XC7VX690T-2FFG1761I - Virtex-7 XT FPGA 693K Logic Cells | AMD
MPN: XC7VX690T-2FFG1761I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12500 | $12,500.00 |
| 10 | $11800 | $118,000.00 |
| 100 | $10500 | $1,050,000.00 |
| 500 | $9800 | $4,900,000.00 |
| 1,000 | $9200 | $9,200,000.00 |
Drop-in alternatives for XC7VX690T-2FFG1761I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7VX690T-2FF1761I
β Drop-Inπ Reference alternative (not in catalog)
XC7VX690T-2FFG1761C
β Drop-Inπ Reference alternative (not in catalog)
XC7VX690T-2FF1761C
β Drop-Inπ Reference alternative (not in catalog)
XC7VX690T-1FFG1761I
β Drop-Inπ Reference alternative (not in catalog)
EP4SE680F43C3N
β‘ Same Packageπ Reference alternative (not in catalog)
XC7VX690T-2FFG1761I Maximum Ratings & Electrical Characteristics
| Family | Virtex-7 XT |
| Logic Cells | 693120 |
| Block RAM | 54190080 bits |
| User I/Os | 850 |
| Package | 1760-BBGA, FCBGA (FFG1761) |
| Technology | 28nm |
| Core Voltage | 1V |
| Operating Temperature | -40C to +100C (I grade) |
| Mounting Type | Surface Mount |
| ECCN | 3A001.a.7.a |
| RoHS Status | Compliant |
| REACH Status | Compliant |
| Conflict Minerals | DRC Conflict Free |
| Speed Grade | -2 |
| Configuration | SRAM-based, supports partial reconfiguration |
XC7VX690T-2FFG1761I Pin Configuration
| Pin A1 | IO_L1P_T0 β User I/O bank 0, differential pair P |
| Pin A2 | IO_L1N_T0 β User I/O bank 0, differential pair N |
| Pin B1 | VCCINT β Internal core voltage 1V |
| Pin B2 | GND β Ground |
| Pin C1 | IO_L2P_T0 β User I/O bank 0, differential pair P |
| Pin C2 | IO_L2N_T0 β User I/O bank 0, differential pair N |
| Pin D1 | VCCAUX β Auxiliary voltage 1.8V |
| Pin D2 | GND β Ground |
| Pin E1 | IO_L3P_T0 β User I/O bank 0, differential pair P |
| Pin E2 | IO_L3N_T0 β User I/O bank 0, differential pair N |
| Pin F1 | VCCO_0 β I/O bank 0 supply voltage |
| Pin F2 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7VX690T-2FFG1761I is suitable for 6 applications: Data Center Acceleration, High-Performance Computing, Wired Communications, Aerospace and Defense, Medical Imaging, Test and Measurement.
Data Center Acceleration
The XC7VX690T-2FFG1761I is ideal for data center acceleration due to its 693,120 logic cells and 850 I/Os, enabling complex packet processing and workload offload. Its high transceiver count supports 100GbE and PCIe interfaces, while the 54Mbit block RAM buffers large data streams. Designers can implement custom algorithms in the fabric, achieving lower latency than CPU-based processing. The 28nm process balances performance and power, making it suitable for rack-mounted servers where thermal density is a concern.
Recommended
High-Performance Computing
In HPC clusters, the XC7VX690T-2FFG1761I accelerates scientific simulations and AI inference. Its 693K logic cells implement systolic arrays for matrix multiplication, while the 850 I/Os connect to high-bandwidth memory. The device's DSP slices and block RAM enable efficient FFT and convolution operations. Compared to GPUs, FPGAs offer lower latency and deterministic timing, which is critical for real-time simulations. The industrial temperature grade (-40C to +100C) ensures reliability in demanding compute environments.
Recommended
Wired Communications
The XC7VX690T-2FFG1761I excels in wired communications, supporting 100GbE, OTN, and FlexE interfaces. Its high-speed transceivers and 850 I/Os connect directly to optical modules and switch fabrics. The 54Mbit block RAM stores forwarding tables and packet buffers, while the logic cells implement traffic management and QoS algorithms. The device's 28nm technology reduces power per bit, enabling dense line cards. Designers can use partial reconfiguration to update protocols without service interruption, a key advantage in carrier-grade equipment.
