10M16DCF256C7G vs 10M08DAF256C7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M16DCF256C7G disebabkan oleh Intel dan 10M08DAF256C7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M16DCF256C7G | 10M08DAF256C7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 16,000 | — |
| Adaptive Logic Modules (ALMs) | 10,000 | — |
| Embedded Memory (M9K blocks) | 378 Kbits / 42 blocks | 46 (378 Kbits) |
| Total Embedded Memory Bits | 562,176 bits | — |
| Embedded 18x18 Multipliers | 45 | — |
| Maximum User I/Os | 178 | — |
| General-Purpose PLLs | 4 | — |
| Analog Front-End Blocks (ADC) | 2 (12-bit, 1 MSPS) | — |
| Configuration Flash | Dual-configuration, internal | — |
| Kemasan | 256-FBGA (F256), 17 x 17 mm, 1.0 mm pitch | 256-pin LBGA (F256) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Core Voltage | 1.2 V | 1.2 V |
| Auxiliary / I/O Voltages | 1.2 V to 3.3 V | — |
| Operating Temperature (Commercial) | 0C to +85C (C7G suffix) | — |
| Process Technology | TSMC 55 nm embedded flash | [DATA_NEEDED: process node, typically 55 nm embedded flash] |
| Status RoHS | Compliant | Compliant (Pb-free "G" suffix) |
| Logic Elements (LE) | — | 8,000 |
| User Flash Memory | — | 387,072 bits (approx. 48 KB) |
| Maximum User I/O | — | 178 |
| Suhu Operasi | — | 0 °C to +85 °C (Commercial, "C" grade) |
| Package Dimensions | — | 17 mm × 17 mm, 1.0 mm ball pitch |
| On-chip ADC | — | 12-bit, 1 MSPS, 1 channel |
| PLLs | — | 2 |
| 18 × 18 Multipliers | — | 24 |
| Configuration | — | Dual-configuration internal flash (D-series) |
| Internal Oscillator | — | Yes (on-chip) |