10M08DCF484C8G vs 10M08DAF484I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M08DCF484C8G disebabkan oleh Intel dan 10M08DAF484I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M08DCF484C8G | 10M08DAF484I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 FPGA |
| Logic Elements | 8,000 | — |
| Embedded Memory (M9K) | 378 Kbits (49 M9K blocks) | — |
| Embedded Multiplier Blocks (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| User I/O Count | 250 | — |
| Kemasan | 484-ball FBGA (FineLine BGA) | — |
| Speed Grade | C8 (commercial, standard speed) | — |
| Process Technology | 55 nm TSMC embedded NOR flash | 55 nm |
| Core Voltage | 1.2 V (on-chip regulator) | — |
| Configuration Memory | Dual on-chip flash (instant-on, dual-boot) | Internal flash (non-volatile) |
| PLLs | 2 | — |
| Global Clock Networks | Up to 16 | — |
| Integrated ADC | 12-bit SAR, up to 1 Msps | — |
| LVDS Support | True LVDS up to 1.4 Gbps (input), emulated LVDS (output) | — |
| Suhu Operasi | Commercial (0C to +85C junction, per speed grade) | -40 °C to +100 °C (Industrial) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | 3 (per JEDEC J-STD-020) | — |
| Status RoHS | Compliant | Compliant |
| Series | — | MAX 10 |
| Logic Elements (LE) | — | 8000 |
| Embedded Memory (bits) | — | 387072 |
| Embedded Memory (Kb) | — | 378 |
| Number of I/Os | — | 250 |
| Number of LABs/CLBs | — | [DATA_NEEDED: number of LABs] |
| Number of Logic Array Blocks | — | [DATA_NEEDED: LAB count] |
| Supply Voltage - Core | — | 1.2 V |
| Kemasan / Case | — | 484-BGA |
| Supplier Device Package | — | 484-FBGA (23x23 mm) |
| Lead Free | — | Yes |