10M08SAU169C8G vs 10M08SCU169I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M08SAU169C8G disebabkan oleh Intel dan 10M08SCU169I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M08SAU169C8G | 10M08SCU169I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LEs) | 8,000 | — |
| Embedded Memory (bits) | 387,072 (≈378 Kbits user flash + M9K block RAM) | — |
| User I/Os | 130 | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| M9K Block RAM (Kbits) | 173 (≈378 Kbits total embedded memory including user flash) | — |
| DSP Blocks | Yes (18x18 multiplier blocks) | — |
| PLLs | 4 analog PLLs + 2 fractional PLLs | — |
| On-chip ADC | Yes (single, 12-bit, 1 MSps equivalent — device dependent) | — |
| Configuration Memory | Dual-configuration on-chip flash (non-volatile, instant-on) | Internal flash (non-volatile, dual-boot) |
| Core Voltage | 1.2 V | — |
| I/O Voltage Standards | LVCMOS/LVTTL up to 3.3 V | — |
| Speed Grade | C8 (-8) | — |
| Kemasan | 169-LFBGA (UBGA, 11x11 mm, 0.8 mm pitch) | 169-ball UFBGA / UBGA (U169), 11 mm x 11 mm, 0.65 mm pitch |
| Suhu Operasi | Commercial / Industrial (per device suffix) | -40 C to +100 C (industrial, suffix I7G) |
| Process Node | 55 nm embedded flash | — |
| External Memory Interface | DDR3, LPDDR2, SRAM (hard IP) | — |
| PCIe Hard IP | Yes (PCIe Gen2 x1 hard IP block) | — |
| Status RoHS | Compliant | — |
| Configuration Mode | JTAG (1149.1) + Active Serial (AS) | — |
| Development Toolchain | Intel Quartus Prime | — |
| Logic Elements (LE) | — | 8,000 |
| Embedded Memory (M9K blocks) | — | [DATA_NEEDED: M9K count and total bits] |
| Embedded User Flash | — | 387,072 bits (48 KB) |
| User I/O Count | — | 130 |
| Maximum User I/O (package) | — | 130 (U169) |
| Core Voltage (VCCINT) | — | 1.2 V |
| Process Technology | — | TSMC 55 nm embedded flash |
| PLL Count | — | [DATA_NEEDED: number of PLLs] |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: multiplier count] |
| ADC | — | 12-bit, 1 MSPS, 4 channels (single supply variant) |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Lead-Free / RoHS | — | Yes / Compliant |
| Aras MSL | — | 3 (per JEDEC J-STD-020) |
| Configuration Method | — | JTAG, internal flash, dual-boot |
| Supported I/O Standards | — | LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI |