XC7A200T-1FBG484I - 740K Logic Cells FPGA | AMD Xilinx
MPN: XC7A200T-1FBG484I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $220.5 | $2,205.00 |
| 100 | $196 | $19,600.00 |
| 500 | $171.5 | $85,750.00 |
| 1,000 | $147 | $147,000.00 |
Drop-in alternatives for XC7A200T-1FBG484I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7A200T-2FBG484I
β 99,999 In Stock
$316.8 / Unit
View Datasheet βXC7A200T-1FBG484C
π Reference alternative (not in catalog)
XC7A200T-2FBG484C
β 99,999 In Stock
$320 / Unit
View Datasheet βXC7A200T-1FBG484I Maximum Ratings & Electrical Characteristics
| Family | Artix-7 |
| Logic Cells | 740K |
| Logic Slices | 215K |
| Block RAM | 13 Mb |
| DSP48E1 Slices | 740 |
| Clock Management Tiles | 10 |
| User I/O Pins | 285 |
| Core Voltage | 0.95V to 1.05V |
| Speed Grade | -1 |
| Maximum Clock Frequency | 550 MHz |
| Operating Temperature | -40C to +100C |
| Package | FBGA-484 (23x23 mm) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Configuration Modes | JTAG, SPI, SelectMAP |
XC7A200T-1FBG484I Pin Configuration
| Pin A1 | IO_L1P_T0 β User I/O bank 0, differential pair P |
| Pin A2 | IO_L1N_T0 β User I/O bank 0, differential pair N |
| Pin B1 | IO_L2P_T0 β User I/O bank 0, differential pair P |
| Pin B2 | IO_L2N_T0 β User I/O bank 0, differential pair N |
| Pin C1 | VCCINT β Core voltage supply (0.95V-1.05V) |
| Pin C2 | GND β Ground |
| Pin D1 | VCCAUX β Auxiliary voltage supply (1.8V) |
| Pin D2 | GND β Ground |
| Pin E1 | IO_L3P_T0 β User I/O bank 0, differential pair P |
| Pin E2 | IO_L3N_T0 β User I/O bank 0, differential pair N |
| Pin F1 | IO_L4P_T0 β User I/O bank 0, differential pair P |
| Pin F2 | IO_L4N_T0 β User I/O bank 0, differential pair N |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7A200T-1FBG484I is suitable for 6 applications: Software-Defined Radio, Medical Imaging, Industrial Motor Control, High-Performance Computing Acceleration, Aerospace and Defense, Video and Image Processing.
Software-Defined Radio
The XC7A200T-1FBG484I is ideal for software-defined radio (SDR) systems due to its 740 DSP48E1 slices and high-speed I/O. In a typical SDR, the FPGA interfaces with high-speed ADCs and DACs to perform digital down/up conversion, filtering, and modulation. The DSP slices handle complex multiply-accumulate operations at high throughput, while the 285 I/O pins support parallel data buses to converters. The device's 13 Mb block RAM provides buffering for data streams, and the 10 CMTs generate multiple clock domains for different processing stages. Compared to using a DSP processor, the FPGA offers lower latency and higher parallelism, enabling real-time wideband signal processing. Designers must carefully manage clock domains and use the MMCM/PLL resources to synchronize data across the system.
Recommended
Medical Imaging
The XC7A200T-1FBG484I is well-suited for medical imaging systems such as ultrasound and CT scanners. Its high logic density and DSP resources enable real-time image reconstruction, filtering, and enhancement. In an ultrasound system, the FPGA processes echo signals from transducer arrays, performing beamforming and envelope detection. The 740 DSP48E1 slices accelerate the correlation and filtering algorithms, while the block RAM stores intermediate image data. The industrial temperature range (-40C to +100C) ensures reliable operation in clinical environments. The device's low-latency I/O allows direct connection to analog front-end ADCs, reducing system complexity. Designers should implement pipelined processing stages to maximize throughput and use the CMTs to generate precise clock signals for the imaging chain.
Recommended
Industrial Motor Control
The XC7A200T-1FBG484I is used in industrial motor control for implementing complex control algorithms like field-oriented control (FOC) and space vector modulation. The FPGA's parallel processing capability allows multiple motor axes to be controlled simultaneously with deterministic timing. The DSP48E1 slices handle the Clarke/Park transforms and PID loops, while the I/O pins interface with encoders and PWM drivers. The device's 13 Mb block RAM stores lookup tables for sine/cosine generation and control parameters. The -1 speed grade provides sufficient performance for most motor control loops running at 10-20 kHz. Designers must ensure proper isolation between power and logic domains and use the FPGA's dedicated clock resources to synchronize PWM signals. The industrial temperature range makes it suitable for factory automation environments.
