10M16DAF256I7G vs 10M40DAF256I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M16DAF256I7G disebabkan oleh Intel dan 10M40DAF256I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M16DAF256I7G | 10M40DAF256I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | MAX 10 |
| Logic Elements (LE) | 16000 | 40,000 |
| Embedded Memory Bits | 562176 | — |
| Embedded RAM (M9K) | 45 Kbits (45 x 9 Kbit blocks) | — |
| Maximum User I/O | 178 | — |
| I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Suhu Operasi | -40C to +100C (industrial) | -40C to +100C (Industrial, I7) |
| Speed Grade | 7 (fastest) | — |
| Kemasan | 256-FBGA (17 x 17 mm, 1.0 mm pitch) | 256-FBGA (FineLine BGA), 17x17 mm |
| Configuration Memory | On-die flash (non-volatile, instant-on) | On-chip dual-configuration flash |
| On-die ADC | 12-bit, 1 MSPS, up to 16 channels | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Process Technology | 55 nm CMOS with embedded flash | 55 nm TSMC |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Aras MSL | [DATA_NEEDED: MSL rating] | 3 (168 hours) |
| Embedded Memory (bits) | — | 1,290,240 (M9K + M144K blocks) |
| User I/O Count | — | 178 |
| Core Voltage | — | 1.2 V |
| Maximum Internal Frequency | — | 472.5 MHz |
| Number of PLLs | — | 4 |
| Embedded Multipliers (18x18) | — | 56 |
| ADC | — | 12-bit SAR, up to 16 channels, 1 MSPS |
| PCIe Hard IP | — | PCIe Gen2 x1/x2 (soft IP in 256-FBGA variant) |
| Gaya Pemasangan | — | SMD/SMT |
| Lead-Free / Halogen-Free | — | Yes / Yes |