10AX090S3F45E2LG vs 10AX090S3F45I2SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX090S3F45E2LG sa pamamagitan ng Intel at 10AX090S3F45I2SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX090S3F45E2LG | 10AX090S3F45I2SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Adaptive Logic Modules (ALMs) | 339,620 | — |
| Embedded Memory (bits) | 59,234,304 | — |
| DSP Blocks | 1,518 | Variable-precision, up to ~1.5 TFLOPs FP32 |
| Transceivers | 624 (per package aggregate channels) | Up to 96 (12.5 Gbps chip-to-chip) |
| Maximum Transceiver Data Rate | 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT) | — |
| Packhaging | 1932-ball FCBGA (F45, 45mm flip-chip BGA) | 1932-ball FCBGA (F45) |
| Process Node | TSMC 20nm | — |
| Core Voltage (nominal) | 0.9 V | — |
| User I/O Banks | 12 | — |
| Maximum User I/O | 624 | — |
| Hanay ng Temperature na Operasyon | 0C to 100C (E2 commercial) | — |
| Speed Grade | S3 (-2 speed grade equivalent) | I2 |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Memory Interfaces | DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3 | — |
| Embedded Memory Bits | — | 59,234,304 |
| User I/Os | — | 624 |
| Process Technology | — | 20 nm |
| Core Supply Voltage | — | 0.9 V |
| Temperature Grade | — | Industrial |
| Hard PCIe IP | — | PCIe Gen3 x8 (backwards compatible to Gen2/Gen1) |
| Hard Memory Controllers | — | 2 (DDR4, DDR3, QDRIV, RLDRAM3) |
| LVDS Channels | — | Up to 1.6 Gbps |