10AX090S3F45E2LG vs 10AX090S3F45I2SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX090S3F45E2LG disebabkan oleh Intel dan 10AX090S3F45I2SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX090S3F45E2LG | 10AX090S3F45I2SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Adaptive Logic Modules (ALMs) | 339,620 | — |
| Embedded Memory (bits) | 59,234,304 | — |
| DSP Blocks | 1,518 | Variable-precision, up to ~1.5 TFLOPs FP32 |
| Transceivers | 624 (per package aggregate channels) | Up to 96 (12.5 Gbps chip-to-chip) |
| Maximum Transceiver Data Rate | 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT) | — |
| Kemasan | 1932-ball FCBGA (F45, 45mm flip-chip BGA) | 1932-ball FCBGA (F45) |
| Process Node | TSMC 20nm | — |
| Core Voltage (nominal) | 0.9 V | — |
| User I/O Banks | 12 | — |
| Maximum User I/O | 624 | — |
| Gambaran Suhu Operasi | 0C to 100C (E2 commercial) | — |
| Speed Grade | S3 (-2 speed grade equivalent) | I2 |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Memory Interfaces | DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3 | — |
| Embedded Memory Bits | — | 59,234,304 |
| User I/Os | — | 624 |
| Process Technology | — | 20 nm |
| Core Supply Voltage | — | 0.9 V |
| Temperature Grade | — | Industrial |
| Hard PCIe IP | — | PCIe Gen3 x8 (backwards compatible to Gen2/Gen1) |
| Hard Memory Controllers | — | 2 (DDR4, DDR3, QDRIV, RLDRAM3) |
| LVDS Channels | — | Up to 1.6 Gbps |