10AX090R2F40E2SG vs 10AX090R2F40I1SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX090R2F40E2SG sa pamamagitan ng Intel at 10AX090R2F40I1SG sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX090R2F40E2SG | 10AX090R2F40I1SG |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900000 | 900,000 |
| LABs/CLBs | 339620 | — |
| Total RAM Bits | 59234304 | — |
| User I/O Count | 342 | — |
| Package Type | 1517-BBGA, FCBGA | — |
| Package Code | F40 (approx. 40mm FCBGA) | — |
| Speed Grade | 2 (R2 -2 transceiver rating) | 2 (mid-tier) |
| Temperature Grade | E2 (Extended: -40C to +100C junction) | Industrial (-40 °C to +100 °C) |
| Lead-Free / RoHS | Yes (SG suffix) | — |
| Transceivers | Up to 14.1 Gbps (Arria 10 GX feature) | [DATA_NEEDED: transceiver count and max data rate] |
| DSP Blocks | Variable-precision, hardened floating-point capable | [DATA_NEEDED: variable-precision DSP block count] |
| Process Node | TSMC 20nm | — |
| Uri ng Pagpapasok | Surface Mount (FCBGA ball grid) | Surface Mount (BGA, reflow) |
| Level ng MSL | 3 (168 Hours) | MSL3 (JEDEC J-STD-020) |
| Packaging | Tray | — |
| Embedded Memory Bits | — | 59,234,304 |
| User I/Os | — | 342 |
| Process Technology | — | 20 nm TSMC |
| Packhaging | — | 1517-ball FCBGA (F40) |
| Package Size | — | 40 mm × 40 mm |
| Ball Pitch | — | 1.0 mm |
| Configuration | — | AES-256 / SHA-256 encrypted bitstream support |
| Memory Controller Hard IP | — | DDR4, DDR3, LPDDR3, QDR IV |
| PCIe Hard IP | — | PCI Express Gen3 x8 |
| Tindminan RoHS | — | Compliant |