XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD
부품 번호: XC6SLX75-2FGG676I ✓ 활성XC6SLX75-2FGG676I 개요
A field-programmable gate array is a programmable semiconductor in the FPGA category of digital logic devices. An FPGA combines configurable logic blocks, programmable interconnect, memory resources, and input/output blocks into an integrated circuit whose circuit behavior can be modified after manufacture. Within the broader semiconductor hierarchy, the Spartan-6 LX device provides a programmable alternative to application-specific integrated circuits when interfaces, parallel processing, or logic capacity must change between product variants.
Principal device characteristics include 74,637 logic cells, 5,831 configurable logic blocks, 408 I/O, 667 MHz internal frequency, and operation from approximately -40°C to +100°C for the industrial-temperature ordering indicated by the I suffix. The 676-ball FBGA package supports dense board-level integration, while the lead-free construction is explicitly identified in the available product records.
The -2 designation identifies the device's performance grade within the Spartan-6 LX family, which is manufactured on 45 nm CMOS technology. Its 676-ball package provides a high pin count for high-performance design implementations, including parallel data interfaces, embedded control, industrial automation, networking equipment, and general-purpose signal processing. System timing must still be evaluated against the specific clock, I/O, and resource requirements of each implemented design.
Typical applications include industrial control systems, embedded video processing, communication infrastructure, test equipment, and high-density programmable logic. The combination of 408 I/O and 74,637 logic cells permits multiple interfaces to be consolidated in one device, reducing the need for separate programmable or discrete interface components when pin and performance requirements are satisfied.
A primary design consideration is BGA assembly. The 1 mm pitch, 676-ball package requires a suitable land pattern, multilayer PCB construction, appropriate thermal management, and assembly-process controls. Designers should also confirm timing closure, power budget, configuration method, bank voltage requirements, and I/O standards against the manufacturer datasheet before releasing a production design.
This page consolidates verified distributor specifications, package details, availability information, comparable Spartan-6 device options, and practical selection guidance. It supplements the manufacturer datasheet with decision-oriented information for engineers evaluating the XC6SLX75-2FGG676I as an industrial-grade, high-density FPGA.
드롭인 대체품: XC6SLX75-2FGG676I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC6SLX75-2FGG676I (동일 폼 팩터 및 풋프린트) — 차이점: Logic Cells, Device Type, Internal Frequency, Operating Temperature, Package.
XC6SLX75-2FG676I
✅ 드롭인가격 문의
데이터시트 보기 →XC6SLX75-3FGG676C
✅ 드롭인가격 문의
데이터시트 보기 →XC6SLX75-3FGG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX45-2FGG676I
✅ 드롭인가격 문의
데이터시트 보기 →XC6SLX95-2FGG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX100-2FGG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX75-2FGG676I 최대 정격 & 전기적 특성
| Device Type | Spartan-6 LX field-programmable gate array (FPGA) |
| Logic Cells | 74,637 cells |
| Configurable Logic Blocks | 5,831 CLBs |
| Internal Frequency | 667 MHz |
| Input/Output Count | 408 I/O |
| 공급 전압 | 1 V |
| Speed Grade | -2 |
| Process Technology | 45 nm CMOS |
| Package Type | 676-ball FBGA |
| Package Dimensions | 27 mm × 27 mm |
| Ball Pitch | 1 mm |
| 실장 유형 | Surface mount |
| 동작 온도 | -40°C to +100°C |
| Lead-Free Status | Lead free |
| Device Family | Spartan-6 LX |
XC6SLX75-2FGG676I 27 mm × 27 mm 핀 구성 가이드
XC6SLX75-2FGG676I(27 mm × 27 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC6SLX75-2FGG676I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC6SLX75-2FGG676I 적합 용도: 6 애플리케이션s: Industrial Automation and Machine Control, Network Interface and Protocol Bridging, Embedded Video and Image Processing, Test and Measurement Instrumentation, Communication and Data Acquisition, Programmable Logic and System Integration.
Industrial Automation and Machine Control
The XC6SLX75-2FGG676I fits industrial machine-control boards that combine multiple discrete and fieldbus interfaces with deterministic control logic. Its 408 I/O provide substantial board-level connectivity, while 74,637 logic cells and 5,831 configurable logic blocks can support sequencing, motion-command processing, interlocks, and protocol conversion. The listed -40°C to +100°C range suits industrial environments better than the commercial -3FGG676C option. The design must still verify individual I/O standards, speed grades, timing margins, and isolation requirements. Its 676-ball FBGA also demands a multilayer PCB with controlled impedance, sound power and ground distribution, and assembly capability for a 1 mm pitch.
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Network Interface and Protocol Bridging
The XC6SLX75-2FGG676I is appropriate for fixed-format protocol bridges, data-format converters, and network aggregation logic where parallel interfaces must be combined with programmable packet or frame processing. Its 408 I/O can support multiple external buses or a wide parallel data path, while the listed 667 MHz internal frequency provides a substantial clocking resource relative to many low-speed interface tasks. Verified network-interface companions such as the DP83822HRHBR can be paired with the FPGA for Ethernet PHY connectivity. Designers must partition the design across clock domains, constrain I/O timing, and ensure that the implemented Spartan-6 LX -2 resources meet packet-throughput requirements.
