10M08DAF484C8G vs 10M08DAF484I7P Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M08DAF484C8G disebabkan oleh Intel dan 10M08DAF484I7P disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M08DAF484C8G | 10M08DAF484I7P |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 8000 | 8,000 |
| Embedded Memory | 387,072 bits (378 Kbits) | 378 Kbits (46,080 M9K bits) |
| User Flash | 1,540 Kbits | 8 Kbits (non-volatile) |
| Maximum User I/O | 250 | — |
| ADC | 8-channel, 12-bit | — |
| PLLs | 2 | 4 |
| Process Technology | 55 nm | — |
| Core Voltage | 1.2 V | 1.0 V |
| I/O Bank Voltage | 1.2 V to 3.3 V | — |
| Kemasan | 484-ball FBGA (FineLine BGA) | 484-ball FBGA (F484) |
| Speed Grade | -C8 | -7 |
| Suhu Hubungan Operasi | -40 C to +100 C (industrial) | — |
| Configuration | Internal flash, dual-configuration, RSU support | — |
| DSP Blocks | Yes | Yes (24 x 18-bit multipliers) |
| Status RoHS | Compliant | Compliant |
| User I/O Count | — | 250 |
| Pitch | — | 1.0 mm |
| Suhu Operasi | — | -40 C to +100 C (Industrial) |
| On-chip Configuration Flash | — | Yes, dual-boot |
| Embedded ADC | — | 12-bit, 1 Msps, 16 channels |
| Maximum LVDS Channels | — | [DATA_NEEDED: per-bank LVDS channel count] |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Aras MSL | — | [DATA_NEEDED: moisture sensitivity level] |