10AX115H3F34I2LG vs 10AX115H2F34I2LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115H3F34I2LG disebabkan oleh Intel dan 10AX115H2F34I2LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115H3F34I2LG | 10AX115H2F34I2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LEs) | 1,150,000 | — |
| Embedded Memory | 68,857,856 bits | — |
| User I/O Count | 504 | — |
| Transceiver Count | 24 | — |
| Maximum Transceiver Data Rate | 17.4 Gbps | — |
| DSP Blocks | Variable-precision, floating-point capable | Hard floating-point DSP |
| DSP Performance | Up to 1.5 TFLOP/s (FP) | — |
| Hardened Memory Controllers | DDR4/DDR3/LPDDR3 | — |
| Hardened PCIe | PCIe Gen3 x8 | — |
| Hardened Ethernet MAC | 10G/40G/100G capable | — |
| Core Voltage | 0.9 V | 0.9 V (nominal) |
| Process Node | 20 nm | — |
| Kemasan | 1152-ball FCBGA | 1152-ball FCBGA (BBGA) |
| Speed Grade | H3 | -2 |
| Temperature Grade | Industrial (-40C to +100C junction) | Industrial (-40C to +100C) |
| Status RoHS | Compliant | Compliant (per distributor listing) |
| Logic Elements (LE) | — | 1,150,000 |
| Embedded Memory Bits | — | 68,857,560 |
| Maximum User I/O | — | 504 |
| Transceivers | — | 24 channels, up to 14.4 Gbps |
| Process Technology | — | 20 nm TSMC |
| Memory Controller | — | Hardened external memory interface (DDR4/QDR-IV) |
| PCIe Hard IP | — | PCI Express Gen3 x8 |
| Configuration | — | FPGA (SRAM-based, volatile) |
| Jenis Pemasangan | — | Surface Mount (BGA) |