XCZU42DR-1FSVE1156E - Zynq UltraScale+ RFSoC Gen 1 | AMD
부품 번호: XCZU42DR-1FSVE1156E ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
XCZU42DR-1FSVE1156E 개요
A Zynq UltraScale+ RFSoC is a heterogeneous computing platform that combines a multi-core ARM processing system (PS) with programmable logic (PL) and, in the RFSoC family, integrated RF data converters. This device class sits at the top of the adaptive SoC hierarchy, enabling software-defined radio, radar, and 5G NR baseband processing in a single chip. The RFSoC architecture eliminates the need for separate data converter ICs, reducing board area and power while improving signal integrity.
Key features of the XCZU42DR-1FSVE1156E include the 489K+ logic cells, which provide substantial programmable fabric for custom DSP and control logic. The quad-core Cortex-A53 cluster runs at up to 1.2 GHz, suitable for Linux-based application processing, while the dual-core Cortex-R5 handles real-time tasks. The device supports a wide range of high-speed transceivers and memory interfaces, making it suitable for demanding compute and I/O workloads.
Technically, the RFSoC Gen 1 integrates RF data converters (ADCs and DACs) that operate at multi-GSPS sample rates, enabling direct RF sampling in transceiver designs. The programmable logic is built on the UltraScale+ 16nm FinFET process, offering high logic density and low power. The 1156-FCBGA package provides excellent thermal and electrical performance for high-speed signals.
Typical applications include 5G NR remote radio units (RRUs), phased-array radar, software-defined radio (SDR), and test and measurement equipment. The combination of ARM processing and dense programmable logic makes it ideal for signal processing chains that require both flexibility and performance.
When designing with this device, careful attention must be paid to power supply sequencing, clocking, and thermal management. The device requires multiple power rails with specific ramp-up sequences, and a high-quality reference clock is essential for the RF converters. Adequate decoupling and a low-impedance power distribution network are critical for reliable operation.
드롭인 대체품: XCZU42DR-1FSVE1156E — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XCZU42DR-1FSVE1156E (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XCZU42DR-2FSVE1156E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCZU42DR-1FSVE1156I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XCZU42DR-2FSVE1156I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3950 / 개
데이터시트 보기 →XCZU43DR-1FSVE1156E
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XCZU42DR-1FFVE1156E
⚡ 동일 패키지📋 참조 대체품 (카탈로그에 없음)
XCZU42DR-1FSVE1156E 최대 정격 & 전기적 특성
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight |
| Primary Attributes | Zynq UltraScale+ RFSoC, FPGA, 489K+ Logic Cells |
| Number of Logic Cells | 489K+ |
| Speed Grade | -1 |
| Maximum Clock Frequency (PL) | 500 MHz |
| Maximum Clock Frequency (PS) | 1.2 GHz |
| 패키지 / 케이스 | 1156-FCBGA (35x35 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +100C (Tj) |
| 공급 전압 | 0.85V core (typical) |
| RoHS 상태 | Compliant |
XCZU42DR-1FSVE1156E 1156-fcbga (35x35 mm) 핀 구성 가이드
XCZU42DR-1FSVE1156E(1156-fcbga (35x35 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XCZU42DR-1FSVE1156E.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XCZU42DR-1FSVE1156E 적합 용도: 6 애플리케이션s: 5G NR Remote Radio Unit (RRU), Phased-Array Radar, Software-Defined Radio (SDR), Test and Measurement Equipment, Military and Aerospace Communications, Wireless Infrastructure.
5G NR Remote Radio Unit (RRU)
The XCZU42DR-1FSVE1156E is ideal for 5G NR RRUs due to its integrated RF data converters and high-speed processing. The quad-core Cortex-A53 handles the protocol stack, while the FPGA fabric implements beamforming and signal processing. The 489K+ logic cells provide ample resources for complex algorithms, and the 1.2 GHz processor ensures low-latency control. This integration reduces board space and power compared to discrete solutions.
추천
Phased-Array Radar
In phased-array radar systems, the XCZU42DR-1FSVE1156E provides the necessary processing power for beamforming and target detection. The RFSoC's integrated converters enable direct sampling of multiple channels, reducing analog front-end complexity. The programmable logic can implement parallel FFTs and matched filters, while the ARM cores handle system control and data formatting. The 500 MHz PL clock supports high-throughput processing.
