10AX115R3F40E2SG vs 10AX090R3F40E2LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115R3F40E2SG disebabkan oleh Intel dan 10AX090R3F40E2LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115R3F40E2SG | 10AX090R3F40E2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory | 68,857,856 bits (8,557 Kbit) | 59,234,304 bits |
| M20K Memory Blocks | 2,738 | — |
| DSP Blocks | 1,518 (variable-precision, hard FP) | Hardened fixed/floating-point DSP blocks (on-die) |
| Maximum User I/O | 342 | — |
| Transceiver Channels | 24 (up to 14.1 Gbps) | — |
| Hard Memory Controllers | DDR4/DDR3/QDR IV | — |
| Hard PCIe Gen3 IP Cores | 2 | — |
| Process Technology | TSMC 20 nm | 20 nm |
| Speed Grade | -2 | — |
| Temperature Grade | E2 (0C to +100C) | — |
| Kemasan | 1517-ball FCBGA (F40), 1.0 mm pitch | 1517-Ball FCBGA |
| Jenis Pemasangan | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Configuration Memory | Embedded (no external flash required for typical use) | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 900,000 |
| User I/O Count | — | 342 |
| Core Supply Voltage | — | 0.9 V |
| Package Type | — | Flip-Chip Ball Grid Array |
| Number of Terminals | — | 1517 |
| Transceivers | — | Multi-gigabit serial transceivers (on-die) |
| Memory Interfaces | — | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |