10AX115H3F34I2LG vs 10AX115H2F34I2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115H3F34I2LG sa pamamagitan ng Intel at 10AX115H2F34I2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AX115H2F34I2LG - Arria 10 GX FPGA, 1.15M Logic Elements | Intel
10AX115H2F34I2LG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AX115H3F34I2LG | 10AX115H2F34I2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LEs) | 1,150,000 | — |
| Embedded Memory | 68,857,856 bits | — |
| User I/O Count | 504 | — |
| Transceiver Count | 24 | — |
| Maximum Transceiver Data Rate | 17.4 Gbps | — |
| DSP Blocks | Variable-precision, floating-point capable | Hard floating-point DSP |
| DSP Performance | Up to 1.5 TFLOP/s (FP) | — |
| Hardened Memory Controllers | DDR4/DDR3/LPDDR3 | — |
| Hardened PCIe | PCIe Gen3 x8 | — |
| Hardened Ethernet MAC | 10G/40G/100G capable | — |
| Core Voltage | 0.9 V | 0.9 V (nominal) |
| Process Node | 20 nm | — |
| Packhaging | 1152-ball FCBGA | 1152-ball FCBGA (BBGA) |
| Speed Grade | H3 | -2 |
| Temperature Grade | Industrial (-40C to +100C junction) | Industrial (-40C to +100C) |
| Tindminan RoHS | Compliant | Compliant (per distributor listing) |
| Logic Elements (LE) | — | 1,150,000 |
| Embedded Memory Bits | — | 68,857,560 |
| Maximum User I/O | — | 504 |
| Transceivers | — | 24 channels, up to 14.4 Gbps |
| Process Technology | — | 20 nm TSMC |
| Memory Controller | — | Hardened external memory interface (DDR4/QDR-IV) |
| PCIe Hard IP | — | PCI Express Gen3 x8 |
| Configuration | — | FPGA (SRAM-based, volatile) |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |