10M02DCU324A7G vs 10M04DCF256A7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M02DCU324A7G disebabkan oleh Intel dan 10M04DCF256A7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M02DCU324A7G | 10M04DCF256A7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | — |
| Logic Elements (LE) | 2,000 | 4,000 |
| Embedded Memory | 110,592 bits | — |
| User I/O Count | 160 | — |
| Embedded 18x18 Multipliers | 16 | — |
| PLLs | [DATA_NEEDED: PLL count] | [DATA_NEEDED: PLL count] |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| User Flash Memory | Integrated (on-chip flash configuration) | — |
| Integrated ADC | 12-bit, 1 Msps+, successive approximation | 12-bit, 1 MSPS |
| Core Voltage | 1.15 V to 1.25 V | 1.2 V |
| Supply Voltage (VCCIO) | [DATA_NEEDED: VCCIO range] | — |
| Suhu Hubungan Operasi | -40 C to +125 C (TJ) | — |
| Package Type | 324-UBGA (Ultra FineLine BGA) | — |
| Package Dimensions | 15 x 15 mm | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Process Technology | 55 nm embedded flash (TSMC) | 55 nm |
| Status RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free status] | — |
| Series | — | MAX 10 |
| Maximum User I/O | — | 178 |
| Embedded Memory (M9K) | — | 193,536 bits |
| Total RAM | — | 1.5 Mbit |
| User Flash Memory (UFM) | — | 16 Kbit |
| Kemasan | — | 256-LBGA (FBGA) |
| Suhu Operasi | — | -40C to +125C (Industrial) |
| Configuration Memory | — | Internal dual-configuration flash (instant-on) |