10M02DCU324A7G vs 10M04DCF256A7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M02DCU324A7G sa pamamagitan ng Intel at 10M04DCF256A7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M02DCU324A7G | 10M04DCF256A7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | — |
| Logic Elements (LE) | 2,000 | 4,000 |
| Embedded Memory | 110,592 bits | — |
| User I/O Count | 160 | — |
| Embedded 18x18 Multipliers | 16 | — |
| PLLs | [DATA_NEEDED: PLL count] | [DATA_NEEDED: PLL count] |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| User Flash Memory | Integrated (on-chip flash configuration) | — |
| Integrated ADC | 12-bit, 1 Msps+, successive approximation | 12-bit, 1 MSPS |
| Core Voltage | 1.15 V to 1.25 V | 1.2 V |
| Supply Voltage (VCCIO) | [DATA_NEEDED: VCCIO range] | — |
| Temperature ng Junction na Operasyon | -40 C to +125 C (TJ) | — |
| Package Type | 324-UBGA (Ultra FineLine BGA) | — |
| Package Dimensions | 15 x 15 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Process Technology | 55 nm embedded flash (TSMC) | 55 nm |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free status] | — |
| Series | — | MAX 10 |
| Maximum User I/O | — | 178 |
| Embedded Memory (M9K) | — | 193,536 bits |
| Total RAM | — | 1.5 Mbit |
| User Flash Memory (UFM) | — | 16 Kbit |
| Packhaging | — | 256-LBGA (FBGA) |
| Temperature na Operasyon | — | -40C to +125C (Industrial) |
| Configuration Memory | — | Internal dual-configuration flash (instant-on) |