10M16DAF256I7G vs 10M40DAF256I7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M16DAF256I7G sa pamamagitan ng Intel at 10M40DAF256I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M16DAF256I7G | 10M40DAF256I7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | MAX 10 | MAX 10 |
| Logic Elements (LE) | 16000 | 40,000 |
| Embedded Memory Bits | 562176 | — |
| Embedded RAM (M9K) | 45 Kbits (45 x 9 Kbit blocks) | — |
| Maximum User I/O | 178 | — |
| I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Temperature na Operasyon | -40C to +100C (industrial) | -40C to +100C (Industrial, I7) |
| Speed Grade | 7 (fastest) | — |
| Packhaging | 256-FBGA (17 x 17 mm, 1.0 mm pitch) | 256-FBGA (FineLine BGA), 17x17 mm |
| Configuration Memory | On-die flash (non-volatile, instant-on) | On-chip dual-configuration flash |
| On-die ADC | 12-bit, 1 MSPS, up to 16 channels | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Process Technology | 55 nm CMOS with embedded flash | 55 nm TSMC |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Level ng MSL | [DATA_NEEDED: MSL rating] | 3 (168 hours) |
| Embedded Memory (bits) | — | 1,290,240 (M9K + M144K blocks) |
| User I/O Count | — | 178 |
| Core Voltage | — | 1.2 V |
| Maximum Internal Frequency | — | 472.5 MHz |
| Number of PLLs | — | 4 |
| Embedded Multipliers (18x18) | — | 56 |
| ADC | — | 12-bit SAR, up to 16 channels, 1 MSPS |
| PCIe Hard IP | — | PCIe Gen2 x1/x2 (soft IP in 256-FBGA variant) |
| Style ng Pagpapasok | — | SMD/SMT |
| Lead-Free / Halogen-Free | — | Yes / Yes |