XCZU9EG-1FFVB1156E - Zynq UltraScale+ MPSoC EG | AMD
MPN: XCZU9EG-1FFVB1156E β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3568.75 | $3,568.75 |
| 10 | $3420 | $34,200.00 |
| 100 | $3250 | $325,000.00 |
| 500 | $3100 | $1,550,000.00 |
| 1,000 | $2950 | $2,950,000.00 |
Drop-in alternatives for XCZU9EG-1FFVB1156E β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XCZU9EG-2FFVB1156E
β Drop-Inπ Reference alternative (not in catalog)
XCZU9EG-1FFVB1156I
β Drop-Inπ Reference alternative (not in catalog)
XCZU9EG-2FFVB1156I
β Drop-Inβ In Stock
$11800 / Unit
View Datasheet βXCZU7EV-2FFVC1156E
β‘ Same Packageπ Reference alternative (not in catalog)
XCZU11EG-1FFVC1156E
β‘ Same Packageπ Reference alternative (not in catalog)
XCZU9EG-1FFVB1156E Maximum Ratings & Electrical Characteristics
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2 |
| Speed | 500 MHz, 600 MHz, 1.2 GHz |
| Logic Cells | 599,550 |
| Block RAM | 32.1 Mb |
| DSP Slices | 2,520 |
| Package | 1156-FCBGA (35x35 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +100C (E grade) |
| Supply Voltage | 0.85V core (typical) |
| Process Technology | 16nm |
| Series | Zynq UltraScale+ MPSoC EG |
| Architecture | MCU, FPGA |
| Packaging | Tray |
| Product Status | Active |
| RoHS Status | Compliant |
XCZU9EG-1FFVB1156E Pin Configuration
| Pin A1 | GND β Ground |
| Pin A2 | VCCO_0 β I/O bank 0 supply voltage |
| Pin B1 | IO_L1P_T0_0 β User I/O, differential pair P |
| Pin B2 | IO_L1N_T0_0 β User I/O, differential pair N |
| Pin C1 | VCCINT β Internal core supply voltage |
| Pin C2 | GND β Ground |
| Pin D1 | IO_L2P_T1_0 β User I/O, differential pair P |
| Pin D2 | IO_L2N_T1_0 β User I/O, differential pair N |
| Pin E1 | VCCAUX β Auxiliary supply voltage |
| Pin E2 | GND β Ground |
| Pin F1 | IO_L3P_T2_0 β User I/O, differential pair P |
| Pin F2 | IO_L3N_T2_0 β User I/O, differential pair N |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XCZU9EG-1FFVB1156E is suitable for 6 applications: Software Defined Radio, Medical Imaging, Industrial Automation, Aerospace and Defense, 5G Infrastructure, Machine Vision.
Software Defined Radio
The XCZU9EG-1FFVB1156E is ideal for software-defined radio (SDR) systems due to its high logic density (599,550 cells) and DSP slices (2,520) that enable complex signal processing. The quad-core ARM Cortex-A53 at 1.2 GHz handles protocol stacks, while the programmable logic accelerates FFT and filtering. The Mali-400 GPU supports waveform visualization. This SoC reduces system latency by integrating processing and FPGA fabric, making it suitable for military and commercial SDR platforms.
Recommended
Medical Imaging
In medical imaging systems like ultrasound and CT scanners, the XCZU9EG-1FFVB1156E provides the processing power needed for real-time image reconstruction. The 2,520 DSP slices accelerate beamforming and filtering algorithms, while the ARM cores manage system control and communication. The high-speed transceivers enable data transfer from sensors. The device's low latency and high throughput ensure accurate and timely image processing, critical for diagnostic accuracy.
Recommended
Industrial Automation
The XCZU9EG-1FFVB1156E is well-suited for industrial automation and robotics, where real-time control and deterministic processing are essential. The dual-core ARM Cortex-R5 at 600 MHz provides real-time processing for motor control and safety functions, while the Cortex-A53 handles higher-level tasks like HMI and networking. The programmable logic can implement custom industrial protocols (e.g., EtherCAT) with low latency. This SoC enables a single-chip solution for complex automation systems.
