XC7VX690T-2FFG1761I - Virtex-7 XT FPGA 693K Logic Cells | AMD
부품 번호: XC7VX690T-2FFG1761I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12500 | $12,500.00 |
| 10 | $11800 | $118,000.00 |
| 100 | $10500 | $1,050,000.00 |
| 500 | $9800 | $4,900,000.00 |
| 1,000 | $9200 | $9,200,000.00 |
XC7VX690T-2FFG1761I 개요
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit between fixed-function ASICs and general-purpose processors in the semiconductor hierarchy. They are used to implement custom digital logic, signal processing, and high-speed connectivity functions that would otherwise require dedicated silicon.
Key features of the XC7VX690T-2FFG1761I include 850 user I/O pins, 54,190,080 bits of block RAM, and support for high-speed serial transceivers. The Virtex-7 XT family is optimized for high-bandwidth applications, offering up to 2.8 Tb/s of aggregate serial bandwidth. The device also includes hardened memory controllers, DSP slices, and clock management tiles (MMCM and PLL) for robust timing control.
From a technical perspective, the Virtex-7 XT architecture combines a large programmable fabric with dedicated hard IP blocks. The 28nm HKMG (High-K Metal Gate) process enables high logic density and low power consumption relative to older nodes. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the system.
Typical applications include data center acceleration, high-performance computing, wired and wireless communications, aerospace and defense systems, and medical imaging. The high transceiver count and logic capacity make it suitable for protocol bridging, packet processing, and real-time signal processing workloads.
When designing with this FPGA, careful attention must be paid to power supply decoupling, thermal management, and configuration bitstream security. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) and a reliable configuration source, such as a SPI flash or JTAG interface.
드롭인 대체품: XC7VX690T-2FFG1761I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC7VX690T-2FF1761I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7VX690T-2FFG1761C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7VX690T-2FF1761C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7VX690T-1FFG1761I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP4SE680F43C3N
⚡ 동일 패키지📋 참조 대체품 (카탈로그에 없음)
XC7VX690T-2FFG1761I 최대 정격 & 전기적 특성
| Family | Virtex-7 XT |
| Logic Cells | 693120 |
| Block RAM | 54190080 bits |
| User I/Os | 850 |
| 패키지 | 1760-BBGA, FCBGA (FFG1761) |
| Technology | 28nm |
| Core Voltage | 1V |
| 동작 온도 | -40C to +100C (I grade) |
| 실장 유형 | Surface Mount |
| ECCN | 3A001.a.7.a |
| RoHS 상태 | Compliant |
| REACH Status | Compliant |
| Conflict Minerals | DRC Conflict Free |
| Speed Grade | -2 |
| Configuration | SRAM-based, supports partial reconfiguration |
XC7VX690T-2FFG1761I 핀 구성
| 핀 A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| 핀 A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| 핀 B1 | VCCINT — Internal core voltage 1V |
| 핀 B2 | GND — Ground |
| 핀 C1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| 핀 C2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| 핀 D1 | VCCAUX — Auxiliary voltage 1.8V |
| 핀 D2 | GND — Ground |
| 핀 E1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| 핀 E2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| 핀 F1 | VCCO_0 — I/O bank 0 supply voltage |
| 핀 F2 | GND — Ground |
일반적인 애플리케이션
XC7VX690T-2FFG1761I 적합 용도: 6 애플리케이션s: Data Center Acceleration, High-Performance Computing, Wired Communications, Aerospace and Defense, Medical Imaging, Test and Measurement.
Data Center Acceleration
The XC7VX690T-2FFG1761I is ideal for data center acceleration due to its 693,120 logic cells and 850 I/Os, enabling complex packet processing and workload offload. Its high transceiver count supports 100GbE and PCIe interfaces, while the 54Mbit block RAM buffers large data streams. Designers can implement custom algorithms in the fabric, achieving lower latency than CPU-based processing. The 28nm process balances performance and power, making it suitable for rack-mounted servers where thermal density is a concern.