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Embedded Video and Image Processing
The XC6SLX75-2FGG676I can serve as a programmable image or video-processing engine when a design requires parallel pixel interfaces, control logic, and moderate local processing. The 74,637 logic cells allow designers to implement pipelines, color conversion, scaling, synchronization, and interface bridging, while 408 I/O can accommodate substantial parallel data connectivity. Clocking and timing must be planned around the listed 667 MHz internal frequency and the -2 speed grade rather than inferred from device-family marketing claims. Because exact block-RAM and DSP counts were not supplied, video applications should first confirm those resources in the manufacturer datasheet and the selected AMD implementation tool.
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Test and Measurement Instrumentation
The XC6SLX75-2FGG676I is well suited to configurable test equipment because programmable acquisition, sequencing, pattern generation, and analysis can be consolidated into one device. Its 74,637 logic cells and 408 I/O offer enough capacity for parallel test channels and instrument control, while the -2 speed grade supports designs that do not require the XC6SLX75 -3 timing tier. The industrial temperature listing also supports controlled laboratory or industrial test environments. Signal integrity remains critical: designers should separate sensitive analog inputs, use appropriate grounding and isolation, constrain timing carefully, and confirm that the 1 mm pitch BGA assembly does not compromise component placement around sensitive analog sections.
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Communication and Data Acquisition
The XC6SLX75-2FGG676I can support data-acquisition and communication equipment that requires multiple simultaneous channels, high-speed parallel transfers, and configurable protocol handling. The 408 I/O provides extensive external connectivity, and the listed 667 MHz internal frequency is useful for parallel-to-serial conversion, clock-domain crossing, buffering, and real-time data organization. The -2 grade may offer a cost-effective balance when the design does not close timing in the faster -3 grade, but every high-speed interface must be constrained and verified. Power and signal-integrity planning should include continuous return paths, controlled-impedance routing, and separate treatment of digital, analog, and isolation domains.
추천
Programmable Logic and System Integration
The XC6SLX75-2FGG676I is useful for general programmable-logic consolidation where several fixed-function ICs would otherwise be assembled into one board. Designers can implement glue logic, bus arbitration, data formatting, control sequencing, and interface adaptation within 74,637 logic cells and 5,831 configurable logic blocks. Its 408 I/O reduces the need for external buffers where pin assignments permit, while the lead-free 676-ball FBGA supports compact, high-pin-count integration. The practical trade-off is that high-BGA pin count increases PCB cost and assembly complexity. Before committing, confirm resource utilization, timing closure, configuration requirements, and whether the larger XC6SLX100 would provide useful headroom.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC6SLX75-2FGG676I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC6SLX75-2FG676I | XC6SLX75-3FGG676C | XC6SLX75-3FGG676I | XC6SLX45-2FGG676I | XC6SLX95-2FGG676I | XC6SLX100-2FGG676I |
|---|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-ball FBGA, 27 mm × 27 mm, 1 mm pitch | 676-BGA | 676-ball FBGA | 676-ball FBGA | 676-ball FBGA | 676-ball FBGA | 676-ball FBGA |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -2 | -2 | -3 | -3 | -2 | -2 | -2 |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
주요 차별점
- Provides more logic density than the smaller XC6SLX45 candidate (vs XC6SLX45-2FGG676I)
- Avoids the extra resource capacity and associated design overhead of the LX100 (vs XC6SLX100-2FGG676I)
- Retains the lower-cost -2 performance class when timing permits (vs XC6SLX75-3FGG676C)
- Maintains 676-ball family packaging across compared Spartan-6 LX options (vs XC6SLX95-2FGG676I)
설계 노트
Use the exact manufacturer land pattern for the 676-ball FBGA rather than generating it from a generic BGA library. The package is 27 mm by 27 mm with 1 mm ball pitch, so small errors in pad diameter, solder-mask definition, or ball map can cause bridging or open joints. Confirm whether the PCB uses conventional solder-mask-defined pads or a non-wet-defined process compatible with the selected assembly method, and validate the stack-up, via-in-pad usage, and paste volume before fabrication.
Partition the FPGA rails according to the manufacturer power-supply topology and the voltage assigned to each I/O bank. The verified listing confirms a nominal 1 V supply, but it does not expose every core, auxiliary, and I/O rail value. Decouple each required rail near its supply pins, provide adequate bulk energy for configuration and simultaneous switching, and verify sequencing against the selected startup mode. Do not assign I/O standards or voltages until the bank-level constraints have been checked in the manufacturer data.
Estimated thermal behavior depends on clocking, I/O activity, utilization, voltage, ambient temperature, and the PCB thermal design; the verified excerpts do not provide power, junction-temperature, or thermal-resistance figures, so a defensible numerical estimate cannot be calculated. Use the AMD toolchain to estimate device power, place thermal vias beneath the BGA where assembly rules allow, and preserve uninterrupted copper planes for core and I/O current return. Validate the assembled board at maximum expected ambient temperature rather than relying on nominal FPGA power alone.
Treat all high-speed FPGA interfaces as constrained, length-aware routes. Match impedance to the selected PCB stack-up, avoid routing high-speed clocks adjacent to noisy switching nets, provide continuous reference planes, and use proper source-synchronous spacing where required. The 408 available I/O do not guarantee that all 408 can be user I/O, because configuration, power, ground, clock, and dedicated pins reduce the usable count. Reconcile the final pin plan with the manufacturer package drawing.
규정 준수 정보
The verified FindIC record explicitly identifies the device as lead free. The verified excerpts do not provide direct RoHS, REACH, AEC-Q100, halogen-free, or conflict-minerals statements, so those fields remain unknown rather than assumed.