XCKU3P-1FFVA676E - Kintex UltraScale+ FPGA, 676-FCBGA | AMD Xilinx
부품 번호: XCKU3P-1FFVA676E ✓ 활성XCKU3P-1FFVA676E 개요
A field-programmable gate array is a programmable logic device: an array of configurable logic blocks, block RAM, DSP arithmetic slices and high-speed I/O that is configured at power-up from a bitstream rather than being permanently masked in silicon. FPGAs sit at the top of the programmable-logic hierarchy, above fixed-function ASICs in flexibility and above microcontrollers in datapath throughput. Kintex UltraScale+ occupies the middle of AMD's portfolio, between the cost-optimized Artix-7/Zynq families and the highest-capacity Virtex UltraScale+ devices.
The KU3P device combines roughly 355,950 logic cells with the UltraScale+ DSP48E2 arithmetic pipeline and 16.3 Mb of block RAM per slice group, delivering high performance per watt for mid-range designs. Key platform features include SelectIO resources with back-ported I/O, up to 16.3 Gb/s GTY transceivers, and the AXI4 interconnect fabric that links programmable logic to hard DSP blocks and memory. A dedicated security subsystem supports bitstream encryption and authentication for design-IP protection.
Mechanically, the 676-FCBGA lands on a 31 x 31 mm substrate and is intended for multilayer boards with via-in-pad and micro-BGA fanout design rules. Because the package offers no user I/O beyond the specified 256 balls, the majority of the board budget is spent on power, clocking, and high-speed routing rather than on peripheral connectivity. Configuration data is loaded through the standard AMD configuration path, and the part is supported by the AMD Vivado design suite.
Typical applications for the XCKU3P-1FFVA676E include industrial control and automation platforms, professional broadcast and video infrastructure, aerospace and defence instrumentation, telecom line-card and baseband processing, and test and measurement systems that need a large amount of parallel logic and DSP throughput in a single package.
When planning the board, treat power delivery as the primary risk: UltraScale+ devices require multi-rail sequencing, and decoupling must follow the recommended high-frequency capacitor layout from the AMD package pinout and design documentation. Provide a solid ground plane, follow the recommended BGA fanout and via-in-pad geometry, and keep the high-speed transceiver reference design rules intact if the design uses GTY links.
This page consolidates distributor availability, verified package and speed-grade data, pin-compatible family alternatives, and practical design guidance in one place so that engineers can qualify the KU3P device quickly, and compare it against the KU5P and -2 speed-grade options before committing to a layout.
드롭인 대체품: XCKU3P-1FFVA676E — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XCKU3P-1FFVA676E (동일 폼 팩터 및 풋프린트) — 차이점: Device Type, Package, Logic Cells, Temperature Grade, Speed Grade.
XCKU3P-1FFVB676E
✅ 드롭인가격 문의
데이터시트 보기 →XCKU3P-2FFVA676E
✅ 드롭인가격 문의
데이터시트 보기 →XCKU5P-2FFVA676E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCKU3P-1FFVB676I
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →XCKU3P-2FFVB676I
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →XCKU3P-1FFVA676E 최대 정격 & 전기적 특성
| Device Type | Kintex UltraScale+ FPGA (Field Programmable Gate Array) |
| Logic Cells | 355,950 (as published in distributor listings) |
| Number of Gates | 31,641,600 (as published in distributor listings) |
| User I/O Count | 256 |
| 최대 클록 주파수 | 667 MHz |
| 패키지 | 676-BBGA (FCBGA), 31 x 31 mm |
| Total Ball Count | 676 |
| Device Series | Kintex UltraScale+ (KU3P) |
| Speed Grade | -1 |
| Programming Technology | SRAM-based, volatile configuration (FPGA) |
| 실장 유형 | Surface Mount |
XCKU3P-1FFVA676E 676-bbga (fcbga), 31 x 31 mm 핀 구성 가이드
XCKU3P-1FFVA676E(676-bbga (fcbga), 31 x 31 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XCKU3P-1FFVA676E.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XCKU3P-1FFVA676E 적합 용도: 6 애플리케이션s: Industrial Automation and PLC Control Platforms, Telecom Baseband and Line-Card Processing, Broadcast and Professional Video Infrastructure, Aerospace, Defence and Test Instrumentation, Test and Measurement Equipment, Industrial IoT Edge and Sensor Fusion Hubs.