Recommended
High-Performance Computing Acceleration
The XC7A200T-1FBG484I is used as a hardware accelerator in high-performance computing (HPC) systems for tasks like data compression, encryption, and machine learning inference. Its 740 DSP48E1 slices and 13 Mb block RAM enable efficient implementation of parallel algorithms. In a typical HPC node, the FPGA connects to a host CPU via PCIe, offloading compute-intensive kernels. The device's high logic density allows multiple processing engines to run concurrently, achieving significant speedups over software. The 285 I/O pins support high-bandwidth memory interfaces, and the CMTs generate multiple clock domains for different processing units. Designers should use AMD's Vitis HLS to accelerate development and optimize resource utilization. The -1 speed grade balances performance and power, making it suitable for power-constrained data centers.
Recommended
Aerospace and Defense
The XC7A200T-1FBG484I is used in aerospace and defense systems for radar processing, secure communications, and electronic warfare. Its high DSP count and industrial temperature range make it suitable for harsh environments. In radar systems, the FPGA performs pulse compression, Doppler filtering, and beamforming. The 740 DSP48E1 slices handle the complex FFT and correlation operations, while the block RAM stores radar data frames. The device's I/O supports high-speed ADCs and DACs for signal conversion. The -1 speed grade provides adequate performance for most radar applications, and the FBGA-484 package is compact enough for space-constrained avionics. Designers must implement radiation-hardening techniques if required and follow military-grade design guidelines. The FPGA's reconfigurability allows in-field updates for evolving mission requirements.
Recommended
Video and Image Processing
The XC7A200T-1FBG484I is used in video and image processing systems for tasks like real-time video encoding, object detection, and image enhancement. Its high logic density and DSP resources enable parallel processing of multiple video streams. In a typical video processing pipeline, the FPGA receives video data from cameras or interfaces, performs color space conversion, scaling, and filtering, and outputs processed video. The 740 DSP48E1 slices accelerate convolution and filtering operations, while the block RAM stores line buffers and frame data. The 285 I/O pins support multiple video interfaces such as HDMI, DisplayPort, and MIPI. The device's CMTs generate pixel clocks and synchronization signals. Designers should use pipelined architectures to achieve real-time throughput and implement efficient memory management to avoid bottlenecks.
Recommended
Recommended Products Summary
Engineering reference data for XC7A200T-1FBG484I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7A200T-2FBG484I | XC7A200T-1FBG484C | XC7A200T-2FBG484C |
|---|---|---|---|---|
| Package | FBGA-484 | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Logic Cells | 740K | 740K | 740K | 740K |
| Speed Grade | -1 | -2 | -1 | -2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Maximum Clock Frequency | 550 MHz | 600 MHz | 550 MHz | 600 MHz |
| User I/O Pins | 285 | 285 | 285 | 285 |
| DSP48E1 Slices | 740 | 740 | 740 | 740 |
| Block RAM | 13 Mb | 13 Mb | 13 Mb | 13 Mb |
Key Differentiators
- Industrial temperature grade (vs XC7A200T-1FBG484C)
- Lower speed grade for cost savings (vs XC7A200T-2FBG484I)
- Same logic resources in compact package (vs XC7A200T-1FBG676I)
Design Notes
The XC7A200T-1FBG484I requires multiple power rails: VCCINT (0.95V-1.05V), VCCAUX (1.8V), and VCCO (1.2V-3.3V depending on I/O bank). Use low-dropout regulators or switching regulators with proper decoupling. Place 100nF and 10uF capacitors near each power pin to minimize noise. Follow the power sequencing requirements in the datasheet to avoid latch-up.
The FBGA-484 package has a thermal resistance of approximately 10C/W (theta_JA) with proper airflow. For high-utilization designs, use a heatsink or forced air cooling to keep junction temperature below 100C. Calculate power dissipation using AMD's Power Estimator tool and design the PCB with thermal vias under the package to improve heat transfer.
For high-speed I/O, maintain controlled impedance traces (50 ohm single-ended, 100 ohm differential) and minimize trace lengths. Use ground planes under the FPGA and avoid splitting planes. Place decoupling capacitors as close to the power pins as possible. Follow AMD's PCB design guidelines for the FBGA-484 package to ensure reliable solder joints and signal integrity.
Compliance Information
RoHS compliant per AMD Xilinx product page. Not AEC-Q100 qualified as it is not an automotive-grade device.
