10M08DCF256C8G vs 10M16DCF256C8G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M08DCF256C8G disebabkan oleh Intel dan 10M16DCF256C8G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M08DCF256C8G | 10M16DCF256C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | — |
| Logic Elements | 8,000 | — |
| Embedded Memory (bits) | 387,072 (378 Kbits user flash + block SRAM) | — |
| User I/O Count | 178 | — |
| Kemasan | 256-LBGA (F256, FineLine BGA) | 256-ball FineLine BGA (FBGA), 17 x 17 mm |
| Pitch | 1.0 mm | — |
| Speed Grade | C8 (commercial, slowest speed bin) | C8 |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| Configuration | Internal flash (instant-on, non-volatile) | — |
| ADC | Dual 12-bit SAR, up to 17 analog inputs | — |
| 18x18 Multipliers | 8 | — |
| PLLs | 2 | — |
| Global Clock Networks | 4 | — |
| Process Technology | TSMC 55 nm embedded flash CMOS | 55 nm |
| Suhu Operasi | 0C to +85C (commercial) | 0 °C to +85 °C (commercial) |
| Design Software | Intel Quartus Prime (Lite / Standard / Pro) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Aras MSL | 3 (168 hours) | — |
| Family | — | MAX 10 |
| Logic Elements (LE) | — | 16000 |
| Maximum User I/O | — | 178 |
| Embedded SRAM | — | 562176 bits (562 Kbit) |
| User Flash | — | 5140 Kbit (5.14 Mbit) |
| Core Voltage | — | 1.2 V |
| Configuration Type | — | Dual-configuration flash (DC) |
| Maximum Operating Frequency | — | 472.5 MHz |
| Non-volatile Configuration | — | Yes (on-chip flash) |