10M08DAU324I7G vs 10M08DCU324I7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M08DAU324I7G sa pamamagitan ng Intel at 10M08DCU324I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M08DAU324I7G | 10M08DCU324I7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | MAX 10 | — |
| Logic Elements (LE) | 8,000 | 8,000 |
| Embedded Memory (M9K blocks) | 378 Kbits | — |
| User Flash Memory | 387,072 bits | 387,072 bits |
| Maximum User I/O | 246 | — |
| Packhaging | 324-LFBGA (UBGA), 1.0 mm pitch | 324-pin UFBGA (U324) |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40C to +100C (industrial, I7) |
| Supply Voltage (Core) | 1.2 V typical | — |
| Supply Voltage (I/O Banks) | 1.2 V to 3.3 V | — |
| Process Technology | TSMC 55 nm embedded flash | 55 nm NOR flash CMOS |
| DSP Blocks (18x18 Multipliers) | 24 | — |
| PLLs | 4 | [DATA_NEEDED: PLL count] |
| On-chip ADC | Dual 12-bit, 1 MSPS | — |
| Configuration | Internal flash, JTAG, Passive Serial | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | 3 | — |
| Product Family | — | MAX 10 |
| Embedded Memory (M9K blocks / bits) | — | 246 Kbits |
| Maximum User I/O Pins | — | 246 |
| Ball Pitch | — | 0.8 mm |
| Integrated ADC | — | 12-bit SAR, up to 18 channels |
| ADC Sampling Rate | — | 1 MSa/s (single-ended) |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Configuration Modes | — | JTAG, internal flash, external host |
| Core Voltage | — | 3.3 V |
| Lead-Free | — | Yes |