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High-Performance Computing
In HPC clusters, the XC7VX690T-2FFG1761I accelerates scientific simulations and AI inference. Its 693K logic cells implement systolic arrays for matrix multiplication, while the 850 I/Os connect to high-bandwidth memory. The device's DSP slices and block RAM enable efficient FFT and convolution operations. Compared to GPUs, FPGAs offer lower latency and deterministic timing, which is critical for real-time simulations. The industrial temperature grade (-40C to +100C) ensures reliability in demanding compute environments.
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Wired Communications
The XC7VX690T-2FFG1761I excels in wired communications, supporting 100GbE, OTN, and FlexE interfaces. Its high-speed transceivers and 850 I/Os connect directly to optical modules and switch fabrics. The 54Mbit block RAM stores forwarding tables and packet buffers, while the logic cells implement traffic management and QoS algorithms. The device's 28nm technology reduces power per bit, enabling dense line cards. Designers can use partial reconfiguration to update protocols without service interruption, a key advantage in carrier-grade equipment.
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Aerospace and Defense
For aerospace and defense, the XC7VX690T-2FFG1761I provides the logic density for radar, EW, and secure communications. Its industrial temperature grade and 28nm radiation-tolerant process (with appropriate mitigation) support harsh environments. The 850 I/Os interface with sensors and actuators, while the logic cells implement beamforming and signal processing. The device's configuration security features protect against bitstream tampering, a critical requirement for defense systems. The 1760-ball FCBGA package offers robust mechanical reliability under vibration.
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Medical Imaging
The XC7VX690T-2FFG1761I powers advanced medical imaging systems like CT and MRI. Its 693K logic cells implement real-time image reconstruction and filtering, while the 54Mbit block RAM stores intermediate frames. The 850 I/Os connect to high-speed ADCs and display interfaces. The device's deterministic timing ensures consistent image quality, and the industrial temperature grade supports the thermal demands of imaging equipment. Compared to GPUs, FPGAs offer lower power consumption, which is beneficial for portable and space-constrained medical devices.
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Test and Measurement
In test and measurement, the XC7VX690T-2FFG1761I enables high-speed data acquisition and signal generation. Its logic cells implement custom triggering and analysis algorithms, while the 850 I/Os connect to high-speed ADCs and DACs. The 54Mbit block RAM buffers captured waveforms, and the device's transceivers support PXIe and other instrument buses. The 28nm process provides low jitter, essential for accurate measurements. Engineers can reconfigure the FPGA for different test scenarios, making it a versatile platform for benchtop and ATE systems.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC7VX690T-2FFG1761I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7VX690T-2FF1761I | XC7VX690T-2FFG1761C | XC7VX690T-2FF1761C | XC7VX690T-1FFG1761I | EP4SE680F43C3N |
|---|---|---|---|---|---|---|
| Package | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | Intel |
주요 차별점
- Industrial temperature grade (vs XC7VX690T-2FFG1761C)
- RoHS-compliant finish (vs XC7VX690T-2FF1761I)
- Higher speed grade (vs XC7VX690T-1FFG1761I)
설계 노트
The XC7VX690T-2FFG1761I requires multiple power rails: VCCINT at 1V, VCCAUX at 1.8V, and VCCO for each I/O bank. Use a dedicated power management IC with sequencing to avoid latch-up. Decouple each rail with 100nF and 10uF capacitors placed close to the FPGA pins. The total power consumption can exceed 30W under heavy utilization, so plan for adequate current capacity in the power supply design.
With a 1760-ball FCBGA package, the XC7VX690T-2FFG1761I can dissipate significant heat. Use a heatsink with forced airflow for designs exceeding 10W. The thermal resistance (theta_JA) depends on the PCB copper area and airflow; a typical value is 8-10 C/W with a heatsink. Ensure the junction temperature stays below 100C for the industrial grade. Consider using thermal vias under the package to improve heat transfer to the PCB.
The 1760-ball FCBGA requires a high-layer-count PCB (16-20 layers) for routing. Use controlled impedance traces for high-speed transceivers and match trace lengths for differential pairs. Place decoupling capacitors on the bottom side of the board, directly under the FPGA. Follow AMD's PCB design guidelines (UG803) for power integrity and signal integrity. The package has a 1.0mm ball pitch, requiring fine-pitch PCB fabrication capabilities.
규정 준수 정보
EU RoHS Compliant, REACH Compliant, DRC Conflict Free per Abacus Technologies.
