10AX115R2F40E2SG vs 10AX115R3F40I2SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115R2F40E2SG disebabkan oleh Intel dan 10AX115R3F40I2SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115R2F40E2SG | 10AX115R3F40I2SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | 10AX115 |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory Bits | 68,857,856 | — |
| M20K Memory Blocks | 2,128 | — |
| MLAB Memory Bits | 8,812,800 | — |
| Variable-Precision DSP Blocks | 1,518 | — |
| 18 x 19 Multipliers | 3,036 | — |
| PLLs | 16 | — |
| User I/O Pins | 342 | — |
| Transceiver Count | 48 (max 96 for the family) | — |
| Transceiver Data Rate | up to 17.4 Gbps (chip-to-chip) | — |
| Hard Memory Controllers | Yes | Yes (DDR4/DDR3) |
| PCIe Hard IP | Gen3 x1/x2/x4/x8 | Gen3 |
| Process Technology | 20 nm TSMC | — |
| Speed Grade | -2 (E2, mid) | I2 |
| Suhu Operasi | 0C to +100C (commercial) | — |
| Kemasan | 1517-ball FCBGA, 40 x 40 mm | 1517-BBGA, FCBGA (F40) |
| Jenis Pemasangan | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| RoHS | Compliant | — |
| Series | — | Arria 10 GX |
| Logic Elements | — | 1,150,000 |
| Embedded Memory | — | 68,857,856 bits |
| User I/O Count | — | 342 |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Transceiver Channels | — | 24 (up to 17.4 Gbps) |
| DSP Blocks | — | Yes (variable-precision) |
| Process Node | — | 20 nm (TSMC) |
| Status RoHS | — | Compliant |
| Aras MSL | — | [DATA_NEEDED: MSL level] |