10AS032H2F34I2LG vs 10AS032H2F34E2LG Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AS032H2F34I2LG disebabkan oleh Intel dan 10AS032H2F34E2LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr 10AS032H2F34I2LG 10AS032H2F34E2LG
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Product Type SoC FPGA (FPGA + ARM Cortex-A9 MPCore HPS) —
Family Arria 10 SX Arria 10 SX
Logic Elements 320,000 320,000
Hard Processor System Dual ARM Cortex-A9 MPCore with CoreSight —
HPS Maximum Clock 1.5 GHz —
Process Technology 20 nm —
Core Voltage (Vcc) 0.9 V —
Kemasan 1152-ball FC-FBGA, 35 x 35 mm 1152-ball FC-FBGA (F34), 35 x 35 mm
Package Code F34 (Flip-Chip BGA, 1.0 mm pitch) —
Terminal Form Ball —
Terminal Count 1152 —
Operating Temperature Grade Industrial (-40C to +100C) —
Jenis Pemasangan Surface Mount Surface Mount (BGA)
Status RoHS Compliant Compliant
Design Tool Intel Quartus Prime —
Transceiver Data Rate Up to 17.4 Gbps (per family) —
Device Tier — 10AS032 (mid-density)
Configuration — SoC FPGA (HPS + FPGA fabric)
Processor Subsystem — Dual ARM Cortex-A9 MPCore with CoreSight
Maximum Operating Frequency — 1.5 GHz
Speed Grade — 2
Temperature Grade — E2 (commercial/extended)
On-chip Memory (M20K blocks) — Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet]
DSP Blocks — Variable-precision, IEEE 754 single-precision FP support
Transceivers — Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package]
Memory Controller Hard IP — DDR4, DDR3, QDRII+, RLDRAM3
Process Node — 20 nm
Form of Terminal — Ball (BGA)
Terminal Pitch — 1 mm

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