10AX115N2F40I2SG vs 10AX115N4F40I3SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115N2F40I2SG disebabkan oleh Intel dan 10AX115N4F40I3SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115N2F40I2SG | 10AX115N4F40I3SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | — |
| Embedded Memory Bits | 68,857,856 | 68,857,856 |
| Adaptive Logic Modules (ALMs) | 427,200 | — |
| Registers | 1,708,800 | — |
| User I/O | 600 | — |
| Transceiver Protocol | GX (up to 14.1 Gbps) | — |
| Transceiver Count | [DATA_NEEDED: transceiver count exact value] | [DATA_NEEDED: transceiver count] |
| DSP Blocks | Variable-precision, hard floating-point | [DATA_NEEDED: DSP block count] |
| Kemasan | 1517-ball FCBGA, 40 x 40 mm, 1.0 mm pitch | 1517-BBGA, FCBGA (F40), 40 x 40 mm, 1.00 mm pitch |
| Suhu Operasi | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | 2 | — |
| Process Technology | TSMC 20 nm | — |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Maximum User I/O | — | 600 |
| Maximum Transceiver Data Rate | — | 17.4 Gbps |
| Process Node | — | 20 nm |
| Supply Voltage (Core) | — | [DATA_NEEDED: VCC core voltage] |
| Configuration | — | Serial, Parallel, and Avalon-ST supported |
| Aras MSL | — | 3 (per JEDEC J-STD-020) |
| Hardened IP | — | PCIe Gen3, 100G Ethernet MAC (per Quartus IP library) |
| Device Family Position | — | Mid-range 20 nm transceiver FPGA |