10AX115R3F40E2SG vs 10AX090R2F40E2SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115R3F40E2SG disebabkan oleh Intel dan 10AX090R2F40E2SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115R3F40E2SG | 10AX090R2F40E2SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory | 68,857,856 bits (8,557 Kbit) | — |
| M20K Memory Blocks | 2,738 | — |
| DSP Blocks | 1,518 (variable-precision, hard FP) | Variable-precision, hardened floating-point capable |
| Maximum User I/O | 342 | — |
| Transceiver Channels | 24 (up to 14.1 Gbps) | — |
| Hard Memory Controllers | DDR4/DDR3/QDR IV | — |
| Hard PCIe Gen3 IP Cores | 2 | — |
| Process Technology | TSMC 20 nm | — |
| Speed Grade | -2 | 2 (R2 -2 transceiver rating) |
| Temperature Grade | E2 (0C to +100C) | E2 (Extended: -40C to +100C junction) |
| Kemasan | 1517-ball FCBGA (F40), 1.0 mm pitch | — |
| Jenis Pemasangan | Surface Mount (Flip-Chip BGA) | Surface Mount (FCBGA ball grid) |
| Configuration Memory | Embedded (no external flash required for typical use) | — |
| Status RoHS | Compliant | — |
| Logic Elements | — | 900000 |
| LABs/CLBs | — | 339620 |
| Total RAM Bits | — | 59234304 |
| User I/O Count | — | 342 |
| Package Type | — | 1517-BBGA, FCBGA |
| Package Code | — | F40 (approx. 40mm FCBGA) |
| Lead-Free / RoHS | — | Yes (SG suffix) |
| Transceivers | — | Up to 14.1 Gbps (Arria 10 GX feature) |
| Process Node | — | TSMC 20nm |
| Aras MSL | — | 3 (168 Hours) |
| Packaging | — | Tray |