XCKU3P-1FFVB676I - Kintex UltraScale+ FPGA | AMD
부품 번호: XCKU3P-1FFVB676I ✓ 활성XCKU3P-1FFVB676I 개요
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after manufacture. FPGA architecture belongs to the broader programmable-logic hierarchy and can be classified as a semiconductor, integrated circuit, and digital logic device. Instead of implementing every digital function with fixed application-specific circuitry, an FPGA combines configurable logic blocks and dedicated hard resources with an interconnect fabric. This enables parallel processing, rapid hardware revision, and high integration in systems that require deterministic real-time behavior.
The XCKU3P family targets demanding communications, industrial, networking, signal-processing, and embedded-control systems. A Kintex UltraScale+ FPGA is useful when a design needs substantially more logic and serial throughput than lower-density programmable devices, while retaining a single-package implementation. The device combines a -1 performance grade with a large 676-pin package that provides extensive package I/O and power connectivity. Exact logic-cell, memory, DSP, I/O, and power specifications should be taken from the current AMD Kintex UltraScale+ data sheet for the selected package and speed grade.
Use the part in designs that benefit from parallel datapaths, hardware-assisted filtering, protocol termination, high-speed data movement, or adaptive control. Common engineering roles include accelerator logic, video and image processing, industrial control, test instrumentation, communications infrastructure, and high-speed interface bridging. AMD UltraScale+ devices use programmable logic, block RAM, DSP slices, high-speed I/O, and integrated power-management resources, allowing one device to implement control, datapath, and interface functions in parallel rather than requiring several discrete components.
The 676-ball FCBGA package is mechanically and electrically demanding. Board design must follow the AMD package pinout files and the device PCB-design guidance, including exact power and ground-plane connections, via arrays, decoupling placement, and ball-grid escape routing. Differential and high-speed interfaces require controlled impedance, careful return-path continuity, and compliance with the stated maximum transition-rate and board-routing constraints. Use the package-device pinout files from AMD when assigning every ball and when cross-checking the schematic, PCB library, and assembly drawings.
Thermal design is also central to FPGA implementation because logic utilization, I/O activity, and switching can increase dynamic power. The power budget should be calculated from the actual clocking, memory, DSP, serial-link, and I/O assumptions in the design, including worst-case activity factors. A conservative approach is to use the AMD power estimator and system-design guidance with the exact device, package, speed grade, and utilization. This page identifies the verified commercial configuration and the engineering constraints that should be checked before schematic release.
This product record combines the verified XCKU3P-1FFVB676I configuration, package information, related same-footprint variants, selection trade-offs, and practical implementation guidance. It is intended to help engineers identify the correct AMD/Xilinx Kintex UltraScale+ device and prepare a package-compliant, thermally valid, and production-ready FPGA design.
드롭인 대체품: XCKU3P-1FFVB676I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XCKU3P-1FFVB676I (동일 폼 팩터 및 풋프린트) — 차이점: Device Type, Package, Speed Grade, Mounting Type, Logic Cells.
XCKU3P-2FFVB676I
✅ 드롭인가격 문의
데이터시트 보기 →XCKU3P-1FFVB676E
✅ 드롭인가격 문의
데이터시트 보기 →XCKU3P-L1FFVB676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCKU3P-1FFVB676C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCKU3L-1FFVB676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCKU3P-1FFVB676I 최대 정격 & 전기적 특성
| Device Type | Kintex UltraScale+ FPGA |
| Programmable Logic Blocks | 162720 blocks |
| Speed Grade | -1 |
| 패키지 | 676-BBGA FCBGA |
| Ball Count | 676 balls |
| Programmable Logic | 31641600 gates |
| Fabric Capacity Indicator | 355950 units |
| I/O Capability Indicator | 280 units |
| Operating Temperature Grade | Industrial temperature suffix I |
| 실장 유형 | Surface mount |
| AEC-Q100 Qualification | Not applicable |
XCKU3P-1FFVB676I 676-bbga fcbga 핀 구성 가이드
XCKU3P-1FFVB676I(676-bbga fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XCKU3P-1FFVB676I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XCKU3P-1FFVB676I 적합 용도: 6 애플리케이션s: High-Speed Communications Infrastructure, Parallel Digital Signal Processing, Industrial Control and Automation, Video and Image Processing, Aerospace and Defense Instrumentation, Programmable Test and Measurement.
High-Speed Communications Infrastructure
The XCKU3P-1FFVB676I fits communications infrastructure requiring parallel packet processing, protocol termination, and high-speed data movement in one package. Its Kintex UltraScale+ architecture includes programmable logic, block RAM, DSP, high-speed I/O, and serial transceivers, while the listed 162,720 logic blocks provide substantial implementation capacity. The -1 grade must be checked against the required line rate and timing margin, and the FFVB676 package requires careful power, decoupling, and differential-routing discipline. Use the exact AMD transceiver and pinout documentation to confirm lane availability, reference-clock topology, PCB layer transitions, and implemented interface specifications.
추천
Parallel Digital Signal Processing
The XCKU3P-1FFVB676I is suitable for parallel filters, waveform generation, spectral processing, and fixed-point accelerator functions requiring multiple simultaneous arithmetic operations. Its 162,720 listed programmable logic blocks and dedicated Kintex UltraScale+ DSP resources allow datapaths to be mapped in parallel, reducing the need for serializing data through external processors. The -1 speed grade must support the target clock and pipeline timing, while the large FCBGA package offers extensive power and I/O connectivity. Use AMD's implementation and power-estimation tools with actual sample rates, coefficient storage, and DSP activity to verify timing closure and thermal performance.
