10AX090R2F40E2SG vs 10AX090R2F40I1SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX090R2F40E2SG disebabkan oleh Intel dan 10AX090R2F40I1SG disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX090R2F40E2SG | 10AX090R2F40I1SG |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900000 | 900,000 |
| LABs/CLBs | 339620 | — |
| Total RAM Bits | 59234304 | — |
| User I/O Count | 342 | — |
| Package Type | 1517-BBGA, FCBGA | — |
| Package Code | F40 (approx. 40mm FCBGA) | — |
| Speed Grade | 2 (R2 -2 transceiver rating) | 2 (mid-tier) |
| Temperature Grade | E2 (Extended: -40C to +100C junction) | Industrial (-40 °C to +100 °C) |
| Lead-Free / RoHS | Yes (SG suffix) | — |
| Transceivers | Up to 14.1 Gbps (Arria 10 GX feature) | [DATA_NEEDED: transceiver count and max data rate] |
| DSP Blocks | Variable-precision, hardened floating-point capable | [DATA_NEEDED: variable-precision DSP block count] |
| Process Node | TSMC 20nm | — |
| Jenis Pemasangan | Surface Mount (FCBGA ball grid) | Surface Mount (BGA, reflow) |
| Aras MSL | 3 (168 Hours) | MSL3 (JEDEC J-STD-020) |
| Packaging | Tray | — |
| Embedded Memory Bits | — | 59,234,304 |
| User I/Os | — | 342 |
| Process Technology | — | 20 nm TSMC |
| Kemasan | — | 1517-ball FCBGA (F40) |
| Package Size | — | 40 mm × 40 mm |
| Ball Pitch | — | 1.0 mm |
| Configuration | — | AES-256 / SHA-256 encrypted bitstream support |
| Memory Controller Hard IP | — | DDR4, DDR3, LPDDR3, QDR IV |
| PCIe Hard IP | — | PCI Express Gen3 x8 |
| Status RoHS | — | Compliant |