speed grade of -2. The -2 grade offers faster performance, typically 10-15% higher maximum clock frequencies, but consumes slightly more power. Both share the same logic capacity and package, making them drop-in replacements.

When should I choose XC7A200T-1FBG676I over XC7A200T-2FBG676I?

Choose the XC7A200T-1FBG676I when power consumption and cost are more critical than maximum performance. The -1 speed grade is sufficient for many applications and offers lower power dissipation. If your design requires the highest possible clock rates, the -2 grade is preferable, but it comes at a higher price and power cost.

What is the best drop-in replacement for XC7A200T-1FBG676I?

The best drop-in replacement for XC7A200T-1FBG676I is the XC7A200T-2FBG676I, which shares the same FBG676 package and pinout, offering a faster speed grade. Other drop-in options include the XC7A200T-1FBG676C (commercial temperature grade) and XC7A200T-1FBG676I (same part, different speed grade). All are pin-compatible and require no PCB changes.

Can XC7A200T-2FBG676I replace XC7A200T-1FBG676I?

Yes, the XC7A200T-2FBG676I can replace the XC7A200T-1FBG676I as it is a drop-in replacement with the same package and pinout. The -2 speed grade is faster, so it will meet or exceed the performance of the -1 grade. Ensure your design can handle the slightly higher power consumption of the -2 grade.

Where can I download the XC7A200T-1FBG676I datasheet PDF?

The XC7A200T-1FBG676I datasheet is available for download from the AMD Xilinx website at https://www.xilinx.com/support/documentation/data_sheets/ds181_Artix_7_Data_Sheet.pdf. This document contains full specifications, pinout, and electrical characteristics for the Artix-7 family, including the XC7A200T-1FBG676I.

Where can I find the XC7A200T-1FBG676I pinout?

The pinout for XC7A200T-1FBG676I is provided in the AMD Xilinx Artix-7 data sheet (DS181) and the package specification file. The FBG676 package has 676 balls with specific pin assignments for I/O, power, ground, and configuration. Refer to the pinout tables in the datasheet or use the Vivado design tools to generate a pinout report.

What is the operating temperature range of XC7A200T-1FBG676I?

The XC7A200T-1FBG676I has an industrial temperature grade, operating from -40C to +100C. This makes it suitable for harsh environments such as automotive, industrial, and military applications. The commercial grade variant (XC7A200T-1FBG676C) operates from 0C to +85C.

Does XC7A200T-1FBG676I support PCIe?

Yes, the XC7A200T-1FBG676I includes one integrated PCIe block that supports Gen2 x4 or Gen1 x8 configurations. This allows direct connection to a host processor without external PHY chips, simplifying system design for high-speed data transfer applications.

What is the power consumption of XC7A200T-1FBG676I?

The power consumption of XC7A200T-1FBG676I depends on the design utilization and clock frequencies. Typical power consumption ranges from 5W to 15W for moderate designs, but can be higher with heavy use of transceivers and DSP resources. Use the Xilinx Power Estimator (XPE) tool for accurate estimates based on your specific design.

Is XC7A200T-1FBG676I RoHS compliant?

Yes, the XC7A200T-1FBG676I is RoHS compliant, as indicated in the AMD Xilinx product documentation. It is lead-free and meets the requirements of the EU RoHS directive, making it suitable for use in products sold in the European Union.

What development tools support XC7A200T-1FBG676I?

The XC7A200T-1FBG676I is fully supported by AMD Xilinx Vivado Design Suite, which provides synthesis, implementation, and programming tools. Vivado includes IP cores, constraint files, and power analysis tools specifically for Artix-7 devices. The free Vivado HL WebPACK edition supports this device.

What is the difference between XC7A200T-1FBG676I and XC7A200T-1FBG676C?

The XC7A200T-1FBG676I is the industrial temperature grade (-40C to +100C), while the XC7A200T-1FBG676C is the commercial temperature grade (0C to +85C). Both share the same logic capacity, package, and pinout, but the industrial grade is more expensive and suitable for harsh environments.

Can XC7A200T-1FBG676I be used for software-defined radio?

Yes, the XC7A200T-1FBG676I is well-suited for software-defined radio (SDR) applications due to its high logic density, 365 DSP48E1 slices for digital signal processing, and 16 GTX transceivers for high-speed ADC/DAC interfaces. The XADC block also enables on-chip analog monitoring.

What is the maximum number of I/O pins on XC7A200T-1FBG676I?

The XC7A200T-1FBG676I supports up to 400 user I/O pins, configurable with various I/O standards including LVCMOS, LVDS, and HSTL. The FBG676 package provides 676 balls, with the remaining pins used for power, ground, and configuration functions.

엔지니어링 참조 데이터: XC7A200T-1FBG676I — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the XC7A200T-1FBG676I when you need a high-density FPGA with industrial temperature range and balanced performance. If you require higher clock speeds, select the XC7A200T-2FBG676I, but be prepared for higher power consumption and cost. For cost-sensitive applications in commercial environments, the XC7A200T-1FBG676C offers the same logic capacity at a lower price. All three parts share the same FBG676 package and pinout, allowing PCB layout reuse. The -1 speed grade is sufficient for most applications, while the -2 grade is recommended for designs with tight timing constraints. The industrial grade is essential for automotive, aerospace, and outdoor installations.

대체품과의 비교

파라미터	이 제품	XC7A200T-2FBG676I	XC7A200T-1FBG676C	XC7A200T-1FBG676I
Package	FCBGA-676 (FBG676)	FCBGA-676 (FBG676) - same	FCBGA-676 (FBG676) - same	FCBGA-676 (FBG676) - same
Speed Grade	-1	-2	-1	-1
Temperature Grade	Industrial (-40C to +100C)	Industrial (-40C to +100C)	Commercial (0C to +85C)	Industrial (-40C to +100C)
Logic Cells	740K	740K	740K	740K
Block RAM	13,140 Kb	13,140 Kb	13,140 Kb	13,140 Kb
DSP Slices	365	365	365	365
GTX Transceivers	16	16	16	16
Price (1 pc)	$495.00	$520.00	$450.00	$495.00

주요 차별점

Higher speed grade option (vs XC7A200T-1FBG676I)
Industrial temperature grade (vs XC7A200T-1FBG676C)
Identical part for redundancy (vs XC7A200T-1FBG676I)

설계 노트

The XC7A200T-1FBG676I requires multiple power rails: VCCINT at 1.0V, VCCAUX at 1.8V, and VCCO depending on I/O banks (1.2V to 3.3V). Use low-dropout regulators or DC-DC converters with adequate current capability. Decouple each rail with 100nF and 10uF capacitors placed close to the FPGA pins. Follow the power sequencing requirements in the datasheet to avoid damage.

The FBG676 package can dissipate significant heat under heavy utilization. Use a thermal analysis tool to estimate junction temperature. Ensure adequate airflow or attach a heatsink to the top of the package. Provide thermal vias under the package to conduct heat to the PCB ground plane. The maximum junction temperature is 125C for industrial grade.

For the 676-ball BGA, use a multi-layer PCB with at least 8 layers for signal routing and power planes. Follow the PCB design guidelines in UG483 (Artix-7 FPGA PCB Design Guide). Ensure proper pad size and solder mask openings for reliable soldering. Use Xilinx's pinout files to assign I/O pins to minimize routing congestion.