M1AFS1500-2FGG676I - Fusion FPGA 1.5M Gates | Microchip
부품 번호: M1AFS1500-2FGG676I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82.3 | $823.00 |
| 100 | $74.1 | $7,410.00 |
| 500 | $66.8 | $33,400.00 |
| 1,000 | $59.6 | $59,600.00 |
M1AFS1500-2FGG676I 개요
A Fusion FPGA is a field-programmable gate array that combines programmable logic with analog and memory resources on a single chip. This integration allows designers to replace multiple discrete components with one device, reducing board space and improving system reliability. The Fusion family is part of the broader FPGA category, which sits within the programmable logic device hierarchy, ultimately falling under embedded processing and integrated circuits.
Key features include 1.5M gates, 38,400 logic cells, 252 user I/Os, 276,480 total RAM bits, and a supply voltage range of 1.425V to 1.575V. The device is flash-based, providing instant-on capability and secure IP protection with 128-bit flash lock and AES decryption. It operates over an industrial temperature range of -40°C to +100°C, making it suitable for harsh environments.
The Fusion architecture integrates a 12-bit ADC, analog comparators, and a real-time counter, enabling mixed-signal system design without external components. The flash-based configuration is non-volatile, so the FPGA is ready immediately upon power-up, eliminating the need for external boot memory. This reduces system cost and complexity while enhancing security.
Typical applications include motor control, power management, industrial automation, and medical devices where analog monitoring and digital control are required. The device's ability to handle both analog and digital functions makes it ideal for smart power supplies, battery management systems, and sensor interfaces.
When designing with this FPGA, consider the 1.5V core supply and the need for proper decoupling. The flash-based architecture allows for secure remote updates, but ensure the AES key is managed appropriately. The 676-ball FBGA package requires careful PCB layout for thermal and signal integrity.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the M1AFS1500-2FGG676I.
드롭인 대체품: M1AFS1500-2FGG676I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: M1AFS1500-2FGG676I (동일 폼 팩터 및 풋프린트) — 차이점: Family, Package, Technology, Speed Grade, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
M1AFS1500-2FGG676Y
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
M1AFS1500-1FGG676I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →M1AFS1500-1FGG676
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →M1AFS1500-FGG676I
✅ 드롭인✓ 재고 있음
$89.9 / 개
데이터시트 보기 →M1AFS1500-FGG676
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →M1AFS1500-2FG676I
✅ 드롭인✓ 재고 있음
$405 / 개
데이터시트 보기 →M1AFS1500-2FGG676I 최대 정격 & 전기적 특성
| Family | Fusion |
| System Gates | 1.5M |
| Logic Cells | 38400 |
| 최대 클록 주파수 | 350 MHz |
| Technology | 130nm |
| 공급 전압 | 1.5V (1.425V to 1.575V) |
| Total RAM Bits | 276480 |
| Number of I/Os | 252 |
| 패키지 | 676-ball FBGA |
| Terminal Pitch | 1.00 mm |
| 동작 온도 범위 | -40°C to +100°C |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Flash-Based | Yes |
| Security | 128-bit flash lock, AES decryption |
M1AFS1500-2FGG676I 676-ball fbga 핀 구성 가이드
M1AFS1500-2FGG676I(676-ball fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: M1AFS1500-2FGG676I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
M1AFS1500-2FGG676I 적합 용도: 6 애플리케이션s: Motor Control, Power Management, Industrial Automation, Medical Devices, Aerospace and Defense, IoT and Smart Energy.
Motor Control
The M1AFS1500-2FGG676I is ideal for motor control applications due to its integrated 12-bit ADC and analog comparators, which enable direct monitoring of motor currents and voltages. The programmable logic can implement PWM generation, commutation algorithms, and fault protection. Its flash-based instant-on capability ensures immediate operation on power-up, which is critical for safety in industrial drives. The 1.5M gates provide ample resources for complex control loops and communication interfaces. With 252 I/Os, it can interface with multiple sensors and drivers. The industrial temperature range (-40°C to +100°C) suits harsh factory environments. Compared to discrete solutions, this FPGA reduces board space and improves reliability by integrating analog and digital functions.
추천
Power Management
The M1AFS1500-2FGG676I excels in power management systems, such as smart power supplies and battery management, by integrating analog monitoring and digital control. Its 12-bit ADC can measure voltage and current with high precision, while the programmable logic implements control algorithms like MPPT or charging profiles. The flash memory allows storing calibration data and configuration. The device's low power consumption and wide temperature range make it suitable for industrial and automotive power systems. With 1.5M gates, it can handle complex state machines and communication protocols like PMBus. The instant-on feature ensures the power supply starts correctly without external boot time. This integration reduces component count and enhances system reliability.
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Industrial Automation
In industrial automation, the M1AFS1500-2FGG676I provides a flexible platform for PLCs, robotics, and process control. Its mixed-signal capabilities allow direct interfacing with analog sensors (temperature, pressure, flow) without external ADCs. The programmable logic can implement real-time control loops, communication interfaces (EtherCAT, PROFIBUS), and safety logic. The 1.5M gates and 252 I/Os support multiple fieldbus connections and I/O expansion. The flash-based configuration ensures reliable operation in noisy environments and allows secure field updates. The industrial temperature range and robust design make it suitable for 24/7 operation. Compared to microcontrollers, this FPGA offers higher parallelism and deterministic timing, essential for precise automation.
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Medical Devices
The M1AFS1500-2FGG676I is suitable for medical devices such as patient monitors, infusion pumps, and diagnostic equipment. Its integrated analog front-end (ADC, comparators) enables precise sensor signal conditioning, while the programmable logic handles data processing and communication. The flash-based architecture provides secure storage of patient data and firmware, meeting regulatory requirements. The device's low power consumption is critical for battery-powered portable devices. With 1.5M gates, it can implement complex algorithms like ECG filtering and analysis. The industrial temperature range ensures reliable operation in clinical environments. The instant-on feature allows immediate device readiness, which is vital in emergency situations. This integration reduces system size and improves reliability.
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Aerospace and Defense
The M1AFS1500-2FGG676I is designed for aerospace and defense applications requiring high reliability and security. Its flash-based configuration provides inherent tamper resistance and secure boot, protecting IP from reverse engineering. The device operates over the industrial temperature range and is radiation-tolerant for many applications. The integrated analog capabilities allow direct sensor interfacing for flight control, navigation, and telemetry. With 1.5M gates, it can implement complex signal processing and communication protocols. The instant-on feature is critical for safety-critical systems. The 676-ball FBGA package offers robust mechanical reliability. Compared to SRAM-based FPGAs, this device does not require external configuration memory, reducing system complexity and vulnerability.
추천
IoT and Smart Energy
The M1AFS1500-2FGG676I is well-suited for IoT gateways and smart energy systems, such as smart meters and solar inverters. Its mixed-signal capabilities enable accurate energy measurement and monitoring. The programmable logic can implement communication protocols (Zigbee, Wi-Fi, Modbus) and data aggregation. The flash memory allows storing configuration and logging data. With 1.5M gates, it can handle edge computing tasks like anomaly detection. The low power consumption is essential for battery-powered IoT devices. The industrial temperature range supports outdoor installations. The instant-on feature ensures quick response to wake-up events. This integration reduces BOM cost and power consumption compared to multi-chip solutions.
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추천 제품 요약
엔지니어링 참조 데이터: M1AFS1500-2FGG676I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | M1AFS1500-2FGG676Y | M1AFS1500-1FGG676I | M1AFS1500-1FGG676 | M1AFS1500-FGG676I | M1AFS1500-FGG676 | M1AFS1500-2FG676I |
|---|---|---|---|---|---|---|---|
| Package | 676-ball FBGA | 676-ball FBGA | 676-ball FBGA | 676-ball FBGA | 676-ball FBGA | 676-ball FBGA | 676-ball FBGA (different pitch) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | 2 | 2 | 1 | 1 | Standard | Standard | 2 |
| Temperature Grade | Industrial (-40°C to +100°C) | Extended (-40°C to +100°C) | Industrial (-40°C to +100°C) | Commercial (0°C to +85°C) | Industrial (-40°C to +100°C) | Commercial (0°C to +85°C) | Industrial (-40°C to +100°C) |
| Logic Cells | 38400 | 38400 | 38400 | 38400 | 38400 | 38400 | 38400 |
| Total RAM Bits | 276480 | 276480 | 276480 | 276480 | 276480 | 276480 | 276480 |
| Number of I/Os | 252 | 252 | 252 | 252 | 252 | 252 | 252 |
주요 차별점
- Integrated mixed-signal capabilities (vs M1AFS1500-2FGG676Y)
- Higher speed grade (vs M1AFS1500-1FGG676I)
- Industrial temperature range (vs M1AFS1500-1FGG676)
설계 노트
The M1AFS1500-2FGG676I requires a 1.5V core supply with tight regulation (1.425V to 1.575V). Use a low-dropout regulator or a switching regulator with low ripple. Decouple each power pin with a 0.1uF ceramic capacitor and add bulk capacitance (10uF) near the FPGA. Estimated: For a design with 1.5V at 500mA, power dissipation is 0.75W. Ensure adequate copper pour for thermal dissipation.
For the 676-ball FBGA package, use a multi-layer PCB with dedicated power and ground planes. Route high-speed signals with controlled impedance (50 ohms for single-ended, 100 ohms differential). Place decoupling capacitors as close to the FPGA as possible, ideally on the opposite side of the board. Follow the manufacturer's layout guidelines for BGA escape routing.
The 676-ball FBGA package has a thermal resistance that depends on airflow and PCB design. Estimated: For a power dissipation of 2W, with a theta_JA of 15°C/W, the junction temperature rise is 30°C. At an ambient of 70°C, the junction would be 100°C, which is at the limit. Provide adequate airflow or a heatsink for high-power designs.
규정 준수 정보
RoHS compliant per distributor listings. AEC-Q100 not applicable for FPGA. Other compliance data not specified in provided sources.
