10AX115R3F40I2SG vs 10AX115R3F40E2SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115R3F40I2SG disebabkan oleh Intel dan 10AX115R3F40E2SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115R3F40I2SG | 10AX115R3F40E2SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria 10 GX | — |
| Family | 10AX115 | Arria 10 GX |
| Logic Elements | 1,150,000 | — |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits (8,557 Kbit) |
| User I/O Count | 342 | — |
| Kemasan | 1517-BBGA, FCBGA (F40) | 1517-ball FCBGA (F40), 1.0 mm pitch |
| Temperature Grade | Industrial (-40C to +100C) | E2 (0C to +100C) |
| Speed Grade | I2 | -2 |
| Transceiver Channels | 24 (up to 17.4 Gbps) | 24 (up to 14.1 Gbps) |
| Hard Memory Controllers | Yes (DDR4/DDR3) | DDR4/DDR3/QDR IV |
| PCIe Hard IP | Gen3 | — |
| DSP Blocks | Yes (variable-precision) | 1,518 (variable-precision, hard FP) |
| Process Node | 20 nm (TSMC) | — |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | 427,200 |
| M20K Memory Blocks | — | 2,738 |
| Maximum User I/O | — | 342 |
| Hard PCIe Gen3 IP Cores | — | 2 |
| Process Technology | — | TSMC 20 nm |
| Configuration Memory | — | Embedded (no external flash required for typical use) |