XC7A200T-2FB484I - 215K Logic Cell Artix-7 FPGA | AMD
부품 번호: XC7A200T-2FB484I ✓ 활성XC7A200T-2FB484I 개요
An FPGA is a semiconductor whose digital logic, interconnections, and input/output behavior are configured after manufacture. The Artix-7 family belongs to the broader FPGA hierarchy, which sits above fixed-function logic and programmable signal-processing devices. Compared with an ASIC, an FPGA permits design revisions, hardware reuse, and rapid prototyping without fabricating a custom integrated circuit. Its configurable parallel processing fabric is especially useful for image pipelines, control systems, communications, and data acquisition.
The XC7A200T-2FB484I provides 13,455,360 RAM bits for buffers, packet storage, and general-purpose logic. Its 285 I/O positions support integration with external memory, control signals, serial transceivers, and industrial peripherals. Four GTP channels support high-speed serial links, while the -2 speed grade identifies a performance grade within the Artix-7 portfolio. The industrial-temperature suffix supports designs intended for extended-temperature operation.
Artix-7 devices use a programmable fabric organized into configurable logic blocks and programmable interconnect resources. This architecture allows parallel datapaths to operate simultaneously, making the device suitable for video acquisition, sensor fusion, protocol bridging, and embedded control. Because FPGA designs depend on clocks, I/O standards, power rails, and tool-supported constraints, the device must be paired with an appropriate clocking scheme, power architecture, and device-aware PCB design.
Typical applications include industrial machine vision, test and measurement equipment, embedded communications, radar or signal-processing front ends, and compact control systems. The 484-ball package supports dense connections but requires careful escape routing and multilayer PCB construction. Four GTP links are valuable for high-speed serial interfaces, while the large logic and RAM resources support parallel processing and substantial data buffering.
A key design consideration is that the 484-ball FCBGA package requires a constrained, multilayer PCB with controlled power and ground distribution. Use the AMD package pinout files and the device-specific pin constraints when assigning banks, differential pairs, power pins, and transceiver connections. Confirm the selected clocking, memory interface, and I/O standards before finalizing the schematic and layout.
This product record combines device resource details, package information, verified source links, comparison guidance, and practical PCB-design considerations to accelerate component selection and board planning.
드롭인 대체품: XC7A200T-2FB484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC7A200T-2FB484I (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Speed Grade, Logic Cells, Operating Temperature.
XC7A200T-2FBG484I
✅ 드롭인✗ 재고 없음
$89.15 / 개
데이터시트 보기 →XC7A200T-1FBG484I
✅ 드롭인✗ 재고 없음
$38.5 / 개
데이터시트 보기 →XC7A200T-1FBG484C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XQ7A200T-1RB484
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
GX1P220
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7A200T-2FB484I 최대 정격 & 전기적 특성
| Device Type | Artix-7 FPGA |
| Logic Cells | 215,360 cells |
| Total RAM Bits | 13,455,360 bits |
| User I/O | 285 I/O |
| Process Technology | 28 nm |
| 패키지 | 484-ball FCBGA |
| Package Type | 484-BBGA, FCBGA |
| Speed Grade | -2 |
| Temperature Grade | Industrial |
| Transceiver Channels | 4 GTP channels |
| RoHS 상태 | Non-compliant |
| 실장 유형 | Surface mount |
XC7A200T-2FB484I 484-bbga, fcbga 핀 구성 가이드
XC7A200T-2FB484I(484-bbga, fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC7A200T-2FB484I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC7A200T-2FB484I 적합 용도: 6 애플리케이션s: Industrial Machine Vision, Test and Measurement Instrumentation, High-Speed Data Acquisition, Industrial Communication Gateways, Embedded Signal Processing, Programmable Control Systems.
Industrial Machine Vision
The XC7A200T-2FB484I suits machine-vision controllers that combine parallel image processing with external high-speed interfaces. Its 215,360 logic cells can support pixel-format conversion, thresholding, feature detection, and control pipelines, while 13,455,360 RAM bits support line buffers and frame-sized working storage. Four GTP channels add serial-link options for camera, sensor, or network interfaces. The 484-ball FCBGA also supports dense board connections, although multilayer routing and careful bank assignment are essential. Timing constraints should lock image-processing paths to the selected clock, while I/O planning must separate incompatible voltage standards and preserve the transceiver pin assignments defined for this package.
추천
Test and Measurement Instrumentation
The XC7A200T-2FB484I can implement concurrent acquisition, digital signal conditioning, trigger logic, and data formatting in a compact measurement instrument. Its large programmable fabric is useful for multiple parallel channels, while 13,455,360 RAM bits can hold acquisition records and intermediate results. The four GTP channels permit direct high-speed serial links to converters, memory, or a host processor. Designers should use synchronous clocking to constrain acquisition pipelines, preserve deterministic routing where measurement accuracy depends on latency, and isolate sensitive analog interfaces with suitable I/O-bank planning. The 484-ball package supports dense mixed-signal integration but requires a multilayer PCB with stable power delivery and short return paths.
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High-Speed Data Acquisition
The XC7A200T-2FB484I fits parallel ADC capture, radar-data processing, and other streaming applications where throughput must be distributed across several logic pipelines. Its 215,360 logic cells provide substantial parallelism, and 13,455,360 RAM bits support buffering between acquisition and processing stages. Four GTP channels can connect the FPGA to serializers, memory, or a processing platform when the board-level link budget supports them. Clock-domain crossings require explicit timing exceptions or constraints, and I/O capture timing should be checked against the external device rather than the FPGA's generic speed grade. A dense 484-ball FCBGA helps reduce external component count but makes via-in-pad, assembly, and thermal planning central to the PCB design.
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Industrial Communication Gateways
The XC7A200T-2FB484I is appropriate for protocol-conversion gateways that must bridge multiple serial and parallel interfaces while buffering traffic in hardware. The four GTP channels can support high-speed links, while the 215,360 logic cells accommodate framing, header processing, checksum generation, and packet routing. Its 13,455,360 RAM bits provide useful elasticity for burst traffic and packet queues. Designers should establish clock-domain boundaries, use device-aware I/O standards for each bank, and verify transceiver reference-clock requirements in the AMD documentation. The 484-ball FCBGA enables a high pin count, but decoupling, simultaneous switching-noise control, and layer-stackup planning are necessary for reliable industrial operation.
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Embedded Signal Processing
The XC7A200T-2FB484I supports embedded filtering, modulation, correlation, and fixed-point processing when a design benefits from parallel FPGA execution. The large logic fabric allows multiple lanes to operate concurrently, and the 13,455,360 RAM bits can support sample buffers, coefficient storage, and intermediate pipeline data. Four GTP channels broaden the available high-speed serial connectivity for sensor or processing-chain links. Implementation should use the AMD DSP and implementation flow where applicable, constrain arithmetic pipelines deterministically, and account for resource sharing when multiple algorithms run concurrently. The dense package reduces board area but increases assembly complexity, so ball pitch, solder mask, paste volume, and component placement should be reviewed with the selected assembly process.
추천
Programmable Control Systems
The XC7A200T-2FB484I can serve as the central controller in a complex machine, robotic subsystem, or industrial controller where parallel logic replaces multiple fixed-function devices. Its 215,360 logic cells can coordinate motion sequencing, safety-adjacent monitoring, communications, and diagnostic functions, while the 13,455,360 RAM bits support state history and local buffers. The -2 speed grade provides additional timing headroom for demanding control paths, although final closure must be demonstrated in Vivado. Use separate clock domains carefully, define reset behavior for every controller block, and assign external interfaces only after reviewing voltage, slew, and drive-capability requirements. The 484-ball FCBGA supports this integration while requiring careful high-speed return-path and power-plane design.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC7A200T-2FB484I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7A200T-2FBG484I | XC7A200T-1FBG484I | XC7A200T-1FBG484C | XQ7A200T-1RB484 | GX1P220 |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | GXSC |
| Package | 484-ball FCBGA | 484-ball FCBGA | 484-ball FCBGA | 484-ball FCBGA | 484-ball FCBGA | 484-ball migration option |
주요 차별점
- Higher speed grade than the -1 alternatives (vs XC7A200T-1FBG484I)
- Industrial-temperature ordering option (vs XC7A200T-1FBG484C)
- Military-temperature pin-compatible migration path (vs XQ7A200T-1RB484)
- Original AMD 215,360-cell Artix-7 resource configuration (vs GX1P220)
설계 노트
Use AMD's Artix-7 package device pinout files to assign every one of the 484 package balls. Place the BGA footprint and power, ground, configuration, clock, and transceiver connections according to the package-specific mechanical drawing rather than a generic 484-ball library item. A multilayer stack with short return paths is especially important for GTP interfaces, external memories, and high-speed I/O. Validate differential-pair lengths against the applicable device and board constraints before release.
Plan the power tree around the device's required voltage rails and high-current activity in the configurable fabric and GTP transceivers. Place local bulk and high-frequency decoupling at the relevant supply pins, with each power domain connected to its intended plane through a low-impedance via structure. Review simultaneous switching requirements, voltage tolerance, startup behavior, and configuration-pin states in the manufacturer data. Do not infer rail values from a related device ordering code when the package or grade differs.
Keep configuration, clock, reset, and JTAG routing deterministic, and avoid splitting power or ground planes beneath the BGA to maintain low return-path inductance. Place decoupling and clock references close to their associated package balls, while giving GTP and other high-speed interfaces uninterrupted reference planes and controlled impedance. Check BGA assembly requirements, including solder-mask-defined pads or via-in-pad construction, against the selected PCB fabricator's process because thermal and solder-joint reliability depend on the complete stackup and assembly recipe.
A replacement is not established merely because it contains 215,360 logic cells, 13,455,360 RAM bits, 285 I/O positions, and a 484-ball package. Compare the exact package pinout, speed grade, temperature class, I/O standards, power pins, configuration behavior, and transceiver assignments. For XC7A200T-1FBG484I and XQ7A200T-1RB484, rerun timing after changing the ordering code because the -1 speed grade may not close the paths previously signed off for the -2 device.
The 484-ball FCBGA relies heavily on its board thermal path, so junction temperature depends on device activity, ambient conditions, package construction, and the PCB copper system rather than logic-cell count alone. Use the manufacturer's power and thermal guidance to identify the dominant rails and activity patterns, then distribute heat through a multilayer board with uninterrupted ground planes. Where airflow is limited, assess the assembly with the expected clocking and transceiver activity instead of relying only on a nominal device estimate.
규정 준수 정보
The available product-directory data identifies the XC7A200T-2FB484I as RoHS non-compliant. REACH, lead-free, halogen-free, and conflict-minerals status were not established. AEC-Q100 is not applicable to this industrial FPGA.
