XC7A200T-2FBG676I - 740K Logic Cells FPGA | AMD Xilinx
MPN: XC7A200T-2FBG676I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1250 | $1,250.00 |
| 10 | $1180 | $11,800.00 |
| 100 | $1100 | $110,000.00 |
| 500 | $1050 | $525,000.00 |
| 1,000 | $990 | $990,000.00 |
Drop-in alternatives for XC7A200T-2FBG676I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7A200T-2FBG676C
β 99,999 In Stock
$550 / Unit
View Datasheet βXC7A200T-1FBG676I
π Reference alternative (not in catalog)
XC7A200T-3FBG676I
β 99,999 In Stock
$390 / Unit
View Datasheet βXC7A200T-2FBG676I Maximum Ratings & Electrical Characteristics
| Family | Artix-7 |
| Logic Cells | 740,000 |
| Logic Slices | 215,360 |
| Block RAM | 13,140 Kb |
| Distributed RAM | 10,500 Kb |
| DSP Slices | 740 |
| Transceivers | 16 (up to 6.6 Gb/s) |
| PCIe Blocks | 1 (Gen2 x4) |
| User I/O | 400 |
| I/O Standards | LVCMOS, LVDS, HSTL, SSTL |
| Core Voltage | 1.0V |
| Package | FCBGA-676 (FBG676) |
| Speed Grade | -2 |
| Operating Temperature | -40C to +100C (I grade) |
| Configuration | SRAM-based, supports partial reconfiguration |
XC7A200T-2FBG676I Pin Configuration
| Pin A1 | IO_L1P_T0 β User I/O (LVDS pair P) |
| Pin A2 | IO_L1N_T0 β User I/O (LVDS pair N) |
| Pin B1 | VCCINT β Core voltage 1.0V |
| Pin B2 | GND β Ground |
| Pin C1 | IO_L2P_T0 β User I/O |
| Pin C2 | IO_L2N_T0 β User I/O |
| Pin D1 | VCCAUX β Auxiliary voltage 1.8V |
| Pin D2 | GND β Ground |
| Pin E1 | IO_L3P_T0 β User I/O |
| Pin E2 | IO_L3N_T0 β User I/O |
| Pin F1 | VCCO β I/O bank voltage |
| Pin F2 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7A200T-2FBG676I is suitable for 6 applications: Software-Defined Radio (SDR), Medical Imaging, Industrial Motor Control, High-Performance Computing (HPC) Acceleration, Aerospace and Defense, Video and Image Processing.
Software-Defined Radio (SDR)
The XC7A200T-2FBG676I is ideal for SDR baseband processing due to its 740 DSP slices and 16 high-speed transceivers. In a typical SDR, the FPGA handles digital down/up conversion (DDC/DUC), filtering, and modulation/demodulation. The DSP slices implement FIR filters and FFTs efficiently, while the transceivers interface with RF front-ends via JESD204B or LVDS. The high logic density allows integration of multiple channels, and the -2 speed grade ensures sufficient clock rates for wideband signals. Power consumption is manageable with proper clock gating, and the industrial temperature grade supports deployment in remote or outdoor radio units.
Recommended
Medical Imaging
The XC7A200T-2FBG676I excels in medical imaging systems such as ultrasound and CT scanners, where high-speed data acquisition and real-time image processing are critical. The FPGA's 740 DSP slices accelerate beamforming, filtering, and image reconstruction algorithms. The 13,140 Kb Block RAM provides ample storage for line buffers and intermediate results. The 400 user I/O pins interface with high-speed ADCs and DACs, while the transceivers support data streaming to host processors. The industrial temperature grade ensures reliable operation in clinical environments. The device's low power consumption compared to GPUs makes it suitable for portable ultrasound devices.
Recommended
Industrial Motor Control
The XC7A200T-2FBG676I is well-suited for advanced motor control applications, including multi-axis servo drives and robotics. Its 740 DSP slices enable high-bandwidth current and velocity loops, while the logic cells implement PWM generation, encoder interfaces, and safety functions. The FPGA's deterministic timing ensures precise control, and the 400 I/O pins connect to gate drivers, current sensors, and encoders. The -2 speed grade supports high PWM frequencies (up to 100 kHz) for low-inductance motors. The industrial temperature range (-40C to +100C) is essential for factory floor environments. The device also supports fieldbus protocols like EtherCAT via soft IP cores.
Recommended
High-Performance Computing (HPC) Acceleration
The XC7A200T-2FBG676I can accelerate compute-intensive workloads in HPC and data centers, such as financial risk analysis, genomics, and scientific simulations. Its 740 DSP slices and 13,140 Kb Block RAM enable efficient implementation of custom arithmetic pipelines, including floating-point operations via IP cores. The PCIe Gen2 x4 block provides a high-bandwidth host interface, while the 16 transceivers support 10GbE or InfiniBand for inter-FPGA communication. The FPGA's reconfigurability allows hardware specialization for specific algorithms, achieving orders-of-magnitude speedup over CPUs. The -2 speed grade balances performance and power, and the FBG676 package's thermal characteristics support high-utilization designs with proper cooling.
Recommended
Aerospace and Defense
The XC7A200T-2FBG676I is used in aerospace and defense systems for radar, electronic warfare, and secure communications. Its industrial temperature range and high reliability make it suitable for harsh environments. The FPGA's DSP slices implement pulse compression, beamforming, and FFTs for radar signal processing. The transceivers support high-speed data links such as Serial FPDP and SpaceWire. The device's configuration security features, including bitstream encryption, protect intellectual property. The 400 I/O pins interface with sensors and actuators, while the logic density allows integration of multiple functions on a single device, reducing size, weight, and power (SWaP) in avionics systems.
Recommended
Video and Image Processing
The XC7A200T-2FBG676I is ideal for video processing applications such as broadcast equipment, surveillance systems, and machine vision. Its logic cells implement video scalers, color space converters, and compression algorithms. The 13,140 Kb Block RAM supports line buffers and frame stores, while the DSP slices accelerate filtering and edge detection. The 400 I/O pins connect to HDMI, DisplayPort, and MIPI interfaces via external PHYs. The transceivers support SDI (3G/6G/12G) for broadcast video. The -2 speed grade handles 4K60 video processing with ease. The device's low power consumption is beneficial for fanless surveillance cameras and portable inspection systems.
Recommended
Recommended Products Summary
Engineering reference data for XC7A200T-2FBG676I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7A200T-2FBG676C | XC7A200T-1FBG676I | XC7A200T-3FBG676I |
|---|---|---|---|---|
| Package | FCBGA-676 (FBG676) | FCBGA-676 (FBG676) - same | FCBGA-676 (FBG676) - same | FCBGA-676 (FBG676) - same |
| Logic Cells | 740,000 | 740,000 | 740,000 | 740,000 |
| Speed Grade | -2 | -2 | -1 | -3 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| User I/O | 400 | 400 | 400 | 400 |
| Block RAM | 13,140 Kb | 13,140 Kb | 13,140 Kb | 13,140 Kb |
| DSP Slices | 740 | 740 | 740 | 740 |
| Transceivers | 16 (up to 6.6 Gb/s) | 16 (up to 6.6 Gb/s) | 16 (up to 6.6 Gb/s) | 16 (up to 6.6 Gb/s) |
Key Differentiators
- Industrial temperature grade (vs XC7A200T-2FBG676C)
- Higher speed grade than -1 (vs XC7A200T-1FBG676I)
- Balanced performance and power (vs XC7A200T-3FBG676I)
Design Notes
The XC7A200T-2FBG676I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (per I/O bank). Use a dedicated power management IC or DC-DC converters with proper sequencing. VCCINT must be stable within +/-3% and VCCAUX within +/-5%. Decouple each rail with a combination of bulk and ceramic capacitors (e.g., 10uF and 0.1uF) placed close to the FPGA pins. Refer to the Artix-7 FPGA Data Sheet (DS181) for detailed power supply specifications.
The FBG676 package has a thermal resistance (theta_JA) of approximately 8.5 C/W with airflow. For high-utilization designs, power dissipation can exceed 10W, requiring a heatsink or forced air cooling. Use AMD's Power Estimator (XPE) to estimate junction temperature and ensure it stays below the maximum of 100C for industrial grade. Consider adding thermal vias under the package to improve heat transfer to the PCB.
For high-speed transceivers (up to 6.6 Gb/s), use controlled impedance traces (e.g., 100 ohm differential) and minimize via stubs. Place the FPGA close to connectors to reduce trace length. Use ground planes under the transceiver pins and provide adequate decoupling. For the 400 user I/O, follow the I/O bank guidelines in the datasheet to avoid signal integrity issues. Use the pinout files from Vivado to ensure correct pin assignment.
Compliance Information
AMD Xilinx devices are RoHS and REACH compliant. The FBG676 package is lead-free and halogen-free. AEC-Q100 qualification is not applicable for this FPGA family.