Recommended
Aerospace and Defense
For aerospace and defense applications, the XCZU9EG-1FFVB1156E offers the performance and reliability required for mission-critical systems. The device's secure boot and AES decryption features ensure data integrity. The combination of ARM processing and FPGA fabric supports radar, electronic warfare, and secure communications. The industrial temperature variant (-I) is available for harsh environments. The high logic density enables complex algorithms to be implemented in hardware, reducing power and size.
Recommended
5G Infrastructure
The XCZU9EG-1FFVB1156E is designed for 5G base stations and edge computing nodes, where high throughput and low latency are critical. The programmable logic can implement PHY layer processing, while the ARM cores handle protocol stack and network management. The device supports high-speed transceivers for fronthaul/backhaul interfaces. Its power efficiency (16nm process) makes it suitable for remote radio heads and small cells, reducing cooling requirements.
Recommended
Machine Vision
In machine vision systems, the XCZU9EG-1FFVB1156E accelerates image processing algorithms such as object detection and classification. The 2,520 DSP slices and programmable logic enable real-time convolution and neural network inference. The ARM Cortex-A53 cores run the application software and communicate with cameras via MIPI or LVDS interfaces. The Mali-400 GPU can handle display output for operator interfaces. This SoC provides a complete vision processing platform in a single device.
Recommended
Recommended Products Summary
Engineering reference data for XCZU9EG-1FFVB1156E β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XCZU9EG-2FFVB1156E | XCZU9EG-1FFVB1156I | XCZU9EG-2FFVB1156I | XCZU7EV-2FFVC1156E |
|---|---|---|---|---|---|
| Package | 1156-FCBGA (35x35 mm) | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 599,550 | 599,550 | 599,550 | 599,550 | [DATA_NEEDED] |
| Speed Grade | -1 | -2 | -1 | -2 | -2 |
| Temperature Range | 0C to +100C | 0C to +100C | -40C to +100C | -40C to +100C | 0C to +100C |
| Core Voltage | 0.85V | 0.85V | 0.85V | 0.85V | 0.85V |
| DSP Slices | 2,520 | 2,520 | 2,520 | 2,520 | [DATA_NEEDED] |
| Block RAM | 32.1 Mb | 32.1 Mb | 32.1 Mb | 32.1 Mb | [DATA_NEEDED] |
Key Differentiators
- Higher speed grade option (vs XCZU9EG-1FFVB1156E (this product))
- Industrial temperature range (vs XCZU9EG-1FFVB1156E (this product))
- Larger logic density (vs XCZU7EV-2FFVC1156E)
Design Notes
The XCZU9EG-1FFVB1156E requires multiple power rails including VCCINT (0.85V), VCCAUX, and VCCO for I/O banks. Proper power sequencing is critical; refer to the Zynq UltraScale+ power management application note. Use low-ESR decoupling capacitors close to each power pin to minimize voltage ripple. A dedicated power management IC (PMIC) is recommended for reliable operation.
The XCZU9EG-1FFVB1156E can dissipate significant power under full load, potentially exceeding 10W. The 1156-FCBGA package requires a heatsink or active cooling for sustained operation. Ensure adequate airflow and consider a thermal interface material (TIM) between the package and heatsink. Monitor junction temperature to stay within the 0C to +100C range for the -E grade.
For the 1156-FCBGA package, use a high-layer-count PCB with controlled impedance for high-speed signals. Route differential pairs with proper spacing and ground planes. Place decoupling capacitors on the bottom side of the PCB directly under the BGA to minimize inductance. Follow AMD's PCB design guidelines in UG583 for optimal signal integrity.
Compliance Information
RoHS compliant per AMD product page. Not AEC-Q100 qualified; this is a commercial-grade SoC.
