10AX115R3F40I2SG vs 10AX115R3F40E2SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115R3F40I2SG sa pamamagitan ng Intel at 10AX115R3F40E2SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX115R3F40I2SG | 10AX115R3F40E2SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Arria 10 GX | — |
| Family | 10AX115 | Arria 10 GX |
| Logic Elements | 1,150,000 | — |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits (8,557 Kbit) |
| User I/O Count | 342 | — |
| Packhaging | 1517-BBGA, FCBGA (F40) | 1517-ball FCBGA (F40), 1.0 mm pitch |
| Temperature Grade | Industrial (-40C to +100C) | E2 (0C to +100C) |
| Speed Grade | I2 | -2 |
| Transceiver Channels | 24 (up to 17.4 Gbps) | 24 (up to 14.1 Gbps) |
| Hard Memory Controllers | Yes (DDR4/DDR3) | DDR4/DDR3/QDR IV |
| PCIe Hard IP | Gen3 | — |
| DSP Blocks | Yes (variable-precision) | 1,518 (variable-precision, hard FP) |
| Process Node | 20 nm (TSMC) | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | 427,200 |
| M20K Memory Blocks | — | 2,738 |
| Maximum User I/O | — | 342 |
| Hard PCIe Gen3 IP Cores | — | 2 |
| Process Technology | — | TSMC 20 nm |
| Configuration Memory | — | Embedded (no external flash required for typical use) |