10M08SAU169C8G vs 10M08SCU169I7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M08SAU169C8G sa pamamagitan ng Intel at 10M08SCU169I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M08SAU169C8G | 10M08SCU169I7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LEs) | 8,000 | — |
| Embedded Memory (bits) | 387,072 (≈378 Kbits user flash + M9K block RAM) | — |
| User I/Os | 130 | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| M9K Block RAM (Kbits) | 173 (≈378 Kbits total embedded memory including user flash) | — |
| DSP Blocks | Yes (18x18 multiplier blocks) | — |
| PLLs | 4 analog PLLs + 2 fractional PLLs | — |
| On-chip ADC | Yes (single, 12-bit, 1 MSps equivalent — device dependent) | — |
| Configuration Memory | Dual-configuration on-chip flash (non-volatile, instant-on) | Internal flash (non-volatile, dual-boot) |
| Core Voltage | 1.2 V | — |
| I/O Voltage Standards | LVCMOS/LVTTL up to 3.3 V | — |
| Speed Grade | C8 (-8) | — |
| Packhaging | 169-LFBGA (UBGA, 11x11 mm, 0.8 mm pitch) | 169-ball UFBGA / UBGA (U169), 11 mm x 11 mm, 0.65 mm pitch |
| Temperature na Operasyon | Commercial / Industrial (per device suffix) | -40 C to +100 C (industrial, suffix I7G) |
| Process Node | 55 nm embedded flash | — |
| External Memory Interface | DDR3, LPDDR2, SRAM (hard IP) | — |
| PCIe Hard IP | Yes (PCIe Gen2 x1 hard IP block) | — |
| Tindminan RoHS | Compliant | — |
| Configuration Mode | JTAG (1149.1) + Active Serial (AS) | — |
| Development Toolchain | Intel Quartus Prime | — |
| Logic Elements (LE) | — | 8,000 |
| Embedded Memory (M9K blocks) | — | [DATA_NEEDED: M9K count and total bits] |
| Embedded User Flash | — | 387,072 bits (48 KB) |
| User I/O Count | — | 130 |
| Maximum User I/O (package) | — | 130 (U169) |
| Core Voltage (VCCINT) | — | 1.2 V |
| Process Technology | — | TSMC 55 nm embedded flash |
| PLL Count | — | [DATA_NEEDED: number of PLLs] |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: multiplier count] |
| ADC | — | 12-bit, 1 MSPS, 4 channels (single supply variant) |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Lead-Free / RoHS | — | Yes / Compliant |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |
| Configuration Method | — | JTAG, internal flash, dual-boot |
| Supported I/O Standards | — | LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI |