10M08DAF484C8G vs 10M08DAF484I7P Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M08DAF484C8G sa pamamagitan ng Intel at 10M08DAF484I7P sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M08DAF484C8G | 10M08DAF484I7P |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 8000 | 8,000 |
| Embedded Memory | 387,072 bits (378 Kbits) | 378 Kbits (46,080 M9K bits) |
| User Flash | 1,540 Kbits | 8 Kbits (non-volatile) |
| Maximum User I/O | 250 | — |
| ADC | 8-channel, 12-bit | — |
| PLLs | 2 | 4 |
| Process Technology | 55 nm | — |
| Core Voltage | 1.2 V | 1.0 V |
| I/O Bank Voltage | 1.2 V to 3.3 V | — |
| Packhaging | 484-ball FBGA (FineLine BGA) | 484-ball FBGA (F484) |
| Speed Grade | -C8 | -7 |
| Temperature ng Junction na Operasyon | -40 C to +100 C (industrial) | — |
| Configuration | Internal flash, dual-configuration, RSU support | — |
| DSP Blocks | Yes | Yes (24 x 18-bit multipliers) |
| Tindminan RoHS | Compliant | Compliant |
| User I/O Count | — | 250 |
| Pitch | — | 1.0 mm |
| Temperature na Operasyon | — | -40 C to +100 C (Industrial) |
| On-chip Configuration Flash | — | Yes, dual-boot |
| Embedded ADC | — | 12-bit, 1 Msps, 16 channels |
| Maximum LVDS Channels | — | [DATA_NEEDED: per-bank LVDS channel count] |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Level ng MSL | — | [DATA_NEEDED: moisture sensitivity level] |