10M08DCU324A7G vs 10M04DCU324A7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M08DCU324A7G disebabkan oleh Intel dan 10M04DCU324A7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M08DCU324A7G | 10M04DCU324A7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 8,000 | 4,000 |
| Embedded Memory (Kbits) | 246 | — |
| User Flash Memory (bits) | 387,072 | — |
| Total User I/O | 246 | — |
| Kemasan | 324-LFBGA (U324) | 324-pin UFBGA (U324) |
| Process Technology | 55 nm | — |
| Core Supply Voltage | 1.15 V to 1.25 V | — |
| Maximum Internal Clock Frequency | 382 MHz | — |
| Suhu Operasi | -40 C to +125 C | [DATA_NEEDED: temperature grade -40C to +100C vs -40C to +125C] |
| AEC-Q100 Grade | Automotive qualified | — |
| Configuration Memory | On-chip flash (non-volatile) | On-chip flash (instant-on, no external PROM) |
| JEDEC Package Code | S-PBGA-B324 | — |
| Terminal Position | Bottom | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant | — |
| Process Node | — | 55 nm |
| Core Voltage | — | 1.2 V |
| Embedded Memory (bits) | — | 193,536 |
| User Flash Memory | — | Integrated (non-volatile configuration) |
| Maximum User I/O | — | 246 |
| Ball Pitch | — | 0.8 mm |
| Speed Grade | — | 7 |
| AEC-Q100 Qualification | — | Yes (A-grade suffix) |
| Lead-Free / RoHS | — | Yes (G suffix) |
| Integrated ADC | — | Yes (12-bit SAR, multiple channels) |
| PLL Count | — | [DATA_NEEDED: PLL count for 10M04] |
| Multipliers (18x18) | — | [DATA_NEEDED: multiplier count for 10M04] |