10M50DAF484I7G vs 10M50DCF484I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DAF484I7G disebabkan oleh Intel dan 10M50DCF484I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M50DAF484I7G | 10M50DCF484I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | — |
| Embedded Memory (bits) | 1,677,312 | — |
| Embedded User Flash (bits) | 1,677,312 (dual configuration) | — |
| User I/O Count | 360 | — |
| Kemasan | 484-ball FBGA (F484) | 484-ball FBGA (F484), 23x23 mm, 1.0 mm pitch |
| Package Pitch | 1.0 mm | — |
| Package Body Size | 23 x 23 mm | — |
| Process Technology | TSMC 55 nm | TSMC 55 nm embedded flash |
| Supply Voltage - Core | 1.2 V | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| On-die Configuration Flash | Yes (dual-boot) | — |
| Integrated ADC | 12-bit, 1 MSPS, up to 18 channels | 12-bit, up to 17 channels, 1 MSPS |
| DSP Blocks | 144 (18x18 multipliers) | — |
| PLLs | 4 | 4 |
| Configuration Mode | Single-chip (no external boot device required) | On-chip flash + JTAG |
| Jenis Pemasangan | Surface Mount (FBGA) | Surface Mount (BGA) |
| Aras MSL | 3 (per JEDEC J-STD-020) | — |
| Status RoHS | Compliant | Compliant |
| Lead-free / Halogen-free | Yes / Yes | — |
| Logic Elements | — | 50,000 |
| Embedded SRAM | — | 1,677,312 bits (1.6 Mb) |
| User Flash Memory | — | Up to 5,888 Kb (on-chip dual configuration) |
| Maximum User I/O Pins | — | 360 |
| LVDS Channels (dedicated) | — | 160 (rx + tx) |
| 18x18 Hardware Multipliers | — | 144 |
| Core Voltage | — | 1.2 V (internal) |
| Suhu Hubungan Operasi | — | -40C to +100C (industrial, 'I' suffix) |
| Speed Grade | — | 7 (fastest commercial/industrial) |