10M08DAU324I7G vs 10M08DCU324I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M08DAU324I7G disebabkan oleh Intel dan 10M08DCU324I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M08DAU324I7G | 10M08DCU324I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | — |
| Logic Elements (LE) | 8,000 | 8,000 |
| Embedded Memory (M9K blocks) | 378 Kbits | — |
| User Flash Memory | 387,072 bits | 387,072 bits |
| Maximum User I/O | 246 | — |
| Kemasan | 324-LFBGA (UBGA), 1.0 mm pitch | 324-pin UFBGA (U324) |
| Suhu Operasi | -40C to +100C (Industrial) | -40C to +100C (industrial, I7) |
| Supply Voltage (Core) | 1.2 V typical | — |
| Supply Voltage (I/O Banks) | 1.2 V to 3.3 V | — |
| Process Technology | TSMC 55 nm embedded flash | 55 nm NOR flash CMOS |
| DSP Blocks (18x18 Multipliers) | 24 | — |
| PLLs | 4 | [DATA_NEEDED: PLL count] |
| On-chip ADC | Dual 12-bit, 1 MSPS | — |
| Configuration | Internal flash, JTAG, Passive Serial | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Aras MSL | 3 | — |
| Product Family | — | MAX 10 |
| Embedded Memory (M9K blocks / bits) | — | 246 Kbits |
| Maximum User I/O Pins | — | 246 |
| Ball Pitch | — | 0.8 mm |
| Integrated ADC | — | 12-bit SAR, up to 18 channels |
| ADC Sampling Rate | — | 1 MSa/s (single-ended) |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Configuration Modes | — | JTAG, internal flash, external host |
| Core Voltage | — | 3.3 V |
| Lead-Free | — | Yes |