10AX090N2F45E2LG vs 10AX090N3F40E2LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX090N2F45E2LG disebabkan oleh Intel dan 10AX090N3F40E2LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX090N2F45E2LG | 10AX090N3F40E2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Embedded Memory (bits) | 59,234,304 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | [DATA_NEEDED: ALM count] |
| User I/O Pins | 768 | 600 |
| Core Voltage | 0.9 V | 0.9 V typical |
| Transceivers | [DATA_NEEDED: transceiver count and data rate] | Up to 24 full-duplex channels |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 1,518 |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Process Technology | 20 nm | TSMC 20nm |
| Kemasan | 1932-ball FCBGA (FBGA) | 1517-ball FCBGA, 40 mm |
| Package Type | Flip-Chip BGA, surface mount | — |
| Operating Temperature Grade | Enhanced (E2) | — |
| Lead-Free / RoHS | Yes (per part suffix LG) | — |
| Configuration Memory | SRAM-based, volatile (external flash required) | — |
| Jenis Pemasangan | Surface Mount | — |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Status Lingkungan Hidup | Active | — |
| Embedded Memory | — | 59,234,304 bits |
| Transceiver Data Rate | — | Up to 14.4 Gbps |
| Hard Memory Controllers | — | Yes (DDR4, DDR3, QDR IV, RLDRAM 3) |
| Maximum DDR4 Rate | — | 2666 Mbps |
| PCIe Hard IP | — | PCIe Gen3 x8 (root port or endpoint) |
| Suhu Operasi | — | -40C to +100C (extended industrial) |
| Configuration Encryption | — | AES-256 bitstream encryption |
| Partial Reconfiguration | — | Supported |
| Status RoHS | — | Compliant |