10M50DAF256C8G vs 10M25DAF256C8G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DAF256C8G disebabkan oleh Intel dan 10M25DAF256C8G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M50DAF256C8G | 10M25DAF256C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 49,760 (50K) | — |
| Embedded Memory (bits) | 1,677,312 | — |
| User Flash (bits) | 1,677,312 | — |
| Maximum User I/Os | 178 | — |
| Multipliers (18x18) | 312 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| On-chip ADC | 12-bit, 1 MSPS, single or dual supply | — |
| Process Technology | 55 nm | — |
| Core Voltage | 1.2 V | [DATA_NEEDED: core voltage] |
| Configuration | Internal flash (non-volatile, instant-on) | — |
| Speed Grade | C8 (8 ns) | C8 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0 °C to 85 °C) |
| Kemasan | 256-ball FBGA (F256) | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Aras MSL | 3 (per JEDEC J-STD-20) | [DATA_NEEDED: MSL level] |
| Logic Elements (LE) | — | 25,000 |
| Embedded Memory | — | 1,728 Kbits |
| Embedded 18x18 Multipliers | — | 55 |
| User I/O Count | — | 178 |
| Hard ADC Blocks | — | 2 (12-bit) |
| Configuration Flash | — | Internal, non-volatile |
| Process Node | — | 55 nm TSMC |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL |
| Lead-Free / Halogen-Free | — | Yes / Yes |