Industrial Automation and PLC Control Platforms
The XCKU3P-1FFVA676E fits machine-vision inspection, motion control and multi-axis PLC platforms because 355,950 logic cells absorb parallel encoder, IO-Link and safety logic while DSP48E2 slices handle servo-loop filtering and vibration analysis on the same die. The 256 user I/O in the 676-FCBGA package leave the remaining board area for isolated digital and analog front ends. With the -1 speed grade the device balances performance against the thermal load inside a sealed cabinet. Use the industrial-temperature ordering option in the same 676-ball family when the ambient range exceeds consumer limits, and drive it from a single synchronised clock tree to avoid jitter on the motion-control loops.
추천
Telecom Baseband and Line-Card Processing
Baseband and line-card designs need dense logic for symbol-level filtering plus dedicated arithmetic for the FFT and FEC path, which is exactly the split the Kintex UltraScale+ KU3P provides. The XCKU3P-1FFVA676E places the datapath, control microcode logic and GTY serial links in one 676-ball FCBGA package, removing inter-package latency on wide parallel buses. Because the device is a -1 speed grade, power stays inside a typical line-card thermal envelope without forced air. Use the AMD package pinout files to place the transceiver reference design layout, and confirm link count and data rate against your target grade before committing to a board spin.
추천
Broadcast and Professional Video Infrastructure
Video infrastructure designs such as frame synchronisers, wall controllers and analyser platforms are dominated by wide pixel buses and heavy pixel-pipeline arithmetic. The XCKU3P-1FFVA676E handles the pixel-domain logic in its 355,950 logic cells while DSP48E2 slices run scaling, gamma and colour-space conversion, and the 256 user I/O support multi-channel parallel video interfaces without external glue logic. The 676-FCBGA footprint keeps the high-speed pixel routing on a compact substrate. For 4K and beyond, check the I/O count and pin placement carefully against your video interface standard, and confirm the speed grade is adequate for your pixel clock before finalising the design.
추천
Aerospace, Defence and Test Instrumentation
Instrumentation and defence electronics value deterministic timing, long device availability and the ability to reconfigure hardware in the field. The XCKU3P-1FFVA676E provides programmable logic for acquisition and control paths plus DSP48E2 arithmetic for filters and FFT-based analysis, all inside a single 676-FCBGA package with no external processor needed for basic control flow. Select the appropriate temperature-grade ordering code for your environmental envelope, and confirm security features such as bitstream encryption and authentication are enabled in your Vivado configuration. For space-qualified flows, review the radiation and reliability data for the exact part number with the manufacturer before design freeze.
추천
Test and Measurement Equipment
Automated test equipment and bench instruments need wide parallel capture, precise clocking and heavy pattern arithmetic in a small, low-power package. The XCKU3P-1FFVA676E supports dense acquisition pipelines, pattern generation and DSP-based filtering while the 256 I/O drive instrument front-panel logic and status multiplexing. Placing control logic, acquisition and analysis on one device removes the latency of a processor-plus-FPGA split and simplifies trigger timing. Use the -1 speed grade where the thermal envelope is passive, and plan the layout with the BGA fanout and via-in-pad rules from the AMD package documentation to keep high-speed analogue-adjacent routing clean.
추천
Industrial IoT Edge and Sensor Fusion Hubs
Edge gateways that aggregate sensors, run local analytics and drive actuators benefit from a single device that handles protocol termination, time stamping and filtering without a separate processor. The XCKU3P-1FFVA676E offloads protocol parsing and sensor fusion into 355,950 logic cells and DSP48E2 slices, keeping latency low and boot time short. Its 676-FCBGA package and low -1 speed grade suit compact, fanless enclosures where power, not raw throughput, is the constraint. Plan for configuration storage in external flash, keep the JTAG and configuration pins accessible for field updates, and verify the supply rails meet the sequencing rules in the AMD power documentation.