추천
Software-Defined Radio (SDR)
The XCZU42DR-1FSVE1156E is well-suited for SDR platforms, offering flexibility through its programmable logic and processing system. The integrated RF converters allow for a wide range of frequencies to be sampled directly, simplifying the RF front-end. The ARM processors can run Linux for waveform control, while the FPGA fabric implements modulation and demodulation. This device enables a compact, reconfigurable radio.
추천
Test and Measurement Equipment
For test and measurement, the XCZU42DR-1FSVE1156E provides high-speed data acquisition and processing capabilities. The integrated ADCs and DACs can capture and generate wideband signals, while the FPGA fabric performs real-time analysis. The ARM cores handle user interfaces and data streaming. The 489K+ logic cells allow for complex triggering and measurement algorithms, making it a versatile platform for benchtop instruments.
추천
Military and Aerospace Communications
The XCZU42DR-1FSVE1156E is suitable for military and aerospace communications due to its high performance and reliability. The device's integrated RF converters support secure, wideband waveforms, while the programmable logic enables custom encryption and modulation. The quad-core A53 processor can handle network protocols, and the 1.2 GHz clock ensures real-time responsiveness. The 1156-FCBGA package is robust for harsh environments.
추천
Wireless Infrastructure
In wireless infrastructure, the XCZU42DR-1FSVE1156E can be used in baseband units and fronthaul processing. The device's processing system and programmable logic can handle multiple protocol layers, from PHY to MAC. The integrated converters support various radio configurations, and the high logic density allows for multi-standard support. This reduces the need for multiple discrete components, lowering system cost and power.
추천
추천 제품 요약
엔지니어링 참조 데이터: XCZU42DR-1FSVE1156E — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XCZU42DR-2FSVE1156E | XCZU42DR-1FSVE1156I | XCZU42DR-2FSVE1156I | XCZU43DR-1FSVE1156E | XCZU42DR-1FFVE1156E |
|---|---|---|---|---|---|---|
| Package | 1156-FCBGA (35x35 mm) | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same | 1156-FBGA (35x35 mm) - different |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Speed Grade | -1 | -2 | -1 | -2 | -1 | -1 |
| Temperature Grade | Extended (E) | Extended (E) | Industrial (I) | Industrial (I) | Extended (E) | Extended (E) |
| Logic Cells | 489K+ | 489K+ | 489K+ | 489K+ | Higher (e.g., 930K+) | 489K+ |
| Core Processor | Quad A53, Dual R5 | Quad A53, Dual R5 | Quad A53, Dual R5 | Quad A53, Dual R5 | Quad A53, Dual R5 | Quad A53, Dual R5 |
| Max PL Clock | 500 MHz | Higher (e.g., 600 MHz) | 500 MHz | Higher (e.g., 600 MHz) | 500 MHz | 500 MHz |
| Max PS Clock | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz |
주요 차별점
- Integrated RF data converters (vs XCZU42DR-2FSVE1156E)
- Lower speed grade for cost optimization (vs XCZU42DR-2FSVE1156E)
- Extended temperature grade (vs XCZU42DR-1FSVE1156I)
설계 노트
The XCZU42DR-1FSVE1156E requires multiple power rails with specific voltage levels and sequencing. Refer to the Zynq UltraScale+ power management documentation for the recommended power-up sequence. Use a dedicated power management IC (PMIC) to ensure proper sequencing and reduce design complexity. Adequate decoupling capacitors are essential for stable operation.
The 1156-FCBGA package can dissipate significant power, especially with high logic utilization and RF converters active. Use a heatsink and ensure adequate airflow in the system enclosure. The thermal resistance (theta_JA) depends on the PCB design and airflow. Perform thermal simulation to verify junction temperature stays within the specified range.
For high-speed signals, including the RF converters and transceivers, use controlled impedance traces and minimize via stubs. Follow the layout guidelines in the Zynq UltraScale+ PCB Design Guide (UG583). Keep the power distribution network low-impedance with multiple vias to the ground plane. Place decoupling capacitors close to the device pins.
규정 준수 정보
RoHS compliance is indicated by distributor listings. Other compliance details are not specified in the verified data.