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Industrial Control and Automation
The XCKU3P-1FFVB676I can serve as the programmable control core in factory automation, motion control, robotics, and machine vision systems where deterministic parallel logic is valuable. The I suffix identifies the target as an industrial-temperature-grade configuration, while the -1 speed grade supports clocked control, acquisition, and safety-adjacent logic paths. The 676-ball FCBGA requires a dense multilayer PCB with uninterrupted power planes, many decoupling capacitors, and careful thermal design. Engineers should map industrial I/O requirements against the exact package file, confirm isolation or protection circuitry outside the FPGA, and complete timing, EMC, and worst-case power validation before production release.
추천
Video and Image Processing
The XCKU3P-1FFVB676I fits video pipelines that need parallel pixel transport, real-time filtering, color conversion, or hardware acceleration. Its large logic capacity allows multiple image stages to run concurrently, and the dedicated DSP and block-memory resources can support arithmetic-heavy operations without external accelerators. The -1 grade should be compared with the target pixel clock and video-standard timing, while the FFVB676 footprint demands controlled escape routing from the BGA array to memory and connector interfaces. Use the AMD pinout files to assign memory, clocks, and I/O correctly, and budget continuous video traffic when estimating dynamic power and junction temperature.
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Aerospace and Defense Instrumentation
The XCKU3P-1FFVB676I can support modular test, telemetry, signal-conditioning, and embedded-processing systems when its exact temperature, radiation, reliability, and qualification requirements are satisfied. The I suffix and -1 speed grade are relevant identifiers, but they do not by themselves establish suitability for every aerospace or defense program. Designers should review the AMD ordering information, package documents, radiation reports, and reliability qualifications applicable to the exact suffix. Board construction must preserve supply integrity and thermal margins, while every high-speed route and power connection should be checked against the official package and PCB-design documentation.
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Programmable Test and Measurement
The XCKU3P-1FFVB676I is suitable for modular instruments that combine acquisition, pattern generation, real-time analysis, and programmable logic in one device. The extensive parallel resource count supports wide data paths and multiple concurrent test channels, while DSP and block RAM can accelerate filtering and transformation. The -1 grade must close timing for the selected sample rate and data path, and the BGA package requires careful sequencing of supply rails, clock distribution, and high-speed memory routing. Prototype designers should use AMD's device files, board-support documentation, and timing tools, and should reserve thermal analysis for sustained full-rate operation rather than short bench tests.
추천
추천 제품 요약
엔지니어링 참조 데이터: XCKU3P-1FFVB676I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XCKU3P-2FFVB676I | XCKU3P-1FFVB676E | XCKU3P-L1FFVB676I | XCKU3P-1FFVB676C | XCKU3L-1FFVB676I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-BBGA FCBGA | 676-BBGA FCBGA - same package | 676-BBGA FCBGA - same package | 676-BBGA FCBGA - same package | 676-BBGA FCBGA - same package | 676-BBGA FCBGA - same package |
| Device Family | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3L |
| Speed Grade | -1 | -2 | -1 | -1 | -1 | -1 |
| Temperature Suffix | I | I | E | I | C | I |
| Special Features | Kintex UltraScale+ FPGA with programmable logic, block RAM, DSP, serial I/O, and high-speed I/O | Higher -2 speed grade with corresponding performance and power characteristics | Extended-temperature suffix with XCKU3P feature set | L1 suffix designation with distinct ordering characteristics | Commercial-temperature suffix with XCKU3P feature set | Lower-capacity XCKU3L resource class |
주요 차별점
- Target -1 industrial-grade ordering configuration (vs XCKU3P-1FFVB676C)
- Broader deployment temperature positioning than the C suffix (vs XCKU3P-1FFVB676C)
- Same XCKU3P logic capacity with a selectable faster speed grade (vs XCKU3P-2FFVB676I)
- Full XCKU3P resource class rather than reduced XCKU3L capacity (vs XCKU3L-1FFVB676I)
설계 노트
Use AMD's power estimator with the exact XCKU3P-1FFVB676I device, -1 speed grade, FFVB676 package, clocks, utilization, I/O activity, and transceiver state. Connect every specified power and ground ball according to the official package files, provide local bulk and high-frequency decoupling, and keep the supply return path continuous. Because dynamic power depends on switching activity, do not base thermal design on an idle engineering sample; include sustained production-like activity and the worst-case ambient condition.
The 676-ball FCBGA requires a multilayer PCB with controlled escape routing, dense power connectivity, and package-specific via arrays. Cross-check every ball in the AMD FFVB676 pinout file against the schematic and footprint before fabrication. Place decoupling at the closest electrically suitable layer without blocking BGA-escape corridors, and route high-speed interfaces as controlled-impedance differential or single-ended paths with continuous references. Board-level signal-integrity and power-integrity simulation should include the actual stack-up and component placement.
Estimate junction temperature from actual clock activity, logic utilization, block RAM, DSP, transceiver, and I/O loading rather than nominal FPGA capacity alone. Use the package thermal model and board thermal boundary conditions defined by AMD. Keep heat-sensitive components away from the hottest area beneath the BGA, provide copper spreading where the design rules permit, and specify airflow or conduction paths appropriate to the enclosure. Validate the thermal design during sustained operation because short benchmark runs can underestimate self-heating.
Avoid substituting a related suffix without reviewing the AMD ordering guide. The -2 option changes speed grade and related power and timing behavior; E and C change temperature-grade meaning; L1 has its own ordering designation; and XCKU3L has lower resource capacity. For every substitution, rerun implementation, static timing, power estimation, thermal analysis, pin assignment, and validation. A matching package name alone does not prove functional equivalence or qualification.
규정 준수 정보
The verified product and comparison records identify RoHS and REACH comparison topics but do not provide explicit compliance declarations. Confirm the exact suffix with the current AMD environmental-product documentation before procurement.