Recommended
Aerospace and Defense
For aerospace and defense, the XC7VX690T-2FFG1761I provides the logic density for radar, EW, and secure communications. Its industrial temperature grade and 28nm radiation-tolerant process (with appropriate mitigation) support harsh environments. The 850 I/Os interface with sensors and actuators, while the logic cells implement beamforming and signal processing. The device's configuration security features protect against bitstream tampering, a critical requirement for defense systems. The 1760-ball FCBGA package offers robust mechanical reliability under vibration.
Recommended
Medical Imaging
The XC7VX690T-2FFG1761I powers advanced medical imaging systems like CT and MRI. Its 693K logic cells implement real-time image reconstruction and filtering, while the 54Mbit block RAM stores intermediate frames. The 850 I/Os connect to high-speed ADCs and display interfaces. The device's deterministic timing ensures consistent image quality, and the industrial temperature grade supports the thermal demands of imaging equipment. Compared to GPUs, FPGAs offer lower power consumption, which is beneficial for portable and space-constrained medical devices.
Recommended
Test and Measurement
In test and measurement, the XC7VX690T-2FFG1761I enables high-speed data acquisition and signal generation. Its logic cells implement custom triggering and analysis algorithms, while the 850 I/Os connect to high-speed ADCs and DACs. The 54Mbit block RAM buffers captured waveforms, and the device's transceivers support PXIe and other instrument buses. The 28nm process provides low jitter, essential for accurate measurements. Engineers can reconfigure the FPGA for different test scenarios, making it a versatile platform for benchtop and ATE systems.
Recommended
Recommended Products Summary
Engineering reference data for XC7VX690T-2FFG1761I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7VX690T-2FF1761I | XC7VX690T-2FFG1761C | XC7VX690T-2FF1761C | XC7VX690T-1FFG1761I | EP4SE680F43C3N |
|---|---|---|---|---|---|---|
| Package | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | Intel |
| Logic Cells | 693120 | 693120 | 693120 | 693120 | 693120 | [DATA_NEEDED] |
| Block RAM | 54190080 bits | 54190080 bits | 54190080 bits | 54190080 bits | 54190080 bits | [DATA_NEEDED] |
| User I/Os | 850 | 850 | 850 | 850 | 850 | [DATA_NEEDED] |
| Speed Grade | -2 | -2 | -2 | -2 | -1 | [DATA_NEEDED] |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | [DATA_NEEDED] |
| RoHS | Compliant | Non-compliant | Compliant | Non-compliant | Compliant | [DATA_NEEDED] |
Key Differentiators
- Industrial temperature grade (vs XC7VX690T-2FFG1761C)
- RoHS-compliant finish (vs XC7VX690T-2FF1761I)
- Higher speed grade (vs XC7VX690T-1FFG1761I)
Design Notes
The XC7VX690T-2FFG1761I requires multiple power rails: VCCINT at 1V, VCCAUX at 1.8V, and VCCO for each I/O bank. Use a dedicated power management IC with sequencing to avoid latch-up. Decouple each rail with 100nF and 10uF capacitors placed close to the FPGA pins. The total power consumption can exceed 30W under heavy utilization, so plan for adequate current capacity in the power supply design.
With a 1760-ball FCBGA package, the XC7VX690T-2FFG1761I can dissipate significant heat. Use a heatsink with forced airflow for designs exceeding 10W. The thermal resistance (theta_JA) depends on the PCB copper area and airflow; a typical value is 8-10 C/W with a heatsink. Ensure the junction temperature stays below 100C for the industrial grade. Consider using thermal vias under the package to improve heat transfer to the PCB.
The 1760-ball FCBGA requires a high-layer-count PCB (16-20 layers) for routing. Use controlled impedance traces for high-speed transceivers and match trace lengths for differential pairs. Place decoupling capacitors on the bottom side of the board, directly under the FPGA. Follow AMD's PCB design guidelines (UG803) for power integrity and signal integrity. The package has a 1.0mm ball pitch, requiring fine-pitch PCB fabrication capabilities.
Compliance Information
EU RoHS Compliant, REACH Compliant, DRC Conflict Free per Abacus Technologies.