추천
추천 제품 요약
엔지니어링 참조 데이터: XCKU3P-1FFVA676E — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XCKU3P-1FFVB676E | XCKU3P-2FFVA676E | XCKU5P-2FFVA676E | XCKU3P-1FFVB676I | XCKU3P-2FFVB676I |
|---|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | 676-BBGA (FCBGA) | 676-BBGA (FCBGA) - same land pattern | 676-BBGA (FCBGA) - same land pattern | 676-BBGA (FCBGA) - same land pattern | 676-BBGA (FCBGA) - same land pattern | 676-BBGA (FCBGA) - same land pattern |
| Speed Grade | -1 | -1 | -2 | -2 | -1 | -2 |
| Temperature Grade Suffix | Standard (no I suffix) | Standard (no I suffix) | Standard (no I suffix) | Standard (no I suffix) | Industrial (-I suffix) | Industrial (-I suffix) |
| Device Family | Kintex UltraScale+ KU3P | Kintex UltraScale+ KU3P | Kintex UltraScale+ KU3P | Kintex UltraScale+ KU5P (larger device) | Kintex UltraScale+ KU3P | Kintex UltraScale+ KU3P |
| Programmable Logic Type | FPGA (SRAM-based, volatile configuration) | FPGA (SRAM-based, volatile configuration) | FPGA (SRAM-based, volatile configuration) | FPGA (SRAM-based, volatile configuration) | FPGA (SRAM-based, volatile configuration) | FPGA (SRAM-based, volatile configuration) |
주요 차별점
- Same 676-ball FCBGA land pattern across five qualified alternatives (vs XCKU3P-1FFVB676E)
- Clear I/O headroom difference versus the A-suffix part (vs XCKU3P-1FFVB676E)
- Speed-grade headroom without changing the footprint (vs XCKU3P-2FFVA676E)
- Capacity upgrade path on the existing board (vs XCKU5P-2FFVA676E)
- Temperature-grade coverage without a footprint change (vs XCKU3P-1FFVB676I)
설계 노트
UltraScale+ devices use multiple supply rails that must be brought up in a defined order; violating the sequence can cause latch-up or erratic startup behaviour. Follow the AMD power-supply sequencing guidance for the KU3P, provide a high-current auxiliary rail, and use the recommended bulk plus high-frequency decoupling close to the device power balls. Use the AMD power estimator with your real utilisation, clocking and I/O toggle rates rather than a worst-case nominal number, then size the regulators so the rails do not droop during burst activity.
The 676-FCBGA land pattern requires a disciplined escape strategy. Adopt via-in-pad or micro-BGA fanout per the package design guide, route power and ground on inner layers with a solid reference plane, and keep the ball escape short and symmetric so that channel-to-channel skew between parallel I/O stays inside your timing budget. Obtain the official UltraScale+ package device pinout files from AMD and build the footprint from those ball assignments rather than from a generic 676-ball library.
A KU3P in the 676-FCBGA package dissipates power that depends on logic utilisation, clock frequency and transceiver activity, so thermal design must be based on the estimated worst case rather than typical. Provide a continuous ground plane for heat spreading into the board, keep the device away from heat sources on the assembly, and check junction temperature with the recommended airflow assumptions. If the -2 grade is substituted for the -1 grade, re-run the estimate, since the faster grade typically raises dynamic power.
The most frequent design errors on this device are a mismatched speed or temperature grade in the BOM, an incomplete bitstream configuration path, and under-specified I/O standards for the chosen package option. Verify that the part number suffix matches the required ambient range, that configuration memory and the boot path are correctly implemented, and that every pin assigned in the constraints file exists in the selected package. When migrating between A and B suffix options, re-check I/O availability because the published counts differ.
If the design uses GTY high-speed transceivers, the reference design layout, length matching and bias network must be reproduced exactly; small deviations cause eye closure and intermittent link errors that look like firmware bugs. Keep the transceiver supply filtering close to the device, provide a clean low-noise reference clock, and separate high-speed differential pairs from noisy switching nets on adjacent layers with continuous return-path planes underneath.
규정 준수 정보
Compliance declarations for this exact ordering code are not stated in the distributor listings shown; confirm RoHS, REACH and lead-free status with the manufacturer for the specific part number and package. Industrial-temperature ordering options exist in the same 676-ball family, but AEC-Q100 qualification is not stated and must be verified per part number.
